Photonic devices and methods of manufacture are provided. In embodiments a fill material and/or a secondary waveguide are utilized in order to protect other internal structures such as grating couplers from the rigors of subsequent processing steps. Through the use of these structures at the appropriate times during the manufacturing process, damage and debris that would otherwise interfere with the manufacturing process of the device or operation of the device can be avoided.

An optical emitter-receiver module includes a light source, a photodetector and a fiber. The light source emits an emitted beam. The fiber includes a core and an optical axis. The fiber has an outer surface, inclined at an angle of 45° with respect to the optical axis, having a mirror. The fiber has a notch, extending to the core of the fiber and having a face having a dichroic filter for reflecting a received beam. The light source is arranged relative to the mirror so that the emitted beam is reflected by the mirror and transmitted in the fiber. The photodetector and the face of the notch are positioned so that the received beam reflected by the dichroic filter is directed towards the photodetector.

A vacuum fluctuation quantum random number generator chip includes a heat sink substrate, a laser fixed to a first end of the heat sink substrate, at least two photoelectric detectors fixed to a second end of the heat sink substrate, and a beam splitter fixed to the heat sink substrate and located between the laser and the at least two photoelectric detectors. Light of the laser propagates through the beam splitter. The at least two photoelectric detectors are respectively positioned at optical path outlets of the beam splitter.

An optical connector assembly includes first and second optical ferrules. Each of the first and second optical ferrules includes a front portion extending forwardly from a rear portion. The rear portion includes a top side and a bottom side. The bottom side of the rear portion defines a recessed portion. The first and second optical ferrules mate with each other such that the front portion of each of the first and second ferrules is disposed in the recessed portion of the other one of the first and second ferrules. Discrete retainers are assembled to opposite ends of the mated first and second ferrules. Each of the retainers defines a resilient portion resiliently forcing the front portion of one of the first and second mated ferrules against the other one of the first and second optical ferrules.

In various embodiments, the beam parameter product and/or numerical aperture of a laser beam is adjusted utilizing a step-clad optical fiber having a central core, a first cladding, an annular core, and a second cladding.

An optical module package using a bidirectional polished silica optical waveguide is disclosed. An optical module package may include a planar optical waveguide that connects at least one aperture of each of the optical components and including inclined surfaces at both ends thereof to allow light, which exits from at least one aperture of any one optical component of the optical components to be subjected to optical coupling in a vertical direction through total reflection on an inclined surface corresponding to the at least one aperture of the any one optical component to cause the light to travel in a horizontal direction, and allows the light to be subjected to optical coupling to at least one aperture of a remaining optical component in the vertical direction through total reflection on the inclined surface corresponding to the at least one aperture of the remaining optical component.

According to the present disclosure, techniques related to manufacturing and applications of power photodiode structures and devices based on group-III metal nitride and gallium-based substrates are provided. More specifically, embodiments of the disclosure include techniques for fabricating photodiode devices comprising one or more of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, structures and devices. Such structures or devices can be used for a variety of applications including optoelectronic devices, photodiodes, power-over-fiber receivers, and others.

A casing for housing a fiber optic transceiver for use in a fiber optic connector can include a top surface, a bottom surface and one or more lateral surfaces, wherein the top surface and at least one or more lateral surfaces are at least in parts electrically conductive, and wherein the bottom surface of the casing comprises one or more solder pads.

A dynamic light source for a display is disclosed. The dynamic light source comprises a first light source located inside a first device; and a second light source. The first device is configured to allow light from the first light source to exit the first device in a first cone of angles and to reflect light incident outside the cone of angles back towards the first light source. The first device is configured such that injected light from the second light source is reflected by the first light source in a second cone of angles substantially coincident with the first cone of angles and that light output by the first device from the second light source is attenuated more than light output by the first light source, and an amount of attenuation is based on an intended dynamic power range of the dynamic light source.

An optical circuit board of the present disclosure includes a wiring board and an optical waveguide located on the wiring board. The optical waveguide includes a lower cladding layer, a core located on the lower cladding layer, an upper cladding layer located on the lower cladding layer and covering the core, a first cavity extending from the upper cladding layer to the lower cladding layer and dividing the core, and at least two second cavities extending from the upper cladding layer to the lower cladding layer and located with the core therebetween in plan view. The first cavity has a first opening portion located on the upper cladding layer side and a first bottom portion located on the lower cladding layer side. The second cavities each include a second opening portion located on the upper cladding layer side and a second bottom portion located on the lower cladding layer side.