Various embodiments relate to an optical detection element and GOI (Ge-on-insulator) device for ultra-small on-chip optical sensing, and a manufacturing method of the same. According to various embodiments, the optical detection element and the GOI device may be implemented on a GOI structure comprising a germanium (Ge) layer, and the GOI device may be implemented to have an optical detection element. Specifically, the GOI device may include a GOI structure with a waveguide region comprising a germanium layer, a light source element configured to generate light for the waveguide region, and at least one optical detection element configured to detect light coming from the waveguide region. At least one slot configured to collect light from the light source element may be formed in the germanium layer in the waveguide region. The light source element may generate light so as to be coupled to the germanium layer in the waveguide region. The optical detection element may detect heat generated as light is propagated from the germanium layer.

An optical module as disclosed includes an aligning bridge, an optical de-multiplexer and a lens array. The aligning bridge has a first section and a second section opposite to the first section. The optical de-multiplexer is on the first section of the aligning bridge. The optical de-multiplexer comprises a plurality of filters configured to transmit a plurality of light beams of different wavelengths. The lens array is on the second section of the aligning bridge. The lens array comprises a plurality of input ports aligned with the filters and configured to receive the light beams from the filters.

Configurations for a modal interference device used for wavelength locking are disclosed. The modal interference device may be an interference device that includes an input waveguide, an interference waveguide, and an output waveguide. A fundamental mode of light may be launched into the input waveguide and the interference waveguide may receive the fundamental mode and generate a higher order mode of light, where the two modes of light may be superimposed while propagating through the interference waveguide. The two modes of light may be received at an output waveguide that collapses the two modes into a single mode and generates an output signal corresponding to the interference between the two modes of light. The output signal may be used to wavelength lock a measured wavelength to a target wavelength. The multiple output waveguides may produce output signals that have dead zones that do not align with one another for any wavelength in the wavelength range of interest.

An electro-optic combiner includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Each of the first and second OW's has a respective combiner section. The first and second OW combiner sections extend parallel to each other and have opposite light propagation directions. A plurality of ring resonators is disposed between the combiner sections of the first and second OW's and within an evanescent optically coupling distance of both the first and second OW's. Each of ring resonators operates at a respective resonant wavelength to optically couple light from the combiner section of the first OW into the combiner section of the second OW.

Examples described herein relate to an optical device having a photonic-crystal lattice structure. In some examples, the optical device may include a substrate having a photonic-crystal lattice structure. The optical device may further include an optical waveguide formed in the photonic-crystal lattice structure and a defect cavity formed in the photonic-crystal lattice structure and optically coupled to the optical waveguide. Furthermore, the optical device may include a refractive index tuning structure adjacent to the defect cavity in the photonic-crystal lattice structure.

An optical signal transceiver in a transistor outline package includes a component base, a laser device, a first wavelength division multiplexing prism and a second wavelength division multiplexing prism, a first photodetector, and a second photodetector. The component base is inside the transistor outline package and supports the laser device, the laser device emitting light to the outside of the transistor outline package. The first and second prisms and the first photodetector and the second photodetector are also located on the component base. Light output as optical signals sequentially pass through the first and second multiplexing prisms. The first input optical signal is transmitted to the first photodetector through the first prism, and the second input optical signal passes through the first prism and is passed on to the second photodetector via the second prism.

A microlens array according to an embodiment of the present disclosure includes lens layers with a first side thereof having aspheric-surface shapes. The microlens array is configured such that an optical communication module may be miniaturized and integrated as a working distance (WD) is minimized to 1.30±0.05 mm, and collimating performance is excellent as a curvature radius (R1) of each lens layer is 1.1 to 1.5.

Disclosed is a photodetector with a resonant waveguide structure, including: a substrate; a light absorption layer located on the substrate and configured for detecting an optical signal; a resonant waveguide structure including a first waveguide portion and a second waveguide portion spaced apart; the first waveguide portion receives the optical signal and transmits the received optical signal to a first region of the second waveguide portion, the second waveguide portion includes a second region for coupling the optical signal to the light absorption layer, and the second waveguide portion provides a circular transmission path for transmission of the optical signal to transmit the optical signal that transmitted to the first region to the second region along part of the circular transmission path and retransmit the optical signal that flows through the second region without being coupled to the light absorption layer to the second region along the circular transmission path.

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises a mold material. In an embodiment, a first photonics integrated circuit (PIC) is within the second layer. In an embodiment, a second PIC is within the second layer, and a waveguide is in the first layer. In an embodiment, the waveguide optically couples the first PIC to the second PIC.

The present disclosure includes a first lens to concentrate light emitted from an inclined output end face of an output end of a light guide; and a photodetector to receive light concentrated by the first lens, wherein when a point of the output end face farthest from the photodetector and a point of the output end face closest to the photodetector are projected onto a plane perpendicular to an optical axis of the first lens, a direction connecting the projected points is taken as a first axis, and an axis perpendicular to the first axis and the optical axis of the first lens is taken as a second axis, the photodetector is located at a position displaced with respect to an optical center of the first lens in a direction of the first axis and a direction of the second axis.