A chip packaging structure that includes an optoelectronic (OE) chip mounted on a first surface of a substrate and whose optically active area is directed laterally; and a lens array for the optoelectronic (OE) chip that is mounted on the first surface of the substrate and faces to the optoelectronic (OE) chip, wherein the lens array has inside a reflector reflecting light from a first direction to a second direction, in which the first direction is substantially perpendicular to the second direction.

An optical subassembly structure for mode conversion by an active alignment of an optical fiber with a semiconductor optical waveguide includes a sub-mount for holding the optical subassembly structure, a semiconductor die mounting on the sub-mount, the semiconductor optical waveguide growing on the semiconductor die and a glass capillary subassembly actively aligned to the semiconductor optical waveguide.

In a wavelength selective filter, an optical fiber collimator, an interference filter, and a reflective plate are arranged in this order from front to rear along a z-axis. The collimator has a collimator lens disposed on the rear side of an optical fiber that is opened. The interference filter includes light incident and emitting surfaces, opposed with their xy-planes rotated about a y-axis at a predetermined rotation angle. The reflective plate has a front reflective surface having a normal direction along a z-axis direction, and reflects, toward the front, light incident from the front through the interference filter, to be incident onto the interference filter. The optical fiber collimator causes the input light propagating through the optical fiber from the front to be incident onto the interference filter, and converges the reflected light transmitted through the interference filter to the optical fiber and outputs the light.

In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.

An alignment connector for an optoelectronic module can include: a front end having a first gripper arm and a second gripper arm with an alignment connector aperture between the first gripper arm and the second gripper arm; a base having a bottom surface and a receptacle surface; the back end having a first back wall and a second back wall with a back gap therebetween; and a ferrule receptacle extending to a medial region where the alignment connector aperture extends from, and including a portion of the receptacle surface, the ferrule receptacle being defined by a first side wall having a first latch arm and a second side wall having a second latch arm. The alignment connector can be included in a module with a bail or pull-tab. Alternatively, the first gripper arm and second gripper arm can be mounted directly to a module housing.

Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.

Optoelectronic devices with a support member and methods of manufacturing or assembling the same are provided. An example of an optoelectronic device according to the present disclosure includes a substrate and an optical component and an electronic component disposed thereon or therein. The optoelectronic device further includes a ferrule coupled to the optical fiber and an optical socket receiving the ferrule therein. The optoelectronic device includes a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member.

Encircled flux compliant test apparatus are provided. A test apparatus includes an optical connector, and a light source, the light source operable to emit encircled flux compliant light. The test apparatus further includes a first collimator, and a beam splitter optically aligned with the first collimator. The test apparatus further includes a first optical fiber pigtail connected to the light source, and a second optical fiber pigtail connected between the optical connector and the first collimator. A first portion of the light emitted by the light source is transmitted from the first optical fiber pigtail by the beam splitter and first collimator to the second optical fiber pigtail, and from the second optical fiber pigtail to the optical connector.

Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.

A light guide body for optical path and optical axis adjustment, the light guide body includes a silicon single crystal having an extinction ratio of 30 dB or more. The light guide body is a light guide body having one side surface alone joined and fixed to a base. An optical module including the light guide body installed at an installation angle adjusted for optical path and optical axis adjustment between components. An optical path and optical axis adjustment method including adjusting an installation angle of the light guide body to perform the optical path and optical axis adjustment between components. It is possible to provide the light guide body which does not adversely affect polarization characteristics and can easily perform the optical path and optical axis adjustment. It is possible to provide optical module and the optical path and optical axis adjustment method using such a light guide body.