An optical adjustment apparatus includes a measurement-light irradiation part that has a plurality of second optical fibers and emits, with timings different from each other, a plurality of lights having a single wavelength via the second optical fibers, an optical fiber block that holds exit-side end portions of the first and second optical fibers, a light detection part that receives and detects a plurality of reflected lights via the second optical fibers, a tilt calculation part that compares, with each other, variations with time of intensities of the respective reflected lights and calculates a tilt of the optical fiber block relative to the optical substrate, and a distance calculation part that calculates an inter-end surface distance between the optical substrate and the optical fiber block, based on a variation with time of an intensity of at least one reflected light.

Both a conventional receiver and an HDR-compatible receiver well perform electro-optical conversion processing on transmission video data obtained by using an HDR opto-electronic transfer characteristic. High dynamic range opto-electronic conversion is performed on high dynamic range video data to obtain the transmission video data. Encoding processing is performed on this transmission video data to obtain a video stream. A container of a predetermined format including this video stream is transmitted. Metadata information indicating a standard dynamic range opto-electronic transfer characteristic is inserted into a layer of the video stream, and metadata information indicating a high dynamic range opto-electronic transfer characteristic is inserted into at least one of the layer of the video stream and a layer of the container.

In an example, an optoelectronic device may include a hermetic cavity, an optical component, a multilayer ceramic, and an electrical circuit. The optical component may be positioned inside the hermetic cavity. The multilayer ceramic may define at least one side of the hermetic cavity. The electrical circuit may be routed through the multilayer ceramic to electrically couple the optical component positioned inside the hermetic cavity to an electrical component positioned outside of the hermetic cavity.

In the adjustment method of optical coupling for an optical integrated circuit according to the present disclosure, the optimal adjustment position of optical coupling is determined on the basis of, for example, a sum of a plurality of photocurrents at electrodes on arm waveguides respectively formed on the plurality of MZIs in the polarization-multiplexing IQ modulator. According to the maximum value of the sum of the plurality of photocurrents, the light condensing spot position is adjusted to the center position of the end face core of the optical waveguide of the integrated chip. Typically, the light condensing spot position is adjusted to the center of the end face core by displacing the two input lenses.

Optical alignment between an optical waveguide device and an optical connection part is realized easily and at low cost. An optical circuit in which optical waveguides to be connected to optical fibers are formed includes: an alignment optical waveguide configured to be opposed to, on an optical waveguide edge face to which an optical connection part having guide holes for insertion of core wires of the optical fibers is to be fixed, a guide hole into which an alignment optical fiber is to be inserted; and a light path changing member configured to change a path of light to a vertical direction with respect to the optical axis direction of the core of the alignment optical waveguide.

Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.

An optical module is disclosed. The optical module comprises an optical semiconductor element having a first optical axis thereof, an optical receptacle optically coupling with the semiconductor element and having a second optical axis thereof, a box-shaped housing having a bottom and a side wall built in an end of the bottom, and a beam shifter provided in the side wall. The housing encloses the optical semiconductor element therein but extracts the optical receptacle. The side wall of the housing demarcates the optical semiconductor element from the optical receptacle. The beam shifter aligns the first optical axis with the second optical axis.

Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.

An alignment connector for an optoelectronic module can include: a front end having a first gripper arm and a second gripper arm with an alignment connector aperture between the first gripper arm and the second gripper arm; a base having a bottom surface and a receptacle surface; the back end having a first back wall and a second back wall with a back gap therebetween; and a ferrule receptacle extending to a medial region where the alignment connector aperture extends from, and including a portion of the receptacle surface, the ferrule receptacle being defined by a first side wall having a first latch arm and a second side wall having a second latch arm. The alignment connector can be included in a module with a bail or pull-tab. Alternatively, the first gripper arm and second gripper arm can be mounted directly to a module housing.

Provided herein are systems, devices, and methods for improved optical waveguide transmission and alignment in an analytical system. Waveguides in optical analytical systems can exhibit variable and increasing back reflection of single-wavelength illumination over time, thus limiting their effectiveness and reliability. The systems are also subject to optical interference under conditions that have been used to overcome the back reflection. Novel systems and approaches using broadband illumination light with multiple longitudinal modes have been developed to improve optical transmission and analysis in these systems. Novel systems and approaches for the alignment of a target waveguide device and an optical source are also disclosed.