A method for optically and mechanically coupling an optical fiber to an optical or optoelectronic component on a substrate is provided. The method comprises: providing an optical fiber comprising a core and a cladding, the core being exposed at an end face of the optical fiber; forming a polymer waveguide core on the end face, the polymer waveguide core extending from the fiber core; bringing the polymer waveguide core in proximity of the optical or optoelectronic component; providing a liquid optical material, the liquid optical material embedding the polymer waveguide core; and curing the liquid optical material, thereby forming a polymer cladding layer encapsulating the polymer waveguide core and mechanically attaching the optical fiber to the optical or optoelectronic component.

Systems and methods are described for characterizing the location of optical components relative to one another for optimizing the performance of the optical module. In particular, a mechanism is provided for a user to visually determine, from a fiber point of view, the alignment and relative positioning of a lens assembly of the optical module with an optoelectronic transceiver, such as a VCSEL or a photodiode. By characterizing a location of the lens assembly with respect to the optoelectronic transceiver in an x-y plane and/or determining a spacing of the components in a z-direction, the user can compensate for expected signal losses through the optical module due to inaccuracies in the relative positioning of the components, adjust the relative positioning of the components in the optical module being examined, or modify manufacturing parameters to improve the accuracy of positioning in the modules and PCBAs yet to be built.

A fiber coupling device for coupling of at least one optical fiber is disclosed. The fiber coupling device comprises at least one opto-electronic and/or photonic chip comprising at least one opto-electronic and/or photonic integrated element capable of emitting and/or detecting electromagnetic radiation. The fiber coupling device is configured for coupling the at least one opto-electronic and/or photonic integrated element to at least one fiber end-piece of an optical fiber having a reflection surface and a convex exit and/or entrance surface. The fiber coupling device further comprises a fiber end-piece alignment substrate configured for locally contacting and thereby supporting at least one convex exit and/or entrance surface of at least one fiber end-piece in an aligned position relative to the at least one opto-electronic and/or photonic integrated element.

A blood coagulation analyzer comprises: a light irradiation unit configured to apply light onto a container configured to store a measurement specimen containing a sample and a reagent, and comprising: light sources including a first light source configured to generate light of a first wavelength for blood coagulation time measurement, a second light source configured to generate light of a second wavelength for synthetic substrate measurement, and a third light source configured to generate light of a third wavelength for immunonephelometry measurement; and optical fiber parts facing the respective light sources; a light reception part configured to receive light transmitted through the container; and an analysis unit configured to analyze the sample using an electric signal outputted from the light reception part.

Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

An optical module may include a case, an optical assembly, a circuit board interface positioned on the case, and a circuit board attached to the case through the circuit board interface. The optical assembly may be arranged in the case. The circuit board may include a first area that may electrically connect the circuit board to the optical assembly. The circuit board may also include a second area that may secure the circuit board to the circuit board interface. An optical module manufacturing method is also provided.

An optical communication module configured for enhancing optical coupling efficiency, which includes an optical butt joint receptacle and a light emitting body provided on one side of the optical butt joint receptacle. The optical butt joint receptacle has a receptacle body and a through hole provided in the receptacle body for a dual-core optical fiber to extend through. The receptacle body has a light-receiving side and an optical fiber insertion groove corresponding respectively to two ends of the through hole. The light emitting body includes a housing, a laser semiconductor provided in the housing, and an aperture provided in one side of the housing for aligning with the through hole so as that the laser beam emitted by the laser semiconductor is optically coupled to the dual-core optical fiber. The dual-core optical fiber has different core diameters and numerical apertures to enhance the coupling efficiency and reduce the coupling loss in between with the external optical fiber.

A fixture for aligning a linear array of optical fiber terminators includes a base and a heightwise stack of positioning devices disposed on the base. Each positioning device includes an anchor secured to a lengthwise wall of a bracket coupled to the base, a terminator holder flexibly coupled to the anchor and having a lengthwise channel for holding a respective optical fiber terminator, and actuators controlling position and yaw of the terminator holder in a plane orthogonal to the heightwise direction. The terminator holder has planar top and bottom surfaces that define a height of the terminator holder and interface with the terminator holder of any adjacent positioning device. The fixture also includes a clamp for clamping the positioning device stack against the base after setting the in-plane position and yaw of each terminator holder. Individual positioning devices may be adjusted or replaced without disturbing the rest of the stack.

An optical connection structure includes a substrate, an optical integrated circuit, including a reception/emission portion that receives and emits an optical signal, that is electrically connected to the substrate, a microlens array including a first lens disposed at a position corresponding to the reception/emission portion, a ferrule including a fiber hole into which an optical fiber is inserted and a second lens into which an optical signal from the optical fiber is input, and a receptacle that holds the ferrule. The optical integrated circuit and the receptacle are fixed to the microlens array. The second lens faces the first lens when the receptacle holds the ferrule.

A substrate comprises multiple interposers. Each interposer includes interposer elements, where an optical device is coupled to at least some of the interposer elements; two passages formed through the interposer, where each passage is registered with respect to the interposer elements; two blind holes formed in a surface of the interposer, where each blind hole is concentric with a different passage; two annular troughs formed in the surface, each concentric with a different passage, and an annular area separates the annular troughs from an outer diameter of the corresponding concentric passage; and two spherical registration elements, where each registration element is positioned on uncured adhesive on one of the annular areas, where the passages enable a vacuum to be drawn through such that the registration elements are pulled toward the surface of the interposer to self-align to the inner diameter of the blind holes.