An interposer for coupling an optical conduit to an optical component, said interposer comprising: (a) an optical component; (b) a first lens component having a first lens; (c) a second lens component having a second lens, said first and second lenses being configured to define an expanded-beam coupling therebetween; (d) at least one reflective surface optically coupled with said second lens; (e) a first optical path at least partially defined between said optical component and said first lens to accommodate a diverging light beam from said optical component to said first lens; (f) a second optical path at least partially defined between said second lens and said at least one reflective surface to accommodate a converging light beam from said second lens and said at least one reflective surface; and (g) a separable interface along said second optical path or at said expanded-beam coupling.

A termination ferrule includes a ferrule body and a ferrule plate. The ferrule body includes multiple bores arranged to align with a pattern of lasers in a vertical-cavity surface-emitting laser (VCSEL) array. Each of the multiple bores includes an entry diameter sized for an optical fiber with a protective coating and an exit diameter sized for a portion of the optical fiber without the protective coating. The ferrule plate includes multiple holes arranged to align with the pattern of lasers in the VCSEL array. Each of the multiple holes includes a hole diameter sized to receive the portion of the optical fiber without the protective coating. The ferrule plate is secured between the VCSEL array and the ferrule body, and the ferrule plate includes a thickness sufficient to create a gap between each laser in the VCSEL array and the corresponding optical fiber.

An optical fiber coupling connector includes a board, a light receiving device, two light emitting devices, a controller and an optical coupling lens. The optical coupling lens includes three main bodies, each includes a bottom surface, a top surface, an alignment surface, a first and a second side surface, a third side surface obliquely connected to the first side surface, and a fourth side surface obliquely connected to the second side surface and connected to the third side surface at a second edge. The alignment surface, the first side surface, the third side surface, the fourth side surface and the second side surface are connected to each other end to end in that order. The third side surface of each one of the main bodies contacts the fourth side surface of an adjacent one of the main bodies. At least three optical fibers positioned to the optical coupling lens.

An integrated optical sensor module includes an optical sensor die having an optical sensing area on its first surface, and an application-specific integrated circuit (ASIC) die arranged over the first surface of the optical sensor die. A hole in the ASIC die is at least partially aligned with the optical sensing area such that at least some of the light passing through the hole may contact the optical sensing area. The hole through the ASIC die can be configured to receive an optical fiber, lens structure, or other optical element therein.

A multi-channel transmitter optical subassembly (TOSA) with an off-center fiber in an optical coupling is disclosed, and can provide passive compensation for beam displacement introduced by optical isolators. The optical coupling receptacle can include an optical isolator configured to receive a focused light beam from a focus lens within the TOSA. The optical coupling receptacle may be offset such that a center line of the focused light beam entering the optical isolator is offset from a center line of a fiber within optical coupling receptacle. Thus the optical isolator receives the focused light beam from the focus lens and introduces beam displacement such that an optical signal is launched generally along a center line of the fiber. Thus the expected beam displacement introduced by the optical isolator is eliminated or otherwise mitigated by the offset between a center line of the fiber and a center position of the focus lens.

An ophthalmic illumination apparatus can include a movable support. The apparatus can also include an optical array coupled to the movable support and positioned to interact with a light beam from a light source. The optical array can include first and second optical elements. The first optical element can be configured to reflect and transmit first associated amounts of the light beam. The second optical element can be configured to reflect and transmit second associated amounts of the light beam different than the first optical element. The apparatus can further include a drive mechanism coupled to the movable support. The drive mechanism can be configured to cause the movable support to selectively move the optical array such that the light beam is selectively incident upon one of the first optical element or the second optical element. Associated devices, systems, and methods are also provided.

A substrate comprises multiple interposers. Each interposer includes interposer elements, where an optical device is coupled to at least some of the interposer elements; two passages formed through the interposer, where each passage is registered with respect to the interposer elements; two blind holes formed in a surface of the interposer, where each blind hole is concentric with a different passage; two annular troughs formed in the surface, each concentric with a different passage, and an annular area separates the annular troughs from an outer diameter of the corresponding concentric passage; and two spherical registration elements, where each registration element is positioned on uncured adhesive on one of the annular areas, where the passages enable a vacuum to be drawn through such that the registration elements are pulled toward the surface of the interposer to self-align to the inner diameter of the blind holes.

A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

Disclosed are various embodiments for a multi-tip laser coupler with improved alignment guidance. A photonic integrated circuit (PIC) includes an input interface, an output interface, and a waveguide array. The waveguide array includes a first waveguide, a second waveguide, and a third waveguide. The first waveguide and the third waveguide are coupled to the input interface and are not coupled to the output interface. The second waveguide is coupled to the input interface and the output interface. Further, the second waveguide is positioned parallel to and between the first waveguide and a third waveguide. The second waveguide includes a tapered body such that an output end of the second waveguide coupled to the output interface is wider than an input end of the second waveguide coupled to the input interface.