An optical-electrical substrate for providing electrical and optical connections to a photonic integrated circuit (PIC) includes a glass body with glass optical waveguides along an upper surface, and electrically conductive vias extending through a portion of the glass body from an intermediate surface to a lower surface. The intermediate surface is arranged at an elevation positioned between the upper and lower surfaces, and may optionally support redistribution layers and an electrical integrated circuit. An optical-electrical substrate may be fabricated by defining glass optical waveguides along an upper surface of a glass body, and forming electrically conductive vias through the glass body from the intermediate surface to the lower surface. A connection method includes registering a PIC with an optical-electrical substrate as described herein; heating bonding bumps arranged between the PIC and the intermediate surface; and providing optically transmissive paths between the PIC and glass optical waveguides of the substrate.

Disclosed are various embodiments for a multi-tip laser coupler with improved alignment guidance. A photonic integrated circuit (PIC) includes an input interface, an output interface, and a waveguide array. The waveguide array includes a first waveguide, a second waveguide, and a third waveguide. The first waveguide and the third waveguide are coupled to the input interface and are not coupled to the output interface. The second waveguide is coupled to the input interface and the output interface. Further, the second waveguide is positioned parallel to and between the first waveguide and a third waveguide. The second waveguide includes a tapered body such that an output end of the second waveguide coupled to the output interface is wider than an input end of the second waveguide coupled to the input interface.

Alignment aid structures and the method of formation of these structures on an interposer comprised of a planar waveguide layer and a base structure, facilitate the alignment of the optical axes of optical and optoelectrical devices formed from and mounted to the interposer. Alignment aids formed from a common hard mask on the planar waveguide layer of the interposer structure include vertical and lateral alignment structures and fiducials. Optical losses for signals propagating in interposer-based photonic integrated circuits are reduced with effective alignment structures and methods.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

An optical connector has a connector housing assembly for holding one or more ferrules, the connector housing assembly having a height align a vertical alignment axis and a width perpendicular to the height. The connector housing assembly includes an inner front body and an outer release component, the outer release component being movable in relation to the inner front body between a front position and a back position. The optical fiber connector is configured to mate with a receptacle having an upper receptacle hook such that the upper receptacle hook is received in the upper receptacle hook recess and latches with the upper hook retainer surface when the outer release component is in the front position and such that the upper ramp lifts the upper receptacle hook out of the upper receptacle hook recess when the outer release component moves to the back position.

An optical connector module and an optical interconnection module comprising it are disclosed. The optical connector module and the optical interconnection module of the present invention comprise: at least one optical device configured to include at least one of a light-emitting device and a light-receiving device; and an optical fiber guide configured to contact the optical device on at least two points to align a first optical path of the optical device with a second optical path of the optical fiber at a predetermined position, wherein the second optical path acquires light generated by the optical device or transmits light to the optical device. According to the present invention, the optical device and the optical fiber can be naturally aligned with each other.

An optical assembly includes an optical ferrule configured to receive an input light ray through an input location on a major input surface of the optical ferrule along a first direction for coupling to an optical waveguide secured to the optical ferrule, the optical ferrule including a reference location, such that a change in a temperature of the optical assembly causes the input light ray and the input location, but not the reference location, to move respective distances d1 and d2 along a same direction along a same axis, wherein a magnitude of d1-d2 is , and a maximum of magnitudes of d1 and d2 is greater than 10 times .

An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Optical alignment of a receptacle at an aligned position on an optoelectronic device body is accomplished using an alignment optical connector that is demountably attached to the receptacle by matching passive alignment features on the facing surfaces between the receptacle and the alignment optical connector. The device body includes a first row of at least two data optical ports, and a second row of alignment input and output ports parallel to and spaced from the first row of data optical ports by a parallel spacing. The data optical ports communicate with the optoelectronic device. The alignment ports correspond to a loopback waveguide. The aligned position of the receptacle is determined from the loopback waveguide. The receptacle is permanently attached to the device body at this aligned position. A data optical connector is similarly configured as the alignment optical connector, in the manner in which optical fibers are supported to input/output optical signals and with similar passive alignment features, but the passive alignment features are referenced to the optical fibers by an offset equivalent to the parallel spacing between the first and second rows. The second row is same or shorter than the first row. The number of data optical ports is greater or equal to the number of alignment optical ports. The data optical ports and the alignment optical ports are arranged in a 2N matrix.

Methods and apparatus are disclosed for waveguide alignment between optical components. An example apparatus includes a first component having a first surface and a first waveguide, the first component having a first magnet array on the first surface; and a second component having a second surface and a second waveguide, the second component having a second magnet array on the second surface, the first magnet array to be attracted towards the second magnet array to urge the first magnet array into alignment with the second magnet array, the first waveguide positioned to at least one of transmit or receive an optical signal to or from the second waveguide when the first magnet array is in alignment with the second magnet array.