Some embodiments of the present disclosure are directed to an optical waveguide for co-packaged optics packages. For example, a module may include a substrate having a substrate optical waveguide, an interposer disposed on a surface of the substrate, where the interposer comprises an interposer optical waveguide, and where the interposer is configured to optically align the interposer optical waveguide with the substrate optical waveguide, a main die disposed on a surface of the interposer, and a photonic IC disposed on the surface of the interposer and configured to be in optical communication with the interposer optical waveguide. Additionally, or alternatively, the substrate optical waveguide may be configured to convey optical signals between the substrate and the interposer. Further, the interposer optical waveguide may be configured to convey optical signals between the surface of the substrate and the interposer.

Disclosed embodiments relate to additive manufacturing systems. In some embodiments, an additive manufacturing system may include a plurality of laser energy sources, an optics assembly configured to direct laser energy onto a build surface, and an optical fiber connector positioned between the plurality of laser energy sources and the optics assembly. A first plurality of optical fibers may extend between the plurality of laser energy sources and the optical fiber connector, and a second plurality of optical fibers may extend between the optical fiber connector and the optics assembly. Each optical fiber of the first plurality of optical fibers may be coupled to a corresponding optical fiber of the second plurality of optical fibers within the optical fiber connector.

A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.

Photonic IC packages, related devices and methods, are disclosed herein. In some embodiments, a photonic package may include a substrate including a dielectric material with conductive pathways; a photonic integrated circuit (PIC) having a first optical element, the PIC electrically coupled to the substrate; a connector including a fiber alignment structure; and a second optical element, wherein the second optical element is to expand and collimate an optical beam; and a fiber having a first end and an opposing second end, wherein the fiber is positioned in the fiber alignment structure, and wherein the first end of the fiber is optically coupled to the first optical element and the second end of the fiber is optically coupled to the second optical element.

An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

An electronic device is provided. The electronic device includes a photonic component, a first optical element, and a second optical element. The photonic component includes an optical channel. The first optical element is configured to optically couple with the optical channel. The second optical element is self-aligned with the optical channel and defined at a specific position to be configured to direct an optical signal between the optical channel and the first optical element.

An optical module includes: a base having a first surface facing a first direction, and a second surface that faces the first direction and that is away from the first surface in a second direction orthogonal to the first direction; an optical element provided on the first surface; an optical fiber fixing portion including a groove configured to at least partially accommodate a core wire obtained by removing a coating from an optical fiber; and an alignment mark provided either at a first position away from the groove in a direction opposite to the second direction or at a second position shifted from the first position in a direction opposite to a third direction orthogonal to both of the first direction and the second direction, as viewed in the direction opposite to the first direction.

Structures and methods that provide and maintain precise lateral registration between mounted optical devices and waveguides formed on an optical interposer structure use a methodology in which a same patterned mask layer is utilized to pattern a plurality of alignment features requiring alignment and the waveguide cores to which mounted devices are aligned in the formation of photonic integrated circuits. Subsequent burial and re-exposure of the patterned mask layer in subsequent processing steps maintains the feature registration provided with the use of the self-aligned layer throughout the formation of the optical interposer and the alignment structures provided thereon.

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC (PIC) is provided by a controlled mating between alignment V-grooves formed in a fiber array support substrate and extra-array alignment ridges formed beyond the extent of a waveguide array integrated within the PIC. The height and width of the alignment ridges are formed to engage with the alignment V-grooves upon mating of the fiber array substrate with the PIC, providing passive alignment while maintaining a physical gap spacing g between the components (ensuring the integrity of the passive alignment).

Position controlled waveguides and methods of manufacturing the same are disclosed. An example apparatus includes a substrate with a channel that extends into a first surface of the substrate to a second surface of the substrate, wherein the second surface is recessed relative to the first surface; buffer material having a first index of refraction on the second surface of the substrate; and a waveguide on the buffer material, the waveguide having a second index of refraction that is higher than the first index of refraction.