An embodiment optical connector includes a fiber having a core through which light is guided and a magnet attached to one end of the fiber, and the magnet has an opening that exposes at least the end face of the core. An embodiment optical connection structure includes a first optical connector and a second optical connector, each including a fiber having a core through which light is guided and a magnet attached to one end of the fiber, wherein the magnets are magnetized so as to exert attraction on each other, and when the first optical connector and the second optical connector are mechanically connected by magnetic forces, the core of the first optical connector and the core of the second optical connector are optically connected through the opening of the magnet of the first optical connector and the opening of the magnet of the second optical connector.

A silicon photonics based single wavelength 100 Gbit/s PAM4 DWDM transceiver in a pluggable form factor having a transmitter, said transmitter having: a DWDM laser source; a fiber array pigtail having a polarization maintaining fiber and an output single mode fiber; a silicon photonics modulator chip configured to optically connect to the DWDM laser source through the usage of the polarization maintaining fiber, a modulator driver chip connected to the silicon photonics modulator chip and an LC receptacle configured to optically connect to the silicon photonics modulator chip through the usage of the output single mode fiber. The disclosed transmitter may be further comprised of a reference loop within the silicon photonics modulator chip to allow for the utilization of a passive alignment approach for optically connected elements. The disclosed transceiver may be configured for use with C-band DWDM applications for utilization in applicable technologies, including 5G telecommunications.

A contactless connector includes: a light emitter for emitting light; a light-transmitting member at least partially covering the light emitter; and an alignment mechanism that enables an alignment error between the light emitter and a light receiver on another contactless connector to be not greater than 5 microns; wherein the light-transmitting member includes a mating surface that is matched with an opposite surface of the another contactless connector and there is an elastic member on the opposite surface of the another contactless connector to adjust alignment of the alignment mechanism.

A manufacturing method and application of an optical interconnection module are disclosed. According to example embodiments, by providing the method of manufacturing the optical interconnection module in which an optical fiber optical coupler is disposed at its lower portion by using the FOWLP process, it is possible to provide advantages such as lightness, thinness and compactness of the optical interconnection module, guarantee of signal integrity, and high yield in mass production. Further, it is possible to provide a structure providing an electrical ground to an electronic chip by mounting the electronic chip on ETB and capable of being used as a heat dissipation path.

Embodiments disclosed herein include photonics systems and packages. In an embodiment, a photonics package comprises a package substrate and a photonics die overhanging an edge of the package substrate. In an embodiment, the photonics die comprises a v-groove for receiving an optical fiber. In an embodiment, the photonics package further comprises an integrated heat spreader (IHS) over the photonics die. In an embodiment, the IHS comprises a foot, and a hole through the foot is aligned with the v-groove.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

A method according to one embodiment includes steps of: preparing an optical module and optical fiber holding member; attaching a clip member to a receptacle of the optical module and the optical fiber holding member; and pressing the receptacle of the optical module and the optical fiber holding member from below and pressing the clip member from above. The pressing step has pressing the first flat surface of the receptacle and the second flat surface of the optical fiber holding member at the third flat surface of the clip member, and which performed until the first flat surface of the receptacle and the second flat surface of the optical fiber holding member establish parallelism with the third flat surface of the clip member by using a jig that changes the parallelism of the pressing surface.

An apparatus includes a dielectric support substrate with one or more planar major surfaces and one or more optical fiber interfaces fixed to the support substrate adjacent one of the one or more planar major surfaces. Each optical fiber interface has optical modulators and photodetectors. The apparatus also includes one or more digital signal processing chips fixed to the support substrate adjacent one of the one or more planar major surfaces, and laterally separated from and communicatively connected via metallic lines to the one or more optical fiber interfaces. The apparatus also includes a first set of one or more metallic heatsinks adjacent the one or more digital signal processing chips to provide heat dissipation therefrom. The apparatus also includes a second set of one or more metallic heatsinks being located adjacent the one or more optical fiber interfaces to provide heat dissipation therefrom and physically separated by a distance from the one or more metallic heatsinks of the first set.