An optical module includes: an optical element including a light emitting section which emits a light signal and two external terminals on a light emitting surface; an optical fiber configured to transmit the light signal; a ferrule having an insertion hole into which the optical fiber is inserted; and a wiring board where two connection electrodes provided to a first main surface are respectively bonded to the two external terminals via bumps, and the ferrule is provided to a second main surface, wherein the light emitting surface of the light emitting element is inclined with respect to the first main surface at a predetermined inclination angle based on heights of the bumps.

An example optoelectronic module may include an optical subassembly (OSA), an optical port block, a housing, and a holder. The OSA may be configured to convert between optical and electrical signals. The optical port block may be attached to the OSA and may be configured to optically align a fiber optic cable with the OSA. The housing may be configured to substantially enclose the OSA and the optical port block. The holder may be configured to couple the OSA and the optical port block to the housing. The holder may be detachably coupled to the optical port block and fixedly coupled to the housing.

Disclosed herein is a fiber optic-to-waveguide coupling assembly with an overlap for edge coupling. The fiber optic-to-waveguide coupling assembly includes a first coupler having a substrate and at least one data fiber, and an interposer with at least one waveguide. A first coupler overlap portion of the substrate is positionable proximate a first interposer overlap portion of the interposer to form a first overlap therebetween to align the at least one data fiber with the at least one waveguide. The substrate and the interposer may each include complementary alignment features to further align the at least one data fiber and the at least one waveguide. The fiber optic-to-waveguide coupling assembly provides simple and accurate alignment with simplified manufacture and assembly.

A combined-wave laser light source comprises a two-dimensional laser light source 1 in which laser light sources are arranged two-dimensionally along a common plane, and a two-dimensional deflection optic element that is arranged corresponding to the two-dimensional laser light source 1 and which has an x-direction steering optic element 3 that deflects each laser optic axis of the two-dimensional laser light source in an x-direction and a y-direction steering optic element 4 that deflects each laser optic axis of the two-dimensional laser light source in a y-direction; and a combining lens 5 that converges the laser lights from the two-dimensional deflection optic elements, 3, 4 to combine said laser lights to an optical fiber.

A photonic chip includes a connecting means, a substrate, and a waveguide layer. The photonic integrated waveguide and the optical fiber each have a front end portion. The connecting means includes a groove configured to receive the front end portion of the optical fiber. The groove is essentially U-shaped in its cross section, and the groove has a bottom surface and two inner side surfaces. A least one of both inner side surfaces of the U-shaped groove has a coating of an elastic material configured to hold in place the optical fiber after it is inserted into the groove. The invention further relates to an optical device which includes a photonic chip and an optical fiber, as well as a method or production of such a photonic chip.

An optical device may include an optical bench used align a photonic chip to a receptacle. In one embodiment, a surface of the optical bench defines an alignment plane. When a fiber stub in the receptacle is disposed on the surface, an optical path in the stub is parallel with the alignment plane. By disposing the photonic chip on the same surface, the chip and the stub can be aligned such that optical signals can be transmitted between the stub and an optical component (e.g., light source or waveguide) in the photonic chip. In one embodiment, the optical path in the stub and the optical component may have the same height relative to the optical bench. Moreover, the optical device may include a direct thermal connection between the assembly and the heat sink, and thus, have better thermal coupling relative to using thermal pads.

Architecture and method for passive-active optical alignment of photonic integrated circuit (PIC) and an optical connector or fiber array unit (FAU). V-grooves are created on the surface of the PIC die and features are created on the FAU to extend from the FAU into the respective V-grooves. The passive alignment aspect includes using moderate precision pick and place equipment to place the FAU connector on the PIC die and mate the features into the V-grooves (i.e., assembling one or more sliding joints). The sliding joints limit movement between the components to a single degree of freedom. The active alignment aspect of the present disclosure includes manipulating the sliding joint, in the available degree of freedom, to actively search for the optimal optical power in optical coupling between the FAU and the PIC die.