A pluggable optical module unlocking structure has a shell and outer buckle; a mounting groove with a metal rocker plate having a flat and oblique rocker plates; the oblique rocker plate at a flat rocker plate end away from the outer buckle, and an oblique rocker plate end near the flat rocker plate is a lower end; a flat rocker plate end away from the oblique rocker plate symmetrically has lifting claws on both sides of the outer buckle; a pulling tab is slidably mounted on the shell, the pulling tab includes a pressing rod in a shell width direction, and a lower end pressing rod surface abuts against a flat rocker plate upper end surface. The pressing rod and metal rocker plate form a seesaw structure unlocking mechanism. The pulling tab moves the pressing rod so that the lifting claws raise the cage spring upward to unlock.

A package includes a light emitting portion configured to emit light, a lens including a first lens surface and a second lens surface, a protective layer between the light emitting portion and the first lens surface and that shields the first lens surface from a surrounding environment, and an optical component that redirects light output from the second lens surface. The first lens surface is configured to receive the emitted light from the light emitting portion, the second lens surface is configured output light that has passed through the first lens surface, and the protective layer has a refractive index greater than 1.5.

An optical alignment device according to an embodiment of the inventive concept includes an optical alignment plate having a first hole and at least one second hole, in which the first hole and the second hole pass through the optical alignment plate, and an optical detection element disposed on the optical alignment plate. Here, the optical detection element includes a substrate having a first surface and a second surface, which face each other, a lens disposed on the first surface, and an optical sensor disposed on the second surface, and the optical detection element vertically overlaps the first hole and the second hole. The lens is exposed to the outside by the first hole, and the second hole is connected with a vacuum suction unit to fix the optical detection element to the optical alignment plate.

A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.

A system for injection of a useful radiation beam into an optical fiber is disclosed including a secondary radiation source, which is connected to the optical fiber such that a secondary radiation beam leaves by an end of the optical fiber. A variable deviation device, for deviating the useful radiation beam towards the end of the optical fiber, an optical detection assembly, identifying the direction of the secondary radiation beam, and an injection controller, for controlling the variable deviation device depending on the direction of the secondary radiation beam. The secondary radiation may be made up by an amplified spontaneous emission from a laser amplifier which is used for amplifying the useful radiation. The injection system may advantageously be used in a terminal for optical telecommunication by laser signals.

A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.

A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.

Alignment aid structures and the method of formation of these structures on an interposer comprised of a planar waveguide layer and a base structure, facilitate the alignment of the optical axes of optical and optoelectrical devices formed from and mounted to the interposer. Alignment aids formed from a common hard mask on the planar waveguide layer of the interposer structure include vertical and lateral alignment structures and fiducials. Optical losses for signals propagating in interposer-based photonic integrated circuits are reduced with effective alignment structures and methods.

A photonic system includes a first photonic circuit having a first face and a second photonic circuit having a second face. The first photonic circuit comprises first wave guides, and, for each first wave guide, a second wave guide covering the first wave guide, the second wave guides being in contact with the first face and placed between the first face and the second face, the first wave guides being located on the side of the first face opposite the second wave guides. The second photonic circuit comprises, for each second wave guide, a third wave guide covering the second wave guide. The first photonic circuit comprises first positioning devices projecting from the first face and the second photonic circuit comprises second positioning devices projecting from the second face, at least one of the first positioning devices abutting one of the second positioning devices in a first direction.

A fiber plug facilitates optical coupling of a light-guiding fiber to a plug receptacle and includes a plug housing for receiving and locking parts of the fiber plug in position relative to one another. The plug housing has: a fiber inlet and a fiber bearing for the spatially fixed reception of the fiber; optically downstream of the fiber bearing along a beam path, an optical lens for collecting light exiting at an end face of the light-guiding fiber and for collimating the collected light; and a coupling surface with an output of the beam path and with a coupling structure for connection to a receptacle structure that is complementary to the coupling structure. An adjustable optical element is arranged optically downstream of the fiber bearing in the beam path and has a first component of a magnetic coupling consisting of two components and a first component of a kinematic coupling.