A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.

A method and system for attaching an optical fiber to a bench. A mounting structure is attached to the bench and the proximal end of the optical fiber is epoxy bonded to the mounting structure.

A first optical axis of a first optical component is caused to be at a first angle with respect to a first precision surface of the first optical component. A second optical axis of a second optical component is aligned to be at a second angle to a second flat surface of the second optical component. The second angle is equal to or derived from the first angle. The first and second flat surfaces are caused to directly face each other to allow only sliding motion between the first and second flat surfaces. The sliding motion is performed between the first and second flat surfaces until the first and second optical axes are sufficiently collinear.

A percutaneous lead is provided which includes a generally tubular, multi-duct, flexible lead body. The lead body supports a distal set of electrodes and a proximal set of contacts which are connected by conductors in the ducts. The lead body further houses an optical fiber with a side firing section. The side firing section is held adjacent an optical transmission window, integrally formed with the flexible lead body. A cylindrical ferrule is provided to position the fiber in the header of an IPG.

In accordance with an embodiment, a welding assembly is disclosed that allows for a laser assembly to be coupled into a socket of the same and held at a fixed position, e.g., by a mechanical grabber of a welding system. The mechanical grabber may then travel along one or more axis to bring the TOSA module into mechanical alignment with an opening of an associated optical subassembly housing. The welding assembly may further include an alignment member that provides one or more alignment contact surfaces configured to be brought directly into contact with a surface of the associated subassembly housing. When the one or more alignment contact surfaces are flush with the surface of the subassembly housing the emission face of the TOSA module is substantially parallel, and by extension, optically aligned with the opening of the associated subassembly housing.

An optical transmission module includes a substrate having an opening portion; an optical element closing an opening on the lower surface side of the substrate and converting an electric signal into an optical signal or the optical signal into the electric signal; an optical fiber transmitting the optical signal; a ferrule closing an opening on the upper surface side of the substrate and having an optical fiber insertion hole; and a resin filled into a space surrounded at least by the substrate, the optical element, the ferrule, and a distal end of the optical fiber, wherein the ferrule has a resin filling hole spaced apart from the optical fiber insertion hole to fill the space with the resin, and an angle formed by an axis of the optical fiber insertion hole and an axis of the resin filling hole is equal to or more than 0 and less than 90.

A photonic system includes a first photonic circuit having a first face and a second photonic circuit having a second face. The first photonic circuit comprises first wave guides, and, for each first wave guide, a second wave guide covering the first wave guide, the second wave guides being in contact with the first face and placed between the first face and the second face, the first wave guides being located on the side of the first face opposite the second wave guides. The second photonic circuit comprises, for each second wave guide, a third wave guide covering the second wave guide. The first photonic circuit comprises first positioning devices projecting from the first face and the second photonic circuit comprises second positioning devices projecting from the second face, at least one of the first positioning devices abutting one of the second positioning devices in a first direction.

A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

A first optical axis of a first optical component is caused to be at a first angle with respect to a first precision surface of the first optical component. A second optical axis of a second optical component is aligned to be at a second angle to a second flat surface of the second optical component. The second angle is equal to or derived from the first angle. The first and second flat surfaces are caused to directly face each other to allow only sliding motion between the first and second flat surfaces. The sliding motion is performed between the first and second flat surfaces until the first and second optical axes are sufficiently collinear.