An optical module that has a structure ensuring reduction in size. The optical module has a structure where a part of a fiber block is protruded from a housing. By including a thin plate, this optical module can avoid entering of dust in the housing, allows a position shift of the fiber block due to a mounting position error of an optical component in the housing, a position shift of an opening portion due to a dimensional error of the housing, or a displacement due to a temperature change, and can reduce the coupling loss due to the optical axis misalignment.

A display device includes a cover structure, a light guide plate, and a display panel. The cover structure includes an anti-glare layer, a light blocking frame, and an adhesive layer. The anti-glare layer has a display region and an non-display region. The light blocking frame surrounds a receiving space. An orthogonal projection of the light blocking frame on the anti-glare layer is located within the non-display region. An adhesive layer is located in the receiving space of the light blocking frame. The light guide plate is located on the surface of the adhesive layer facing away from the anti-glare layer. The display panel is adjacent to the light guide plate.

An optical module that includes a shell, an optical fiber, a coupling portion, and a ferrule is disclosed. The shell installs an optical device, for instance, a multi-mode interference (MMI) device therein. The optical fiber in a tip thereof is optically coupled with the optical device within the shell. The coupling portion has a cylindrical shape with a bore having an axis and secures the optical fiber, where the coupling portion is attached to the shell. The ferrule, which is secured in the coupling portion, has a pillared shape with a diameter that is slightly smaller than a diameter of the bore of the coupling portion. The ferrule has a groove that receives and secures the optical fiber therein. The filler fills the groove and fixes the optical fiber in the groove.

A termination for a light guide is provided that, on the one hand, allows connection of the light guide to a light source in a simple and reliable manner and, on the other hand, blocks light components that are not guided in the light guide. For this purpose, a ferrule is provided for terminating a light guide. The ferrule includes a transparent plastic part and an opaque light-blocking plastic part that are connected to each other to define a channel. The transparent plastic part has a light entry end that receives an end of the light guide. The channel has at least a portion that extends within the transparent plastic part and at least a portion that extends within the opaque plastic part. The has a collar surrounding the channel and has an outer diameter that is greater than a maximum outer diameter of the transparent plastic part.

In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

A hermetic optical fiber alignment assembly includes a ferrule portion having a plurality of grooves receiving the end sections of optical fibers, wherein the grooves define the location and orientation of the end sections with respect to the ferrule portion. The assembly includes an integrated optical element for coupling the input/output of an optical fiber to the opto-electronic devices in the opto-electronic module. The optical element can be in the form of a structured reflective surface. The end of the optical fiber is at a defined distance to and aligned with the structured reflective surface. The structured reflective surfaces and the fiber alignment grooves can be formed by stamping.

In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

An opto-electric hybrid board includes an optical waveguide and an electric circuit board. The opto-electric hybrid board has an electrode at one end portion in a first direction perpendicular to the thickness direction, and optically and electrically connects an optical element emitting light from a space between the one end portion and the other end portion. The electric circuit board includes a terminal portion electrically connected to the electrode and a support portion that supports the other end portion. The optical waveguide includes a light receiving portion for receiving light emitted from the optical element, which is positioned between the terminal portion and the support portion, when projected in the thickness direction, and a one-side surface in the thickness direction of the terminal portion is positioned at the other side in the thickness direction with respect to a one-side surface in the thickness direction of the support portion.

A conductive hermetically sealed monolithic photonic integrated circuit with optical components and multiple optical and electrical inputs/outputs includes a semiconductor/metal base having sensitive components with multiple optical and electrical inputs, multiple optical and electrical outputs, and/or multiple optical and electrical inputs and outputs. An electrically conductive basic lid includes at least two of metal, dielectric and semiconductor materials combined to form an electrically conductive protective circuit. The conductive basic lid is sealed to the semiconductor/metal base by metallization so as to form a chamber including the sensitive components and hermetically sealing the chamber and the sensitive component from the ambient in a basic hermetic capsule and the electrically conductive protective circuit is formed and connected to protect the sensitive components from external electrical interference.

A hermetic optical fiber alignment assembly, including a first ferrule portion having a first surface provided with a plurality of grooves receiving the end sections of optical fibers, wherein the grooves define the location and orientation of the end sections with respect to the first ferrule portion, and a second ferrule portion having a second surface facing the first surface of the first ferrule, wherein the first ferrule portion is attached to the second ferrule portion with the first surface against the second surface, wherein a cavity is defined between the first ferrule portion and the second ferrule portion, wherein the cavity is wider than the grooves, and wherein a suspended section of each optical fiber is suspended in the cavity, and wherein the cavity is sealed with a sealant. The sealant extends around the suspended sections of the optical fibers within the cavity. An aperture is provided in at least one of the first ferrule portion and the second ferrule portion, exposing the cavity, wherein the sealant is feed through the aperture. In another aspect, the hermetic assembly provides optical alignment and a hermetic feedthrough for an opto-electronic module. In a further aspect, the hermetic assembly provides alignment and a terminal for access to an opto-electronic module.