G02B6/4254

TRANSMITTER OPTICAL SUBASSEMBLY ARRANGEMENT WITH VERTICALLY-MOUNTED MONITOR PHOTODIODES
20200251879 · 2020-08-06 ·

The present disclosure is generally directed to a multi-channel TOSA with vertically-mounted MPDs to reduce TOSA housing dimensions and improve RF driving signal quality. In more detail, a TOSA housing consistent with the present disclosure includes at least one vertical MPD mounting surface that extends substantially transverse relative to a LD mounting surface, with the result being that a MPD coupled to the vertical MPD mounting surface gets positioned above an associated LD coupled to the LD mounting surface. The vertically-mounted MPD thus makes regions adjacent an LD that would otherwise be utilized to mount an MPD available for patterning of conductive RF traces to provide an RF driving signal to the LD. The conductive RF traces may therefore extend below the vertically-mounted MPD to a location that is proximate the LD to allow for relatively short wire bonds therebetween.

Transmitter optical subassembly arrangement with vertically-mounted monitor photodiodes

The present disclosure is generally directed to a multi-channel TOSA with vertically-mounted MPDs to reduce TOSA housing dimensions and improve RF driving signal quality. In more detail, a TOSA housing consistent with the present disclosure includes at least one vertical MPD mounting surface that extends substantially transverse relative to a LD mounting surface, with the result being that a MPD coupled to the vertical MPD mounting surface gets positioned above an associated LD coupled to the LD mounting surface. The vertically-mounted MPD thus makes regions adjacent an LD that would otherwise be utilized to mount an MPD available for patterning of conductive RF traces to provide an RF driving signal to the LD. The conductive RF traces may therefore extend below the vertically-mounted MPD to a location that is proximate the LD to allow for relatively short wire bonds therebetween.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
20200192039 · 2020-06-18 ·

A semiconductor device includes a substrate having a first surface and a second surface that have top and back relation, an insulating layer formed on the first surface of the substrate, and an optical waveguide formed on the insulating layer and formed of a semiconducting layer. A first opening is formed on the second surface of the substrate. The first opening overlaps the optical waveguide in plan view.

HERMETIC CAPSULE AND METHOD
20200119516 · 2020-04-16 · ·

A hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal lid. The semiconductor/metal lid sealed to the semiconductor/metal base by metallization so as to form a chamber including all of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient. External access to the sensitive semiconductor/polymer electrical and optical components is provided through a metallization.

TRANSMITTER OPTICAL SUBASSEMBLY WITH HERMETICALLY-SEALED LIGHT ENGINE AND EXTERNAL ARRAYED WAVEGUIDE GRATING
20200073052 · 2020-03-05 ·

In general, a TOSA consistent with the present disclosure includes a light driving circuit coupled to a hermetically-sealed light engine. The hermetically-sealed light engine includes a housing defined by a plurality of sidewalls. The housing defines a cavity that is hermetically-sealed to prevent introduction of contaminants that would otherwise reduce optical power. The hermetically-sealed light engine optically couples to an external arrayed waveguide grating (AWG), or other multiplexing device, by way of an optical receptacle. The optical receptacle can include a waveguide implemented external to the hermetically-sealed cavity and can include, for instance, an optical isolator, fiber stub, and fiber ferrule section. Thus, the external AWG and associated external optical coupling components advantageously allow for the hermetically-sealed light engine to have a cavity with dimensions relatively smaller than other approaches that dispose an AWG and associated components within a hermetically-sealed cavity.

Hermetic capsule and method for a monolithic photonic integrated circuit
10574025 · 2020-02-25 · ·

A hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal lid. The semiconductor/metal lid sealed to the semiconductor/metal base by metallization so as to form a chamber including all of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient. External access to the sensitive semiconductor/polymer electrical and optical components is provided through a metallization.

EMBEDDED HERMETIC CAPSULE AND METHOD
20190278036 · 2019-09-12 · ·

An embedded hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal embedded lid. The semiconductor/metal embedded lid sealed to the semiconductor/metal base by metallization so as to form a chamber including at least one of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient in an embedded hermetic capsule. External access to the sensitive semiconductor/polymer electrical and optical components is provided through the metallization.

HERMETIC CAPSULE AND METHOD
20190237930 · 2019-08-01 · ·

A hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal lid. The semiconductor/metal lid sealed to the semiconductor/metal base by metallization so as to form a chamber including all of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient. External access to the sensitive semiconductor/polymer electrical and optical components is provided through a metallization.

System and method for using hollow core photonic crystal fibers

Disclosed herein are systems and methods related to use of hollow core photonic crystal fibers. A system includes a tube and a collimating lens configured in a first end of the tube, wherein a single mode fiber is coupled to a first end of the collimating lens. A second lens is supported by a structure at a second end of the tube, the second lens receiving a first signal from a second end of the collimating lens and outputting a second signal that is coupled into a first end of a hollow core photonic crystal fiber. A first gas tube is configured to introduce gas through the structure into a chamber and a sealant seals at least one of the collimating lens and the structure within the tube. An output signal is received at a detector that catches the entire beam to suppress multiple-mode beating noise.

Flexible hermetic package for optical device

An opto-electronic package having two enclosures in which a first non-hermetic enclosure provides the structural rigidity required to maintain the alignment of the optical components for a predetermined environmental range, and second flexible enclosure that provides a hermetical seal for the opto-electronic package.