An object is to be capable of housing an optical fiber that connects between components not to exceed a bending limit of the optical fiber in a housing of a pluggable optical module. A pluggable electric connector (11) is configured to be insertable into and removable from an optical communication apparatus (93). An optical output module (12) outputs an optical signal (LS1) and a local oscillation light (LO). An optical reception module (13) outputs a communication data signal (DAT) generated by demodulating using the local oscillation light (LO). A pluggable optical receptor (15) is configured in such a manner that optical fibers are insertable thereinto and removable therefrom. A first optical fiber (F11) is connected between the optical output module (12) and the pluggable optical receptor (15). A second optical fiber (F12) is connected between the optical output module (12) and the optical reception module (13). A third optical fiber (F13) is connected between the optical reception module (13) and the pluggable optical receptor (15). Optical fiber housing means winds extra lengths of the first to third optical fibers (F11 to F13) around a guide.

An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule. The master microprocessor processes a low-speed digital signal transmitted from the co-packaged integrated optoelectronic module to the outside, monitors operation of the co-packaged integrated optoelectronic module, and performs initialization of the co-packaged integrated optoelectronic module.

A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a semiconductor substrate, a conductive structure and at least one via structure. The conductive structure is disposed on an upper surface of the semiconductor substrate. The at least one via structure is disposed in the semiconductor substrate. A portion of the at least one via structure extends beyond the conductive structure.

To provide an optical waveguide device in which damage to a thin plate, particularly damage to an optical waveguide, is prevented. An optical waveguide device includes: a thin plate 1 that has an electro-optic effect and that has a thickness of equal to or thinner than 10 μm, an optical waveguide 2 being formed on the thin plate; and a reinforcing substrate that supports the thin plate, in which the thin plate 1 has a rectangular shape in a plan view, a dissimilar element layer 3, in which an element different from an element constituting the thin plate is disposed in the thin plate, is formed on at least a portion between an outer periphery of the thin plate and the optical waveguide 2, and a total length over which a cleavage plane of the thin plate traverses a region where the dissimilar element layer is formed, is equal to or longer than 5% of a width of the thin plate in a short side direction.

An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

This application relates to a light source module applied to an optical communication device. The light source module includes a substrate, a light source, an electrical interface, a first optical interface, and a second optical interface. A connection between the light source module and the optical communication device is a detachable connection, and the light source and the electrical interface are disposed on the substrate. The electrical interface is configured to supply power to the light source, and the first optical interface is configured to output continuous light emitted by the light source and/or receive a first optical signal from the optical communication device. The second optical interface and the first optical interface are on different sides, and the second optical interface is configured to receive a second optical signal from an outside of the optical communication device and/or the first optical signal sent by the first optical interface.

Technologies for chip-to-chip optical data transfer are disclosed. In the illustrative embodiment, microLEDs on a first chip are used to send data to microphotodiodes on a second chip. The beams from the microLEDs may be sent to the microphotodiodes using an optical bridge, microprisms, a channel through a substrate, a channel defined in a substrate, etc. The microLEDs may be used for high-speed data transfer with low power usage. A chip may include a relatively large number of microLEDs and/or microphotodiodes, allowing for a large bandwidth connection. MicroLEDs and microphotodiodes may be used to connect different parts of the same chip, different chips on the same package, different packages on the same device, or different chips on different devices.

An optical fiber holding structure includes: a structure main body having a prismatic shape; a through hole into which an optical fiber is inserted; a protruding portion having a columnar shape projecting from the structure main body and configured to be inserted into an opening portion of a substrate; and a contact portion configured to abut on a surface of the substrate to position an optical element and the optical fiber at a predetermined distance. The through hole is formed so as to penetrate from a surface of the structure main body through which the optical fiber is inserted to an end surface of the protruding portion, and at least one side surface of the structure main body is flush with at least one side surface of the protruding portion.

An optical transceiver that includes a housing, an inner ceiling, and an outer ceiling. The housing includes sides and a bottom. The inner ceiling is assembled with the housing; while, the outer ceiling is fit with the housing. The outer ceiling, which forms a cavity accompanied with the housing, is fastened with the inner ceiling by a screw inserted into a screw hole.