A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

Systems, methods, and apparatus for a data bus-in-a-box (BiB) are disclosed. The system involves an electrical box, and at least one optical connector located on the box. The system further involves at least one mother board housed inside of the box, and comprising a transmit side comprising at least one transmit optical media converter (OMC) tile, and a receive side comprising at least one receive OMC tile. Also, the system involves first receive optical fibers that are each connected from at least one receive OMC tile to a receive coupler; and a second receive optical fiber connected from the receive coupler to one of the optical connectors. Further, the system involves first transmit optical fibers that are each connected from at least one transmit OMC tile to a transmit coupler; and a second transmit optical fiber connected from the transmit coupler to at least one of the optical connectors.

A device may include a first substrate. The device may include an optical source. The optical source may generate light when a voltage or current is applied to the optical source. The optical source may be being provided on a first region of the first substrate. The device may include a second substrate. A second region of the second substrate may form a cavity with the first region of the first substrate. The optical source may extend into the cavity. The device may include an optical interconnect. The optical interconnect may be provided on or in the second substrate and outside the cavity. The optical interconnect may be configured to receive the light from the optical source.

A cable adapter or connector for an ATEM camera converter includes a bracket secured to at least two holes on a bottom of the ATEM camera converter. Also included is at least a Neutrik opticalCON® fiber chassis connector secured to a cut-out in the bracket by at least two rivets. Two dual ST chassis connectors or dual FC chassis connectors are installed in the cut-out of the bracket using one or more wide nuts with one or more lock-washers. There is also one or more fiber optic cables that terminate with at least one of the Neutrik opticalCON® or dual ST or dual FC chassis connectors. The fiber optic cables terminated with either Neutrik opticalCON®, dual ST or dual FC connectors may be used with the camera converter.

Realized is a bonding method which makes it possible to cause an angle formed between a front surface of an optical element and an upper end surface of a housing side wall to accurately match a design objective value. The bonding method includes the steps of (a) placing an optical element (12) on a jig (2) so that a front surface (12a) of the optical element (12) is in surface contact with a first flat surface (23a) of the jig'(2); and (b) placing a housing (11) on the jig (2) so that (i) an upper end surface (11a1) of a side wall (11a) of the housing (11) is in surface contact with a second flat surface (21a) of the jig (2) and (ii) a bottom plate (11b) of the housing (11) is in contact with a back surface (12h) of the optical element (12) via an adhesive (15).

An optical device for implementing passive alignment of parts and a method therefor, more particularly an optical device and a method therefor that utilize an alignment reference part arranged on the substrate to passively align an optical element part with a lens-optical fiber connection part. For the passive alignment of parts, connection pillars of an alignment reference part are coupled to substrate holes, one or more light-emitting elements and one or more light-receiving elements are aligned in a row in a particular interval with respect to alignment holes arranged opposite each other in the alignment reference part, a lens-optical fiber connection part is aligned with respect to the alignment holes, and an optical fiber is aligned with the optical alignment point at a surface of a prism forming a portion of the lens-optical fiber connection part.

Plastic optical fiber data communication links. Particularly, plastic optical fiber data communication links for embedded applications. More particularly, unique packaging approaches to constructing a very small, low cost, but high performance optical link, which may operate at 1 gigabits per second (Gbps) or faster.

An optical transmission apparatus includes a substrate and a heatsink. The substrate is a substrate on which multiple light sources and a heat generating part are mounted. The heatsink includes a base portion, a fin portion, and multiple light guiding paths. The base portion is arranged on a surface of the heat generating part on an opposite side to the substrate. The fin portion rises up from a surface of the base portion on an opposite side to the heat generating part. The multiple light guiding paths are formed inside the base portion, and guide lights emitted by the multiple light sources to multiple output destinations corresponding to the multiple light sources.

A silicon interposer. The silicon interposer including: a silicon layer, including one or more optical waveguides each connectable to an optical fiber; an optically active component, configured to convert optical signals received from the optical fiber into electrical signals or to convert electrical signals into optical signals and provide them to the optical fiber; and one or more electrical interconnects, connected to the optically active component and connectable to a printed circuit board, a separate die, a separate substrate, or a wafer level package.

Daughter card assembly including a circuit board and leading and trailing connectors mounted to the circuit board. The leading and trailing connectors have mating ends that face in different directions along a board plane. The daughter card assembly also includes a support wall that is coupled to the circuit board and extends orthogonal to the circuit board. The support wall has a wall opening therethrough. The trailing connector is positioned on the circuit board such that the mating end substantially aligns with the wall opening. The daughter card assembly also includes a retention shroud that projects from an exterior surface of the support wall. The retention shroud defines a shroud passage that aligns with the wall opening. The shroud and wall openings form a receiving passage for receiving at least one of the trailing connector or a corresponding cable connector that mates with the trailing connector.