A power and optical fiber interface system includes a housing having an interior. A cable inlet is configured to receive a hybrid cable having an electrical conductor and an optical fiber. An insulation displacement connector (IDC) is situated in the interior of the housing configured to electrically terminate the conductor, and a cable outlet is configured to receive an output cable that is connectable to the IDC and configured to output signals received via the optical fiber.

An optical module includes at least one optical sub-assembly; at least one control circuit configured to control the at least one optical sub-assembly; and a housing including a first case and a second case, wherein the optical module is configured to be plugged in and unplugged from an optical transmission equipment including a heat sink provided at a joining portion with the first case, wherein, through fitting of the first case and the second case, the housing accommodates the at least one optical sub-assembly and the at least one control circuit inside the housing, and wherein a material of the first case has a thermal conductivity higher than a material of the second case.

Related to is the technical field of connectors and disclosed are a connector and a connector assembly. The connector includes a connector body, a heatsink and a light guide, where the connector body is provided with a limit member, the heatsink is disposed on an upper surface of the connector body and is provided with multiple heatsink clips spaced apart from each other and arranged side by side, the light guide is disposed on the connector body, and the limit member is configured to support the light guide. The connector assembly includes the connector described above and a docking connector plug-in fitted with the connector.

A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.

In order to simplify mounting and cabling of optoelectronic plug connectors (3, 3′) and—equipped therewith—subdistribution units (6) and subdistribution systems, the use of special module housings (100) is proposed. The latter can accommodate a plurality of, in particular eight, identical and/or different optoelectronic transducers (2, 2′) and are installed in the plug connectors (3, 3′) between the electrical plug contacts (311) and the multi-core optical cables (58), i.e. the cores (51) thereof. Susceptibility to errors is considerably improved as a result and mounting is significantly simplified as a result of the improved clarity.

An optical port shielding and fastening apparatus is configured to be installed in the optical module. The optical module includes a housing assembly and an optical component located in the housing assembly. The optical port shielding and fastening apparatus includes a fastener and an electromagnetic wave absorbing piece. The fastener is fastened in the housing assembly. The electromagnetic wave absorbing piece is fastened on a side that is of the fastener and that faces an outside of the housing assembly. A first mounting hole and a second mounting hole are correspondingly provided on the fastener and the electromagnetic wave absorbing piece. The optical component passes through the first mounting hole and the second mounting hole in sequence. This application provides an optical port shielding and fastening apparatus, an optical module, and a communications device, to resolve poor optical port shielding performance of an optical module in the related technology.

The present disclosure generally relates to devices, which may be used in communication or optoelectronic modules for example, suitable for arrayed positioning of a plurality of fiber optical components. In one form, an optoelectronic module includes a printed circuit board (PCB) and at least one optical component array device including an array of laterally or radially spaced receptacles configured to receive an optical component. One or more of the receptacles includes a fused fiber optical component positioned therein. A recursive fiber may extend between an output of a first fused fiber optical component and an input of a second fused fiber optical component, and an optical fiber routing member may be coupled to the PCB and include a plurality of guides extending away from the PCB and defining a pathway for routing optical fibers relative to the PCB.

The module device assemblies and systems described herein provide for increased cooling airflow through electronic devices via airflow channels. The module device assemblies also prevent radiation or other noise from emitting through the device assemblies using electromagnetic compatibility (EMC) shields.

A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.

Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.