To provide an optical device which enables both (i) suppression of an increase in production cost and (ii) suppression of an increase in optical loss which increase is caused in accordance with a change in temperature of an external environment.

In the optical device, a holding member and an optical fiber are bonded and fixed to each other via a first resin layer which is provided between a holding surface of the holding member and a surface of the optical fiber, and the substrate waveguide and the holding member are bonded and fixed to each other via a second resin layer which is provided between an upper surface of the substrate waveguide and a region (bonding surface 31) of a lower surface of the holding member which region is outside the holding surface.

An electronic component containing package includes a substrate including a placement region for placing an electronic component in an upper face thereof; a frame disposed on the upper face of the substrate surrounding the placement region, and including a penetration part opening; and an input/output member disposed in the frame closing the penetration part, including a plurality of wiring conductors which extend inward and outward of the frame and are electrically connected to the electronic component. The input/output member includes via conductors which are connected to the wiring conductors and embedded at sites overlapping with the wiring conductors within a region surrounded by the frame in the input/output member, and a ground layer disposed in a surrounding of lower ends of the via conductors being spaced from the via conductors. Improved high frequency characteristics can be achieved.

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.

An optical element-including opto-electric hybrid board includes an opto-electric hybrid board including an optical waveguide and an electric circuit board in order toward one side in a thickness direction, an optical element mounted on the electric circuit board at one side in the thickness direction of the opto-electric hybrid board, and a bonding member interposed between the optical element and the electric circuit board so as to bond the optical element to the electric circuit board. A thermal expansion coefficient of the bonding member is 80 ppm or less

A thermal compensator, for use in connection with arrayed waveguide grating (AWG) modules which are, in turn, utilized in conjunction with wavelength multiplexing and de-multiplexing within optical networks, is disclosed. The thermal compensator comprises a bow-shaped frame member, a central bar member, and a screw. The bow-shaped frame member is characterized by a higher or great coefficient of thermal expansion (CTE) than that of the central bar member such that the bow-shaped frame member can expand and elongate at a greater rate than can the central bar member under hot temperature conditions, however, under cold temperature conditions, the rate of contraction of the bow-shaped member is effectively retarded by the slower rate of contraction of the central bar member. The bow-shaped frame member is adapted to be attached to a movable section of an athermal arrayed waveguide grating (AAWG) module such that the expansion and contraction movements of the bow-shaped member influence the movement of a movable section of the athermal arrayed waveguide grating (AAWG) module in order to maintain the proper focus of the athermal arrayed waveguide grating (AAWG) module across disparate temperature conditions within which the athermal arrayed waveguide grating (AAWG) module is designed to operate.

The disclosed technology is directed to a fixing unit of a light guide member. The fixing unit is attaching the light guide member to a protective member that protects outer circumference of the light guide member that guides primary light and a holding member. The fixing unit comprises a defining member forming a spatial region in which the protective member and the holding member are encapsulated separately from one another in a longitudinal axis direction of the fixing unit. An adhesive that is applied in the spatial region to bond at least part of the protective member and at least part of the holding member to the defining member. The defining member includes a specific region that defines a bonding range of the adhesive in the spatial region in at least one of a longitudinal axis direction and a radial direction of the defining member.

A coupled optic system is disclosed. The coupled optic system includes an optic system. The optic system includes a frame, one or more interface lenses, a lid, and one or more frame alignment surfaces. The coupled optic system further includes an optical connector. The optical connector includes one or more connector lenses, an optical connector holder, and one or more holder alignment surfaces. The optic system is configured to be removably couplable to the optical connector, and the one or more frame alignment surfaces are configured to be removably couplable to the one or more holder alignment surfaces.

The present disclosure provides an optical waveguide connection assembly and an optical module including the optical waveguide connection assembly. The optical waveguide connection assembly includes a holder, an optical fiber, a connection member and an optical coefficient adjusting member. The holder has a first part and a second part. The first part is positioned a side of the optical element, the second part is positioned above the optical element. The optical fiber is fixed to the first par. The connection member is provided between the second part and the optical element. The optical coefficient adjusting member is provided between the optical fiber and the optical element, so that a beam is capable of being transferred between the optical fiber and the optical element via the optical coefficient adjusting member. The optical waveguide connection assembly is fixed to the optical element via the connection member and the optical coefficient adjusting member.

An optical module includes: a base having a predetermined product of a coefficient of linear expansion and a Young's modulus; a planar lightwave circuit element mounted on the base; and a warpage suppression component, which is mounted on a surface of the planar lightwave circuit element, the surface being on a side opposite to a side where the planar lightwave circuit element is mounted on the base, having a product of a coefficient of linear expansion and a Young's modulus that reduces warpage of the planar lightwave circuit element in accordance with warpage of the base depending on temperature change.