A chip-scale transceiver includes an interposer having microspring electrical contacts disposed on the interposer substrate. At least one electronic chip and at least one optoelectronic chip are electrically coupled to the interposer through the microsprings. The electronic chip includes at least one of an amplifier array and a laser driver array. First electrical contact pads arranged to make electrical contact with the first microsprings of the interposer. The optoelectronic chip includes at least one of a laser array and a photodetector array. Second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer are disposed on the optoelectronic chip substrate. The transceiver has an area less than or equal to 0.17 mm.sup.2 per Gbps.

The present invention provides a receptacle structure for an optical connector comprising a receptacle body, and a first housing. The receptacle body has a first end and a second end for providing optical connector inserted thereto, respectively. Two sides of the first end respectively have first flexible plate having first attaching structure. The first housing, folded by a single piece material, is a closed structure having a first through hole wherein two walls of the first housing have first coupling structure for coupling to the attaching structure when the first end of the receptacle body is inserted into the first through hole whereby the first housing is completely assembled with the receptacle body. In addition, an optical communication device having the receptacle structure is also provided in which the optical connector can be inserted into the receptacle structure for optical communication.

A pluggable optical module according to the present invention includes a pluggable electric connector configured so as to be insertable into and removable from an optical transmission apparatus, and capable of transmitting/receiving a data signal to/from the optical transmission apparatus, a drive unit configured to output first/second driving signals by amplifying the data signal, an optical signal output unit configured to output a first/second optical signal modulated according to the first/second drive signal, a light-intensity monitoring unit configured to monitor intensities of the first/second optical signals, a control unit configured to control a gain of the drive unit so as to adjust a difference between the intensities of the first/second optical signals based on a result of the monitoring by the light-intensity monitoring unit, and a pluggable optical receptor configured so that an optical fiber can be inserted thereinto and removed therefrom, and configured to output the first/second optical signals.

In one embodiment, a module for plugging into a QSFP-DD (Quad Small Form Factor Pluggable Double Density) cage is provided that has one or more projections for contacting a QSFP-DD optical module in an adjacent QSFP-DD recess of the QSFP-DD cage so as to evacuate heat from, and or provide power to, the QSFP-DD optical module.

A multimedia connector cable having a cable encasing a plurality of optical fibers. The cable having a proximal end and a distal end. The proximal end having an electrical connector in optical communication with the plurality of optical fibers. The distal end having an optical connector in optical communication with the plurality of optical fibers.

In an optical network having a terrestrial terminal and an open cable interface (OCI) connecting a submarine cable to a terrestrial cable, the OCI may include a filter positioned on an optical path between the terrestrial cable and the submarine cable and configured to pass first communication signals of a first frequency band, and filter out secondary signals of a second frequency band that does not overlap with the first frequency band. The secondary signals may be looped back to the terrestrial terminal. The terrestrial terminal may detect the looped back secondary signals, and in response, determine the presence of the OCI and that the supervisory signals were rerouted by the OCI.

An optical transceiving device includes a housing including opposite lateral surfaces, a fastening component movably disposed on the housing, and a bail assembly including a carrier, a handle and a securing structure. The fastening component includes a linkage arm and two extending arms connected with the linkage arm. The two extending arms configured to be detachably fastened with a cage. The carrier is fixed to the fastening component. The carrier and the linkage arm jointly define an accommodation space having an opening. The handle is disposed on the carrier and movable along a release direction to be at either a close position or an open position. The handle is held in the accommodation space by the securing structure when at the close position. The handle protrudes from the opening when at the open position, and brings the fastening component to move together.

A computing device, comprising: a chassis; an optical base layer, including optical connectors; a power base layer, including power connectors; a thermal base layer, including a cold supply line with liquid disconnects, hot return lines with liquid disconnects, and thermal infrastructure interfaces; a radio frequency base layer, including radio frequency connectors; a power interface, wherein the power interface connects to the power base layer; a power supply to connect to the power interface and provide power to the power base layer through the power interface; and bays defined by bay divider walls, wherein each bay divider wall is removable and each bay comprises one of the optical connectors, one of the power connectors, one liquid disconnect for the supply line, one of the liquid disconnects for a hot return line, and one of the radio frequency connectors.

A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G). Fixed terminal portions of a plurality of contact terminals (32ai) connected to the contact pads (20B2 and 20B3) conducting to the transmission-side high-speed signal lines (S) and the contact pads (20B9 and 20B10) conducting to the receiving-side high-speed signal lines (S) in a host connector (30) are electrically connected to conductive paths (16THL, 16RHL), which are continuous with high-speed signal lines formed on a plane shared with electrode portions (16BE2, 16BE3, 16BE9, and 16BE10) via the electrode portions (16BE2, 16BE3, 16BE9, and 16BE10) of a printed wiring board (16).

An I/O connector assembly configured for making a cabled connection to an interior portion of a printed circuit board for signals passing through the connector. The assembly may include a receptacle connector, a cage and cables, terminated to conductive elements of the terminal subassemblies, extending through the cage to the midboard. The terminal subassemblies may have first type conductive elements configured for mounting to the printed circuit board and second type conductive elements configured for terminating cables. Features may be included for precise positioning of the receptacle connector formed with the terminal subassemblies relative to the cage such that connector to connector variation in the positioning of the contact portions of the conductive elements in the terminal subassembly is provided. A mating plug may be designed with low wipe, which improves high frequency performance of the mated connector system.