A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.

An object is, in a pluggable optical module, to compactly house an optical fiber used for connecting optical components in a housing in which a plurality of optical components are mounted. The pluggable optical module (100) includes: a plurality of optical components, a printed circuit board (51); one or more optical fibers; and optical fiber housing means (14). All or a part of the plurality of optical components are mounted on the printed circuit hoard (51). One or more optical fibers connect between the plurality of optical components. The optical fiber housing means (14) includes a guide that is disposed on a plate-like member and can wind the one or more optical fibers, and mounted to he stacked with the printed circuit board (51) on which the optical components are mounted and all or a part of optical components other than the optical components mounted on the printed circuit board (51).

Systems, methods, and apparatus for a data bus-in-a-box (BiB) are disclosed. The system involves an electrical box, and at least one optical connector located on the box. The system further involves at least one mother board housed inside of the box, and comprising a transmit side comprising at least one transmit optical media converter (OMC) tile, and a receive side comprising at least one receive OMC tile. Also, the system involves first receive optical fibers that are each connected from at least one receive OMC tile to a receive coupler; and a second receive optical fiber connected from the receive coupler to one of the optical connectors. Further, the system involves first transmit optical fibers that are each connected from at least one transmit OMC tile to a transmit coupler; and a second transmit optical fiber connected from the transmit coupler to at least one of the optical connectors.

A receptacle includes a cooling channel that is positioned between a top port and a bottom port. A transfer member is positioned in the cooling channel and is configured to direct heat from an inserted plug module into the cooling channel. Air flowing through the cooling channel acts to remove thermal energy from the receptacle. A connector system may include a plug module that can be inserted into such a receptacle and the plug module can include grooves to help allow for direct cooling of the plug module, even when inserted into the receptacle.

A connector provided on a projector has an RF chip. A plug connected to the connector has an RF chip at a position opposite to the RF chip of the connector. When a protruding section of the plug is inserted and fit into an aperture section of the connector, the RF chip of the plug and the RF chip of the connector perform wireless communication with each other in a non-contact state. Thus, a connecting tool can be easily attached to/detached from a receiving tool without breaking a terminal due to contact such as in a case where a conventional contact type terminal is used.

Plastic optical fiber data communication links. Particularly, plastic optical fiber data communication links for embedded applications. More particularly, unique packaging approaches to constructing a very small, low cost, but high performance optical link, which may operate at 1 gigabits per second (Gbps) or faster.

An optical communications system and a pluggable optical communications module for use in the system are provided. The configuration of the pluggable optical communications module is such that no optical turn in any light path is required. Embodiments of the optical communications module include an EMI shielding solution and an electrical interface for electrically interfacing an electrical subassembly (ESA) of the module with a system printed circuit board (PCB) in a way that obviates the need for an optical turn.

Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

An optical source that implements a wavelength tunable laser diode (t-LD) and a Mach-Zehnder (MZ) modulator within a single package is disclosed. The optical source, which outputs a modulated signal beam and a local beam of a continuous wave (CW), accompanies a control circuit mounted on several circuit boards. Only one of the circuit boards is rigidly mounted on the housing of the optical source. Rest of the circuit boards is moderately fixed to the housing through the rigidly fixed circuit board to suppress stresses caused in the housing and the circuit boards when the optical source is rigidly installed in the host system.

A method for setting a pluggable optical transceiver, includes: amplifying, with an amplifier, an electrical signal being input to the pluggable optical transceiver from an external device to which the pluggable optical transceiver is mounted, and outputting the amplified electrical signal as a drive signal of an optical modulator; modulating light input from a light source with the optical modulator, based on the drive signal, and outputting the modulated light; monitoring amplitude of the drive signal; and executing a control sequence being set in advance for at least one of the amplifier and the optical modulator when detecting that amplitude of the drive signal exceeds a reference value being set in advance.