The present disclosure describes active optical cable assemblies. A cable assembly includes a fixed active optical connector having a transceiver, a ruggedized optical fiber cable integrated with the fixed active optical connector, a main cable assembly comprising one or more optical fiber cables, wherein the ruggedized cable is spliced to the main cable assembly; and a removable shroud configured to surround at least a portion of the fixed active optical connector plugged into a remote radio unit and to be secured to a remote radio unit. Active optical cable and remote radio unit systems are also described.

Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance H.sub.1 between the pair of strip conductors and the ground conductor layer is twice or more a distance H.sub.2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.

An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.

An interconnect for a semiconductor device includes: a carrier; a UV programmable chip mounted on the carrier using a first array of solder connections; a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip; and a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source.

In one embodiment, an optical transceiver includes: a photonic integrated circuit (PIC) formed on a semiconductor die having a first side and a second side opposite the first side, where the first side includes a first optical circuit and a second optical circuit and the second side is to electrically couple with a substrate. The PIC may further have one or more through silicon vias (TSVs) formed through the semiconductor die to electrically couple the first side with the second side, where at least one of the TSVs is to enable electrical coupling between a first other die adapted to the first side and a second other die. Other embodiments are described and claimed.

A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace.

A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace.

A computing device, comprising: a chassis; an optical base layer, including optical connectors; a power base layer, including power connectors; a thermal base layer, including a cold supply line with liquid disconnects, hot return lines with liquid disconnects, and thermal infrastructure interfaces; a radio frequency base layer, including radio frequency connectors; a power interface, wherein the power interface connects to the power base layer; a power supply to connect to the power interface and provide power to the power base layer through the power interface; and bays defined by bay divider walls, wherein each bay divider wall is removable and each bay comprises one of the optical connectors, one of the power connectors, one liquid disconnect for the supply line, one of the liquid disconnects for a hot return line, and one of the radio frequency connectors.

An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.

An optical port shielding and fastening apparatus is configured to be installed in the optical module. The optical module includes a housing assembly and an optical component located in the housing assembly. The optical port shielding and fastening apparatus includes a fastener and an electromagnetic wave absorbing piece. The fastener is fastened in the housing assembly. The electromagnetic wave absorbing piece is fastened on a side that is of the fastener and that faces an outside of the housing assembly. A first mounting hole and a second mounting hole are correspondingly provided on the fastener and the electromagnetic wave absorbing piece. The optical component passes through the first mounting hole and the second mounting hole in sequence. This application provides an optical port shielding and fastening apparatus, an optical module, and a communications device, to resolve poor optical port shielding performance of an optical module in the related technology.