Patent classifications
G02F1/133382
DEVICE AND METHOD FOR IMPROVING RESPONSE TIME OF LIQUID CRYSTAL DISPLAY PANEL IN LOW TEMPERATURE ENVIRONMENT
The present invention relates the quality of a display device by implementing a function capable of increasing the response time of the liquid crystal in the low temperature environment by preventing deterioration in visibility on a panel surface and applying a structure capable of generating heat.
Display device
A display device includes a housing, a display panel, a light source, a first acquirer, a second acquirer, and a stabilizer. The display panel is provided in the housing. The light source is provided in the housing, and includes an LED that irradiates the display panel with light. The first acquirer acquires a first temperature in a first region including a region where the light source is disposed in the housing. The second acquirer acquires a second temperature in a second region different from the first region. The stabilizer has a first adjustment mode for lighting the LED with maximum luminance as an adjustment mode for stabilizing luminance of the LED. The stabilizer operates the LED in the first adjustment mode in a case where a temperature difference between the first temperature and the second temperature is a first threshold value or more.
DISPLAY DEVICE AND PROJECTION TYPE DISPLAY DEVICE
A liquid crystal display element includes a pixel region which optically modulates received illumination light for each pixel. A heat sink dissipates heat of the liquid crystal display element. A first mask member is fixed to the heat sink, is formed of a material having a lower heat transfer rate than the heat sink, includes a first opening of which the size corresponds to the size of the pixel region, and masks unnecessary light. A second mask member is arranged at a position further away from the liquid crystal display element than the first mask member, is fixed to the heat sink, is formed of a material having a higher heat transfer rate than the first mask member, includes a second opening of which the size is equal to or larger than the size of the first opening, and masks the unnecessary light.
WAVEGUIDE OF AN SOI STRUCTURE
A method includes forming a layer made of a first insulating material on a first layer made of a second insulating material that covers a support, defining a waveguide made of the first material in the layer of the first material, covering the waveguide made of the first material with a second layer of the second material, planarizing an upper surface of the second layer of the second material, and forming a single-crystal silicon layer over the second layer.
Smart glass for a fireplace
A fireplace with a smart glass panel and use of a smart glass panel in a fireplace are provided. The fireplace comprises a heating mechanism, and a smart glass panel positioned proximate to the heating mechanism. The smart glass panel comprising a transparent pane, where at least a portion of the smart glass panel has optic or thermal transmission properties that may be altered between a first state and a second state.
Display Device and Method for Manufacturing Cushion Plate
The present disclosure relates to a display device capable of improving heat-dissipation performance and an impact-absorbing function while reducing a non-display area. Further, the display device may improve a display quality by flattening a upper surface of a cushion plate. The cushion plate according to an embodiment of the present disclosure includes a porous substrate that has both a heat-dissipation function and a cushion function, so that the cushion plate can have the heat-dissipation function and the cushion function simultaneously with only the porous substrate without adding a separate heat-dissipation layer or cushion layer. Further, the present disclosure can flatten a upper surface of the cushion plate by placing an adhesive member including fine protrusions or a planarization film on the porous substrate.
CHIP HEAT DISSIPATION STRUCTURE AND LIQUID CRYSTAL DISPLAY DEVICE
The present invention discloses a chip heat dissipation structure and a liquid crystal display device, and the chip heat dissipation structure includes: a chip contact end and a backplate contact end. The chip heat dissipation structure is made of thermal conductive material. The backplate is a backplate on a bottom of a backlight module in the liquid crystal display device. The present invention by conducting heat generated by the chip to the backplate lowers the increased temperature of the chip to solve the issue the heated surface of the liquid crystal display device.
Display substrate, method of fabricating the same, and display panel
The disclosure provides a display substrate and a method of fabricating the same, and a display panel. The display substrate includes: a substrate; a transistor structure on the substrate; a flexible circuit board having one end coupled to the transistor structure, and the other end capable of being bent to a side of the substrate away from the transistor structure; and a blocking conductive layer on the flexible circuit board and configured to block an interference electric field in an external environment from affecting the display substrate.
DISPLAY ASSEMBLY WITH LOOPBACK COOLING
A display assembly with loopback cooling includes a housing for an electronic display where a first airflow pathway extends within the housing. An equipment storage device for electronic equipment located at a storage area within the housing. A second airflow pathway fluidly connects the storage area with the first airflow pathway. One or more fans, when activated, cause a flow of air to travel through a portion of the first airflow pathway extending rearward of the electronic display in a first direction and a portion of the flow to leave the portion of the first airflow pathway and travel through the second airflow pathway, at least initially, in a second direction.
DISPLAY MODULE WITH INTEGRATED THERMAL MANAGEMENT STRUCTURE
Described herein is a display module for an electronic device having a thermal management structure integrated on a backside of the display module. Also described herein are techniques for manufacturing a display module with an integrated thermal management structure. By integrating the thermal management structure on the backside of the display module, the display module itself becomes a passive thermal management solution for an electronic device. Accordingly, the thermal management structure described herein can be considered a part of the display component stack.