A source selection module for spectrally shaping a broadband illumination beam to obtain a spectrally shaped illumination beam. The source selection module includes a beam dispersing element for dispersing the broadband illumination beam; a grating light valve module for spatially modulating the broadband illumination beam subsequent to being dispersed; and a beam combining element to recombine the spatially modulated broadband illumination beam to obtain an output source beam.

A method of determining a performance parameter distribution and/or associated quantile function. The method includes obtaining a quantile function prediction model operable to predict a quantile value for a substrate position and given quantile probability such that the predicted quantile values vary monotonically as a function of quantile probability and using the trained quantile 5 function prediction model to predict quantile values for a plurality of different quantile probabilities for one or more locations on the substrate.

A method for determining a mechanical property of a layer applied to a substrate. The method includes obtaining input data including metrology data relating to the layer and layout data relating to a layout of a pattern to be applied in the layer. A first model or first model term is used to determine a global mechanical property related to the layer based on at least the input data; and at least one second model or at least one second model term is used to predict a mechanical property distribution or associated overlay map based on the first mechanical property and the layout data, the mechanical property distribution describing the mechanical property variation over the layer.

A method for determining values of design variables of a lithographic process based on a predicted failure rate for printing a target pattern on a substrate using a lithographic apparatus. The method includes obtaining an image corresponding to a target pattern to be printed on a substrate using a lithographic apparatus, wherein the image is generated based on a set of values of design variables of the lithographic apparatus or a lithographic process; determining image properties, the image properties representative of a pattern printed on the substrate, the pattern corresponding to the target pattern; predicting a failure rate in printing the pattern on the substrate based on the image properties; and determining a specified value of a specified design variable based on the failure rate, the specified value to be used in the lithographic process to print the target pattern on the substrate.

Some embodiments of this disclosure can improve measurement of target mark asymmetry in metrology apparatuses for improving accuracy in measurements performed in conjunction with lithographic processes. For example, a metrology system can include a projection system configured to receive a plurality of diffraction orders diffracted from a target on a substrate. The metrology system can further include a detector array and a waveguide device configured to transmit the plurality of diffraction orders between the projection system and the detector array. The detector array can be configured to detect each of the plurality of diffraction orders spatially separate from other ones of the plurality of diffraction orders.

Systems, methods, and media for determining a processing parameter associated with a lithography process. In some embodiments, image data of features on a substrate may be obtained, and the image data may be analyzed in Fourier space. Based on the analysis, an amplitude and a phase may be determined, and an overlay of the features may be determined based on the amplitude and the phase.

A control system and method are presented for use in optical measurements on patterned samples. The control system comprises a computer system configured for data communication with a measured data provider and comprising a data processor configured and operable to receive and process raw measured data of first and second types concurrently collected from the patterned sample being measured. said first and second types of the measured data comprising, respectively. scatterometry measured data. characterized by first relatively high signal-to-noise and predetermined first relatively low spatial resolution, and interferometric measured data characterized by second relatively low signal-to-noise and predetermined second relatively high spatial resolution, said data processor being configured to process the measured data to determine pattern parameters along said patterned sample characterized by said first signal to-noise and said second spatial resolution.

Embodiments of the present disclosure generally relate to metrology systems and metrology methods to measure waveguides for image quality standards. In at least one embodiment, an optical device metrology system includes a stage, a body, and a light engine positioned within the body and mounted above the stage. The light engine includes, a light source, a fold mirror angled relative to the light source, the fold mirror is configured to turn a light beam toward the stage, one or more lenses or arrays positioned between the fold mirror and the stage, and a projection lens positioned between the one or more lenses or arrays and the stage. The system further includes, a first detector positioned within the body and mounted above the stage adjacent to the light engine configured to receive the projected light beam projected upwardly from the stage.

Process window qualification (PWQ) layouts can be used to determine a presence of a pattern anomaly associated with the pattern, patterning process, or patterning apparatus. For example, a modulated die or field can be compared to a slightly lower offset modulated die or field. In another example, the high to low corners for a particular condition or combination of conditions are compared. In yet another example, process modulation parameters can be used to estimate criticality of particular weak points of interest.

A method for processing images for metrology using a charged particle beam tool may include obtaining, from the charged particle beam tool, an image of a portion of a sample. The method may further include processing the image using a first image processing module to generate a processed image. The method may further include determining image quality characteristics of the processed image and determining whether the image quality characteristics of the processed image satisfy predetermined imaging criteria. The method may further include in response to the image quality characteristics of the processed image not satisfying the imaging criteria, updating a tuning condition of the charged-particle beam tool, acquiring an image of the portion of the sample using the charged-particle beam tool that has the updated tuning condition, and processing the acquired image using the first image processing module to enable the processed acquired image to satisfy the predetermined imaging criteria.