An apparatus for reticle sub-field thermal control in a lithography system is disclosed. The apparatus includes a clamp configured to fix an object. The clamp includes a plurality of gas distribution features that are spatially arranged in a pattern. The apparatus further includes a gas pressure controller configured to individually control a gas flow rate through each of the plurality of gas distribution features to spatially modulate a gas pressure distribution in a space between the clamp and the object. The gas distribution features include a plurality of trenches or holes arranged in an array form.

A stage assembly (10) that includes (i) a stage (14) that retains a device (26); (ii) a reaction assembly (18) that is spaced apart from the stage (14); (iii) a stage mover (16) that moves the stage (14), the stage mover (16) including a magnet array (38) that is coupled to the stage (14) and a conductor array (36) that is coupled to the reaction assembly (18); (iv) a temperature adjuster (20); and (v) a control system (22) that selectively controls the temperature adjuster (20). The conductor array (36) includes a set of first zone conductor units (250), and a set of second zone conductor units (252). The temperature adjuster (20) independently adjusts the temperature of the set of first zone conductor units (250), and the set of second zone conductor units (252).

An apparatus comprising at least one sealing aperture (40) comprising a hollow part (41), having an inner surface (42), extending at an interface between different zones (50;60) of the apparatus; and a member (43) positioned in the hollow part configured to substantially transmit EUV radiation and to substantially filter non-EUV radiation at the interface; wherein the inner surface of the hollow part has a surface treatment configured to increase absorption of the non-EUV radiation that is transferred by the member to the hollow part.

An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.

A method for thermal management of reticles for conducting an exposure process includes operations. A default state of a reticle is selected based on given data, where the given data includes overlay values of a plurality of processed semiconductor workpieces and temperature profiles of the reticle correlated to the processed semiconductor workpieces. The reticle is regulated to reach the default state before using the reticle to perform the exposure process.

Systems and methods for processing a substrate include exposing a substrate to UV light from a UV light source having a predetermined wavelength range. The substrate includes a photoresist layer that has been bombarded with ions. The method includes controlling a temperature of the substrate, while exposing the substrate to the UV light, to a temperature less than or equal to a first temperature. The method includes removing the photoresist layer using plasma while maintaining a temperature of the substrate to less than or equal to a strip process temperature after exposing the substrate to the UV light.

An immersion lithography apparatus comprises a temperature controller configured to adjust a temperature of a projection system, a substrate and a liquid towards a common target temperature. Controlling the temperature of these elements and reducing temperature gradients may improve imaging consistency and general lithographic performance. Measures to control the temperature may include controlling the immersion liquid flow rate and liquid temperature, for example, via a feedback circuit.

An apparatus including an illumination system to condition a radiation beam, a support to support a patterning device, the patterning device capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate, a projection system to project the patterned radiation beam onto a target portion of the substrate, and a control system configured to: receive pattern data characterizing a pattern distribution, receive radiation data characterizing the radiation beam, determine a dissipation distribution of the pattern based on the pattern data and the radiation data, determine deformation of the pattern by applying the dissipation distribution in a thermo-mechanical model of the patterning device, and determine a control signal to control a component of the apparatus based on the deformation of the pattern.

A lithographic apparatus includes a component and a local cooler to apply a local cooling load to the component. The local cooler has a gas passageway including a flow restriction upstream of the component and configured to direct a flow of gas exiting the flow restriction to cool a surface of the component.

A pump includes a collecting duct to guide a two-phase fluid provided with magnetic field responsive particles, a collecting duct magnet system arranged along the collecting duct and configured to generate a magnetic field in at least a part of the collecting duct, a pumping duct to guide the two-phase fluid, a pumping duct inlet being connected to a collecting duct outlet, and a pumping duct magnet system arranged along the pumping duct and configured to generate a magnetic field in at least a part of the pumping duct. A pump driver is configured to drive the collecting duct magnet system to generate a spatial repetition of collecting duct magnetic fields moving along a length of the collecting duct, and is configured to drive the pumping duct magnet system to generate a spatial repetition of pumping duct magnetic fields moving along a length of the pumping duct.