Aspects of the present disclosure relate to modular expansion systems for use in head-worn computing systems. In an head-worn computer, an electrical connector is adapted to electrically connect with a modular expansion module, wherein the modular expansion module adds a capability to the head-worn computer and is removeably mounted to the head-worn computer, and a mount is adapted to physically secure the modular expansion module to the head-worn computer.

A touchpad device includes a substrate, a circuit board, a connection plate, a resilient member, a triggering member, a first balance bar, a second balance bar, a first swing plate, and a second swing plate. The circuit board is disposed above the substrate and includes a trigger switch. The connection plate has a hollow hole corresponding to the trigger switch. The resilient member is disposed between the substrate and the circuit board. The triggering member corresponds to the hollow hole. The first balance bar is disposed between a first side of the connection plate and the substrate, and the second balance bar is disposed between a second side of the connection plate and the substrate. The swing plates are disposed between the substrate and the circuit board and are pressable to move with respect to the substrate, thereby driving the triggering member to move toward the trigger switch.

Systems, methods, and computer-readable media are disclosed for display devices with transverse planar microphone arrays. In one embodiment, an example voice-activated device may include a housing, and a display assembly coupled to the housing, where a first vertical axis associated with the display assembly is at an acute angle relative to a second vertical axis associated with the housing. Example devices may include a number of microphone openings disposed in a front face of the display assembly, a speaker coupled to the housing and oriented to direct a portion of sound towards a rear portion of the device, and a fabric disposed over the housing, the fabric comprising an aperture disposed along the rear portion of the device.

A flexible electronic device including a flexible substrate, a plurality of first signal lines, a plurality of first transmission lines, a plurality of first through holes, and a plurality of first conductive structures is provided. The flexible substrate has a first surface and a second surface opposite to the first surface. The first signal lines are located on the first surface and have a first extending direction. The first transmission lines are located on the second surface and have a second extending direction. A first included angle is provided between the first extending direction and the second extending direction. An angle of the first included angle is between 10° and 80°. The first through holes penetrate through the flexible substrate. The first conductive structures are located in the first through holes and are electrically connected to the first signal lines and the first transmission lines.

A portable electronic device includes a housing, a display at least partially within the housing, a front cover coupled to the housing and positioned over the display, a rear cover coupled to the housing and defining a first portion of a rear exterior surface of the portable electronic device, a protrusion defining a sensor array region of the rear cover and a second portion of the rear exterior surface, and an internal surface opposite the second portion of the rear exterior surface. The portable electronic device also includes a sensor array mounted within the housing along the sensor array region and comprising a frame member coupled to the rear cover along the internal surface and defining a wall structure defining a first container region and a second container region, a camera module positioned in the first container region, and a depth sensor module positioned in the second container region and attached to the internal surface of the rear cover.

A display device includes a display panel including a front surface at which an image is displayed and a rear surface which is opposite to the front surface; a circuit board connected to the display panel and facing the rear surface of the display panel; and a heat dissipation layer between the rear surface of the display panel and the circuit board. The heat dissipation layer includes a first heat dissipation sheet electrically connected to the circuit board and a second heat dissipation sheet spaced apart from the first heat dissipation sheet in a direction along the display panel.

An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.

An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.

Techniques and apparatuses are described that implement touch sensors and electronic devices including touch sensors. In some implementations, the touch sensor includes a sensing portion and a contact portion extending from the sensing portion. While the sensing portion is configured to be placed in proximity to an interior surface of a housing of an electronic device to detect a touch on the housing, the contact portion is bent to electrically couple the sensing portion to a circuit board via two distinct electrical paths.

This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.