A method and a memory device therefor for reconfiguring a DQ pad organization of the memory device on-the-fly. A DQ organization reconfiguration control unit generates a control signal for reconfiguring the DQ pad organization into a desired mode based on a user command. A DQ organization reconfiguration unit is provided between P DQ pads and memory cell arrays and reconfigures organization P DQ pads on-the-fly in any one among Xi DQ pad modes, where i=1, 2, 4, 8, 16, 32, 64, and 128, based on the control signal. For the reconfiguration of the organization of the DQ pads, a plurality of bus lines for data transfer, being switchable by a control signal, are provided. The bus lines are implemented utilizing at least one of the M3 and M4 metal layers of the memory device.

A modular command device for electrovalve islands having: an input module selected from an input module of the parallel type or the serial type having an input connector to receive the command signals of a user and an output connector to transmit at least the command signals received; a valve command module for controlling a plurality of electrovalves including: an input connector designed to be connected directly or indirectly to the output connector of the input module; a communication BUS of the parallel type and a communication BUS of the serial type dedicated to transmitting the command signals received by the input module; an electronic processing and control unit connected to the communication BUS of the parallel type and to the communication BUS of the serial type, the electronic processing and control unit being configured to extract from the communication BUSes the command signals for the electrovalves to the control of which the valve command module is dedicated and to transmit the corresponding valve control signals to the electrovalves.

A stacking modular instrument bus device is disclosed, which includes N instrument sub-modules, N+1 customized bus connectors, a first bus termination module and a second bus termination module. The N instrument sub-modules are connected with each other in series through the N1 customized bus connectors to form an instrument sub-system, two ends of the N instrument sub-modules are respectively connected with the first bus termination module and the second bus termination module through one customized bus connector; each of the instrument sub-modules includes a bus unit and a functional unit. The present invention can freely stack and combine all the instrument sub-modules in the manner of building blocks, which is divorced from the conventional backboard type structure and becomes more flexible. Every instrument sub-module has the independent and complete instrument structure and form the system itself. The bus unit of the instrument sub-module is detached from the functional unit thereof. The present invention adopts the independent single-board design, which is more conducive to update the instrument bus system, thus saving the development time and design cost.

A system and method of implementing SLR for a USB device of an information handling system is disclosed herein. An OS may load a disk driver stack and a volume driver stack for the USB device, where the USB device is being enumerated by a first driver. The OS may load a second driver on the disk driver stack. The OS may also load second driver on the volume driver stack. The OS may restrict an access to the USB device at the second driver as loaded on the disk driver stack. Furthermore, the OS may restrict an access to a volume of the USB device at the second driver as loaded on the volume driver stack.

An apparatus includes a remote terminal unit (RTU) having one or more input/output (I/O) modules and a controller module. Each of the one or more I/O modules includes multiple I/O channels. The controller module includes at least one processing device configured to communicate with at least one industrial field device via the I/O channels of the I/O modules. The controller module includes a first connector, and a first of the one or more I/O modules includes a second connector. The first connector is configured to be physically connected to the second connector, and the first and second connectors are configured to transport data and power directly between the controller module and the first I/O module.

A PCB apparatus, a module board, and a method for function extension is disclosed. The PCB apparatus includes a substrate for PCB design, and further includes: at least one module board, integrated with a performance enhancing module; and a connector, the module board being connected to the substrate through the connector, such that the module board and the substrate perform signal transmission.

A data processing apparatus includes a first chip and a second chip that are stacked-packaged. The first chip includes a general-purpose processor, a bus, and at least one first dedicated processing unit (DPU). The general-purpose processor and the at least one first dedicated processing unit are connected to the bus. The general-purpose processor is configured to generate a data processing task. The second chip includes a second dedicated processing unit. At least one of one or more units in the at least one first dedicated processing unit and the second dedicated processing unit can process at least a part of the data processing task based on a computing function.