The invention relates to a label comprising an electronic chip for applying to a bottle of liquid, said label comprising; a first layer (S), called a support layer (S), a second layer (E), called an electronic chip layer (E), comprising at least an electronic chip and an antenna connected to the electronic chip, and a third layer (P), called customization layer (P), in which each layer (S, E, P) has two faces, and the three layers (S, E, P) are placed one above the other in a stacking direction, and in which the customization layer (P) comprises at least one sublayer (C5), called metal sublayer (C5), made of a metal material, the thickness of the metal sublayer (C5) along the stacking direction being less than or equal to 35 m.

An RFID system for selectively communicating with a targeted transponder from among a group of multiple adjacent transponders is provided. The RFID system may include a transponder conveyance system adapted to transport at least one targeted transponder from a group of multiple adjacent transponders through a transponder encoding area along a feeding direction and an antenna having a resonant inductor and a ferrite material, wherein the ferrite material at least partially covers the resonant inductor and defines an exposed portion of the resonant inductor. In one antenna-transponder alignment, the exposed portion extends substantially parallel to the feeding direction.

A tracking system comprising a tag reader comprising an interrogating antenna. One or more tags comprising an electrical energy generator configured to convert environmental energy to electrical energy. A radio frequency, RF, communication circuit. A controller configured to use the electrical energy generated by the electrical energy generator to transmit a data signal to the tag reader using the RF communication circuit.

A method of making a transaction instrument comprising making a transaction instrument by three-dimensional (3D) printing or additive manufacturing. The transaction instrument such as a transaction card may have many features or components made by or using three-dimensional (3D) printing or additive manufacturing.

Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.

Provided is a process for manufacturing a standard chip-card module comprising metallized contacts (P1-P6) defining a graphic design comprising visible parts formed from lines, segments or dots, a first portion (2A, 12A) of which passes right through the thickness of the metallized contacts (P1-P6) and a second portion (2B, 12B) of which is formed only superficially on the upper external surface of the metallized contacts (P1-P6). The second portion (2A, 12A) is produced in the continuity of the first portion, to form said graphic design. Other embodiments directed to a module resulting from the process is disclosed.

Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.

In a method for using and maintaining user data stored on a smart card, a smart card receives a user data request for the user data stored on the smart card. The smart card determines whether the user data request is a data maintenance request or a data use request. A data maintenance request is for modifying user data stored on the smart card. A data use request is for read only access to user data stored on the smart card. The smart card uses a first process to determine whether to allow the user data request when the user data request is determined to be a data maintenance request. The smart card uses a second process, different from the first method, to determine whether to allow the user data request when the user data request is determined to be a data use request.

Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.

To enhance reliability to enable use of all of a plurality of IC-chip-based applications, transmission means of an IC chip support terminal transmits, to an IC chip management server, a registration request for each of a plurality of memory areas respectively corresponding to a plurality of IC-chip-based applications for using an IC chip which is enabled to perform wireless communication. Reception means receives registration instructions for the respective memory areas, each of which is transmitted by the IC chip management server in response to the registration request. Registration means executes processes for registering the respective memory areas in the IC chip successively or in parallel based on the registration instructions. Initial setting means performs an initial setting on each of the registered memory areas when all the plurality of memory areas have been registered in the IC chip.