Embodiments of the present disclosure provide a device, system, methods and components related to a modular card. Example components of the modular card include a thin rectangular rear plate, a thin rectangular front plate overlying the rear plate, a first plurality of fasteners fixed to the thin rectangular front plate, a second plurality of fasteners fixed to the thin rectangular rear plate, the second plurality of fasteners being configured to be removably engaged with the first plurality of fasteners; a magnetic strip, and/or an integrated circuit. In operation a user may remove and/or replace various components to customize the modular card. Some customizations include altering the accounts to which the modular card relates. In some example, the modular card may include components which relate to different accounts.

Disclosed herein are an installation assembly (1), an instrument (2) and an installation method for a radio frequency identification tag. The installation assembly (1) comprises a first housing unit (11) mounted on the instrument (2) and a second housing unit (14) snapped-fitted with the first housing unit (11) to form a receiving space for receiving the radio frequency identification tag (13). The radio frequency identification tag (13) can be easily installed on the instrument (2) by snapping-fitting the first housing unit (11) with the second housing unit (14), thereby effectively enhancing installation efficiency and reliability of the radio frequency identification tag (13).

A semiconductor integrated card includes an external package, a subscriber identification module (SIM) circuit, a plurality of SIM pins, a storage device and a plurality of memory pins. The SIM circuit is formed inside of the external package and is configured to store subscriber information. The SIM pins are formed on a surface of the external package and are electrically connected to the SIM circuit. The storage device is formed inside of the external package and is separated from the SIM circuit. The storage device includes a nonvolatile memory device. The memory pins are formed on the surface of the external package and are electrically connected to the storage device.

The disclosed embodiments generally relate to transaction card constructions, and particularly, to a two-piece transaction card construction. Disclosed embodiments include a generally planar first card component including a first surface and a generally planar second card component including a second surface wherein the first card component is separate from the second card component. In disclosed embodiments, for example, the generally planar first card component and the generally planar second card component may be configured such that one forms a cavity and the other forms an inlay component configured to be seated within the cavity. In other embodiments the generally planar first card component and the generally planar second card component may be configured such that one forms a container and the other forms a lid configured to close the container.

A transaction card is disclosed. The transaction card may include a first card component of non-plastic card material having a thickness of no more than about 0.3 mm, a second card component of composite fiber material having a thickness of no more than about 0.3 mm, and an adhesive for affixing the first layer and second layer together. The non-plastic card material may be selected from a group including wood, bamboo, steel, copper, aluminum, silver, gold, platinum, granite, marble, and slate and the composite fiber material may include at least one of a glass fiber composite, a carbon fiber composite, or a natural fiber composite.

Embodiments of the present disclosure provide a device, system, methods and components related to a modular card. Example components of the modular card include a thin rectangular rear plate, a thin rectangular front plate overlying the rear plate, a first plurality of fasteners fixed to the thin rectangular front plate, a second plurality of fasteners fixed to the thin rectangular rear plate, the second plurality of fasteners being configured to be removably engaged with the first plurality of fasteners; a magnetic strip, and/or an integrated circuit. In operation a user may remove and/or replace various components to customize the modular card. Some customizations include altering the accounts to which the modular card relates. In some example, the modular card may include components which relate to different accounts.

A system may include a payment card that includes one or more chips that are operable to utilize information in a payment transaction to enact different functions. For example, a payment applet in a contact chip transaction (e.g., contact EMV transaction) or contactless chip transaction (e.g., contactless EMV transaction) may utilize information that flows through the chip (e.g., country, time, date, transaction amount, approval status) to trigger pre-stored messages or functions (e.g., switch to a payment option or account). Information may be introduced into the chip during a transaction as a result of manual input from the cardholder on the cardholder's phone or other device. Thus, transaction scripting (e.g., EMV scripting) may be utilized to let a card (e.g., static or powered) know that a function (e.g., change of account) is desired by a cardholder and the chip may, if not in the proper account, reset and restart the chip in a mode associated with the desired function (e.g., in the desired account).

A card or other device may include two or more contact chips, each contact chip associated with a different payment method.

Real time scalable loyalty processing apparatuses and/or systems operable to process up to ten thousand transactions per second and more than one billion transactions annually, and having a sub-second response time.

A detection activity of a card may be sensitive to property changes in one or more conductive pads on the card and/or information received by the card, where a processor of the card may execute a transaction indication algorithm based on detected property changes on the card, that may be caused by the card's proximity to a point-of-sale terminal and/or by information received by the card. The transaction indication algorithm may cause the processor to provide visible, audible and/or tactile indicators on the card based on the detection.