The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

A card-type medium includes: a card body; an internal component embedded in the card body; an exposed component partially exposed on a front surface of the card body; and a circuit board to which the internal component and the exposed component are bonded, wherein the circuit board includes a first connection portion to which the internal component is bonded, a second connection portion to which the exposed component is bonded, the second connection portion being located at a position different from the first connection portion in a card thickness direction connecting the front surface of the card body and a rear surface on an opposite side of the card body to the front surface, and a connection wiring portion that connects the first connection portion and the second connection portion, the connection wiring portion extending in a direction including the card thickness direction.

A die for a semiconductor chip package includes a first surface including an integrated circuit formed therein. The die also includes a backside surface opposite the first surface. The backside surface has a total surface area defining a substantially planar region of the backside surface. The die further includes at least one device formed on the backside surface. The at least one device includes at least one extension extending from the at least one device beyond the total surface area.

An RF system is provided that includes an RFID card and a reader-writer device. The RFID card includes a substrate, an RFIC element, an antenna coil, and a deformation sensor. The reader-writer device and the RFID card transmit and receive predetermined information between an antenna coil of the RFID card and an antenna coil of the reader-writer device through a magnetic field. The RFIC element transmits the first signal via the antenna coil when the deformation sensor does not detect bending deformation of the substrate, and the RFIC element transmits the second signal via the antenna coil when the deformation sensor detects the bending deformation of the substrate.

In one embodiment, a radio-frequency identification (RFID) tag including a substrate having a top surface, bottom surface, opposed end surfaces, and opposed lateral surfaces, a passive RFID integrated circuit (IC) chip mounted to the top surface of the substrate, a monopole antenna that includes a planar radiating arm that extends out from the RFID IC chip along the top surface of the substrate and a matching loop having two grounded matching stubs that surround the chip and a portion of the radiating arm, and a ground plane formed on the bottom surface, an end surface, and the top surface of the substrate, the ground plane being electrically coupled to the matching stubs and the radiating arm.

A plastic sheet for manufacturing of a plurality of smart cards which respectively include a plurality of electronic units, includes a first sheet formed of a first material having a first hardness or a first Vicat softening temperature, the first sheet including a plurality of apertures and/or cavities. The plastic sheet includes a second material having, when the first material has the first hardness, a second hardness lower than the first hardness, and when the first material has the first Vicat softening temperature, a second Vicat softening temperature lower than the first Vicat softening temperature, the second material being located inside the apertures and/or cavities in the first sheet. The apertures and/or cavities with the second material located inside the apertures and/or cavities are configured to respectively receive said electronic units via an at least partial penetration from the electronic units into the second material.

An absorbent article has one or more fluid filter layers to inhibit electrode traces from being exposed to low volumes of fluid to reduce the number of false positives that are indicated by an RFID tag of the incontinence detection pad. An antenna inlay has a sacrificial trace portion to permit testing for proper operation of an RFID chip electrically coupled to the antenna inlay. After testing, the sacrificial trace portion is severed. A fluid barrier layer blocks fluid from reaching portions of electrode traces that are located on a backsheet outside a periphery of an absorbent core of an incontinence detection pad. The power at which an antenna transmits to wirelessly energize a passive RFID tag of an incontinence detection pad is controlled to reduce the number of false positives indicated by the RFID tag.

Provided are approaches for removing a chip of a transaction card using a chip removal element. In some approaches, the transaction card may include a body including a first main side opposite a second main side, a chip coupled to the first main side of the body, and a chip removal element disposed between the chip and the body. A first end of the chip removal element may be positioned within a tab recess along the first main side of the body, wherein the chip removal element is operable to decouple the chip from the body when the chip removal element is moved away from the body.

The invention concerns a smart card comprising a microcircuit, at least one other component including a protruding component and external contacts in a card-holder. The invention is characterized in that the microcircuit (1), the protruding component (2) and the external contacts (12) form part of a subassembly (S1) fixed in a housing (C1+C2+C3) provided in part of the thickness of the card-holder, said subassembly including a support film (10) bearing on one inner surface the microcircuit (1) and at least the protruding component (2) and on one outer surface the external contacts (12), a window (11) being arranged in said film opposite part of the projecting component.