A contactless or hybrid contact and contactless chip card, includes a card body composed of a stack of layers and provided with a cavity into which an electronic module is inserted. The electronic module includes a microelectronic chip connected to an inductive or capacitive coupling means for coupling with, or a physical connection to, at least one antenna arranged in the card body. The card body comprises a metal plate forming a core and the periphery of which has at least one edge delimiting at least one recess in which the other layers of the chip card are positioned.

A “core” or “inlay” for a smartcard may comprise a first metal layer and a second metal layer, and may be formed by folding a single metal layer upon itself. A module cavity may be formed in the first metal layer by laser cutting, prior to laminating. An adhesive layer may be disposed between the two metal layers. A module opening may be formed in the second metal layer by milling, after laminating the first metal layer to the second metal layer. A slit in a metal layer may extend from an outer edge of the layer to the cavity or opening, thereby forming a coupling frame. The slit may have a termination hole at either end or at both ends of the slit. The slits of two metal layers may be positioned differently than one another.

Abstract: Embodiments of the invention are directed to a user device. A fingerprint sensor can be located adjacent to electrical contacts. As a result, both the fingerprint sensor and the electrical contacts can be directly connected to an underlying memory within the user device. The direct connection allows the user device to be free of wires.

Systems and methods are provided for assembling an RFID device mounted to a fabric substrate via a “flip chip” approach. The system includes a pin thermode with a tip configured to penetrate the fabric substrate. The pin thermode may include or omit a heating element, with the tip being variously configured. The tip may have a variable cross-sectional area or include a plurality of projections that separately penetrate the fabric substrate, for example. If the pin thermode includes a heating element, a body of the pin thermode may be formed of a low thermal conductivity material to allow the temperature of the tip to increase without increasing the temperature of the body to the same degree. The body may define a lumen, with the tip and/or body defining an aperture for flowing a liquid out of the pin thermode and into the region surrounding the pin thermode.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.

A method of making a metallic credit card from an existing plastic credit card including the steps of cutting the existing plastic credit card from each side edge, peeling the plastic top layer from its bottom plastic substrate, removing its EMV chip, and attaching it to a metallic substrate. The metallic substrate can further be laser engraved with the user's personal information. An alternate embodiment of the method of making a metallic credit card includes the steps of placing the existing plastic credit card into a metal casing, heating the metal casing and existing plastic credit card to loosen the EMV chip from the plastic layers of the credit card, cutting an incision into the side of the credit card to access and remove the EMV chip, and then attaching the EMV chip to a metallic substrate.

A switchable radio-frequency identification (RFID) tag device comprising: a first RFID module positioned on a first plane; at least one un-tuned antenna section positioned on a second plane, wherein the first plane is positioned parallel to the second plane; a second RFID module positioned on the first plane; a third RFID module positioned on the first plane; and a sliding mechanism configured to move between a first position, a second position, and a third position; and wherein, in the first position, the first RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the second and third RFID modules are detuned and/or inoperable; and in the second position, the second RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the first RFID module and third RFID module are detuned and/or inoperable; and in the third position, the third RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the first and second RFID modules are detuned and/or inoperable.

Systems and methods are provided for assembling an RFID device mounted to a fabric substrate via a “flip chip” approach. The system includes a pin thermode with a tip configured to penetrate the fabric substrate. The pin thermode may include or omit a heating element, with the tip being variously configured. The tip may have a variable cross-sectional area or include a plurality of projections that separately penetrate the fabric substrate, for example. If the pin thermode includes a heating element, a body of the pin thermode may be formed of a low thermal conductivity material to allow the temperature of the tip to increase without increasing the temperature of the body to the same degree. The body may define a lumen, with the tip and/or body defining an aperture for flowing a liquid out of the pin thermode and into the region surrounding the pin thermode.

An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor. A distance from the first electrode to the short-circuit part through conductor is shorter than a distance from the second electrode to the short-circuit part through conductor.

Methods and devices for producing artificial nails are disclosed, comprising: automatically recognizing user nail information by means of a 3D scanner (S100); recognizing a selected nail decoration design of a 2D or 3D form by means of a UV 3D printer (S200); a step in which the UV 3D printer, equipped with a device capable of adjusting a Z axis, forms a decoration layer corresponding to a curved surface of a user's nail shape with the nail decoration design recognized in step S200, on the basis of the user nail information recognized in step S100 (S300); a step in which the UV 3D printer forms an adhesive layer to be attached with the decoration layer produced in step S300; and a step of completely curing the decoration layer and the adhesive layer in a short time by subjecting same to heat treatment by using a UV lamp of the UV 3D printer, thereby printing an artificial nail in which the adhesive layer is coupled to the bottom of the decoration layer.