According to one embodiment, a memory device includes first and second wiring lines, memory cells between first and second wiring lines, first and second common wiring lines, a first selecting circuit between one ends of the first wiring lines and the first common wiring line, and a second selecting circuit between the other ends of the first wiring lines and the first common wiring line. A path between the first wiring line and the first common wiring line through the first selecting circuit and a path between the first wiring line and the first common wiring line through the second selecting circuit are defined as first and second paths, one of the first and second paths is set to an electrically conductive state.

A circuit includes an array of OTP cells, an array of NVM cells, an amplifier coupled to each of the array of OTP cells and the array of NVM cells, and a control circuit configured to generate one or more control signals. Responsive to the one or more control signals, the amplifier is configured to generate an output voltage based on a current received from the array of OTP cells in a first configuration, and generate the output voltage based on a voltage received from the array of NVM cells in a second configuration.

A magnetic shielding structure for protecting an MRAM array from adverse switching effects due to external magnetic fields of neighboring devices is provided. The magnetic shielding structure includes a bottom magnetic shield material-containing layer and a top magnetic shield material-containing layer within the MRAM array. The bottom and top magnetic shield material-containing layers can be connected by a vertical magnetic shield containing-material layer that is located near each end of the bottom and top magnetic shield material-containing layers. The bottom magnetic shield material-containing layer is located beneath a MTJ pillar of each MRAM device, but above, bottom electrically conductive structures that are in electrical contact with the MRAM devices. The top magnetic shield material-containing layer is located above the MRAM devices, and is located laterally adjacent to, but not above or below, top electrically conductive structures that are also in electrical contact with the MRAM devices.

A method to control a memory cell in a memory device, where the memory cell includes a switch, a memory element, and a negative resistance device coupled in series, the method includes: determine whether the memory cell is in a read operation or not; during the read operation in the memory cell, apply a read voltage greater than a predetermined threshold voltage of the negative resistance device for making the negative resistance device entering into a negative resistance state. A memory device that includes a memory cell array is also provided.

Memory devices have an array of elements in two or more dimensions. The memory devices use multiple access lines arranged in a grid to access the memory devices. Memory cells are located at intersections of the access lines in the grid. Drivers are used for each access line and configured to transmit a corresponding signal to respective memory cells of the plurality of memory cells via a corresponding access line. The memory devices also include compensation circuitry configured to determine which driving access lines driving a target memory cell of the plurality of memory cells has the most distance between the target memory cell and a respective driver. The plurality of access lines comprise the driving access lines. The compensation circuitry also is configured to output compensation values to adjust the voltages of the driving access lines based on a polarity of the voltage of the longer driving access line.

Example magnetic random access memories are described. One example magnetic random access memory includes a plurality of structural units and a plurality of voltage control lines. The plurality of voltage control lines are in parallel with each other. Planes in which the plurality of structural units are located are in parallel with each other, and a plane in which each of the plurality of structural units is located is perpendicular to the plurality of voltage control lines. Each structural unit includes a multi-layer storage structure including multiple layers that are stacked in sequence. Each layer of the multi-layer storage structure includes an electrode line and a plurality of storage units disposed on the electrode line. Each of the plurality of storage units includes a magnetic tunnel junction. A first end of each storage unit is connected to the electrode line, and a second end of each storage unit is connected to one of the plurality of voltage control lines.

A first memory cell includes a first variable resistance element and a first switching element. A control circuit is configured to execute first detection of detecting a first value of a first physical quantity related to the first memory cell, execute first write for storing first data in the first memory cell, execute second detection of detecting a second value of the first physical quantity related to the first memory cell following the first write, and read second data related to the first memory cell based on the first value and the second value. At least one of the first value and the second value is a value during a change in the first physical quantity related to the first memory cell.

A magnetic memory device includes a first interconnect, a second interconnect, a memory cell, and a write circuit. The memory cell is electrically coupled between the first interconnect and the second interconnect, and includes a variable resistance element and a switching element. The write circuit supplies a write voltage from the current source circuit or the voltage source circuit to write data into the memory cell. The write circuit supplies the write voltage to one of the first interconnect and the second interconnect using the voltage source circuit during a first period ranging from a first time to a second time. The write circuit supplies the write voltage to one of the first interconnect and the second interconnect using the current source circuit during a second period ranging from a third time to a fourth time.

Provided are a magnetoresistive element, a magnetic memory device, and a writing and reading method for a magnetic memory device, in which an aspect ratio of a junction portion can be decreased. A magnetoresistive element 1 of the invention, includes: a heavy metal layer 2 that is an epitaxial layer; and a junction portion 3 including a recording layer 31 that is provided on the heavy metal layer 2 and includes a ferromagnetic layer of an epitaxial layer magnetized in an in-plane direction, which is an epitaxial layer, a barrier layer 32 that is provided on the recording layer 31 and includes an insulating body, and a reference layer 33 that is provided on the barrier layer 32 and has magnetization fixed in the in-plane direction, in which the recording layer 31 is subjected to magnetization reversal by applying a write current to the heavy metal layer 2.

A memory device which includes a control logic circuit that generates a write enable signal based on a write command, a first memory cell connected with a first word line and a first column line, a first write circuit that receives first write data to be stored in the first memory cell through a first write input/output line and applies a write voltage to a first data line based on the first write data in response to the write enable signal, and a first column multiplexer circuit that selects the first column line and connects the first column line with the first data line in response to a first column select signal, such that the write voltage is applied to the first memory cell. The first write circuit applies the write voltage to a bulk port of the first column multiplexer circuit in response to the write enable signal.