A method for operating a memory device is provided. A first address is decoded to select a bit line of a memory device. A second address is decoded to select a word line of the memory device. A word line voltage is applied to the selected word line. A bit line voltage is applied to the selected bit line. A first bias voltage is applied to each of a plurality of unselected word lines connected to a plurality of memory cells connected to the selected bit line san a memory cell connected to both the selected bit line and the selected word line.

A memory device for storing data comprises a memory bank comprising a plurality of addressable memory cells, wherein the memory bank is divided into a plurality of segments. The memory device also comprises a cache memory operable for storing a second plurality of data words, wherein further each data word of the second plurality of data words is either awaiting write verification or is to be re-written into the memory bank. The cache memory is divided into a plurality of primary segments, wherein each primary segment of the cache memory is direct mapped to a corresponding segment of the plurality of segments of the memory bank, wherein each primary segment of the plurality of primary segments of the cache memory is sub-divided into a plurality of secondary segments, and each of the plurality of secondary segments comprises at least one counter for tracking a number of valid entries stored therein.

A non-volatile memory device is configured for in-memory computation of layers of a neural network by storing weight values as conductance values in memory cells formed of a series combination of a threshold switching selector, such as an ovonic threshold switch, and a programmable resistive element, such as a ReRAM element. By scaling the input voltages (representing inputs for the layer of the neural network) relative to the threshold values of the threshold switching selectors, dropout for inputs can be implemented to reduce overfitting by the neural network.

A magnetoresistive memory device according to one embodiment includes: first and second layer stacks, each of which includes: a first ferromagnetic layer having a magnetization directed in a first direction; a non-magnetic first conductive layer above the first ferromagnetic layer, a second ferromagnetic layer provided above the first conductive layer and having a magnetization directed in a second direction different from the first direction, a first insulating layer on an upper surface of the second ferromagnetic layer, and a third ferromagnetic layer above the first insulating layer. The second ferromagnetic layer of the second layer stack is thicker than the second ferromagnetic layer of the first layer stack.

A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a selector layer coupled to the first terminal.

The disclosure is directed to spin-orbit torque MRAM structures and methods. A SOT channel of the SOT-MRAM includes multiple heavy metal layers and one or more dielectric dusting layers each sandwiched between two adjacent heavy metal layers. The dielectric dusting layers each include discrete molecules or discrete molecule clusters of a dielectric material scattered in or adjacent to an interface between two adjacent heavy metal layers.

Embodiments of the present invention provide a storage cell and a data read/write method and storage array thereof. The storage cell includes a bit line, a tunnel junction, and four access transistors. Each access transistor includes at least an active region. The active region includes a source. The sources of the access transistors are all electrically connected to a first end of the tunnel junction. A second end of the tunnel junction is electrically connected to the bit line, and the bit line extends along a first direction. The active regions of the access transistors are isolated from one another. Long-side extension directions of the active regions of the access transistors are the same, and a first angle θ is formed between the long-side extension directions of the active regions and the first direction; wherein θ is a non-right angle.

Disclosed are examples of multiple bit magnetoresistive random access memory (MRAM) cells. A multiple bit MRAM cell may comprise a fixed layer, alternately stacked N tunnel barriers and N free layers, and a tunnel cap. N, which may represent number of bits of the MRAM cell, may be greater than or equal to two. Magnetic moment of the fixed layer may be fixed in one perpendicular direction. Magnetic moments of the free layers may be switchable from one to other perpendicular directions upon application of switch currents. The switch currents may be different for different layers. The magnetic moments of the free layers may be switched separately or otherwise independently of other free layers when the switch currents are applied separately.

A non-volatile memory includes resistive cells, write circuitry, and write detect circuitry. Each resistive cell has a resistive storage element and is coupled to a corresponding first column line and corresponding second column line. The write circuitry is configured to provide a write current through a resistive storage element of a selected resistive memory cell during a write operation based on an input data value. The write detect circuitry is configured to generate a reference voltage using a voltage at the corresponding first column line coupled to the selected resistive memory cell at an initial time of the write operation, and, during the write operation, after the initial time, provide a write detect signal based on a comparison between the voltage at the corresponding first column line coupled to the selected resistive memory cell and the reference voltage, wherein the input data value is based on the write detect signal.

Various embodiments of the present disclosure are directed towards a memory device. The memory device has a first transistor having a first source/drain and a second source/drain, where the first source/drain and the second source/drain are disposed in a semiconductor substrate. A dielectric structure is disposed over the semiconductor substrate. A first memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the first memory cell has a first electrode and a second electrode, where the first electrode of the first memory cell is electrically coupled to the first source/drain of the first transistor. A second memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the second memory cell has a first electrode and a second electrode, where the first electrode of the second memory cell is electrically coupled to the second source/drain of the first transistor.