A resistive-type memory device is disclosed. The resistive-type memory device includes a memory cell array and a control logic circuit. The control logic circuit accesses the memory cell array in response to a command and an address provided from an outside. The memory cell array includes at least a first group of resistive-type memory cells and a second group of resistive-type memory cells. Each of the first group of resistive-type memory cells has a first feature size and each of the second group of resistive-type memory cells has a second feature size that is different from the first feature size.

An example apparatus for writing a bit to a memory cell includes wordline driver circuitry configured to generate a first voltage in response to a row access enable signal. The apparatus also includes boost driver circuitry coupled to the wordline driver circuitry. The boost driver circuitry is configured to charge a capacitor using the first voltage and to generate a second voltage using the first voltage and a voltage at the capacitor in response to a boost enable signal. The apparatus also includes a wordline coupled to the memory cell and the wordline driver circuitry. The wordline is configured to output the first voltage or the second voltage to the memory cell.

According to one embodiment, a storage device includes first wirings extending in a first direction and second wirings extending in a second direction. A memory cells are connected between the first wirings and the second wirings and include a variable resistance memory element. A first drive circuit is provided for supplying voltages to the first wirings, and a second drive circuit is provided for supplying voltages to the second wirings. The first drive circuit applies a first voltage to a selected first wiring, the second drive circuit applies a second voltage to a selected second wiring. A voltage between the second voltage and one-half of the sum of the first and second voltages is applied to a non-selected first wiring, and a voltage between the first voltage and one-half of the sum of the first and second voltages is applied to a non-selected second wiring.

A first memory cell is coupled to first and third interconnects. A second memory cell is coupled to second and fourth interconnects. A first sense amplifier has a first terminal coupled to the first interconnect and a node of a first potential and a second terminal located close to a node of a second potential and coupled to the third interconnect and has a potential difference between the first and second terminals. A second sense amplifier has a third terminal coupled to the fourth interconnect and a node of a third potential and a fourth terminal located close to a node of a fourth potential and coupled to the second interconnect and has a potential difference between the third and fourth terminals.

A memory device includes: a cell array that includes a first region including first memory cells and a second region including second memory cells; first word lines connected to each of the first memory cells; second word lines connected to each of the second memory cells; a first bit line commonly connected to the first memory cells and the second memory cells; a row decoder that selects one of the first word lines and one of the second word lines in parallel during a data read operation; and a sense amplifier between the first region and the second region and electrically connected to the first bit line during the data read operation.

A semiconductor device includes a first memory cell array including a plurality of first memory cells, a plurality of first reference cells and a plurality of first dummy cells, a second memory cell array including a plurality of second memory cells, a plurality of second reference cells and a plurality of second dummy cells, an input/output circuit provided between the first memory cell array and the second memory cell array, a first column decoder connected between the first memory cell array and the input/output circuit and a second column decoder connected between the second memory cell array and the input/output circuit. The second column decoder connects one of the plurality of second dummy cells and the plurality of second memory cells to a selected sense amplifier of the input/output circuit, when the first column decoder connects a selected first memory cell to the selected sense amplifier.

In some embodiments, the present disclosure relates to a memory device that includes a spin orbit torque (SOT) layer arranged over a substrate. A magnetic tunnel junction (MTJ) structure may be arranged over the SOT layer. The MTJ structure includes a free layer, a reference layer, and a diffusion barrier layer disposed between the free layer and the reference layer. A first conductive wire is arranged below the SOT layer and coupled to the SOT layer. A second conductive wire is arranged below the SOT layer and coupled to the SOT layer. A third conductive wire is arranged over the MTJ structure. The memory device further includes a first selector structure arranged between the first conductive wire and the SOT layer.

A circuit includes a first transistor and a second transistor cross-coupled with each other such that a source of the first transistor and a source of the second transistor are connected to a power supply, a gate of the first transistor is connected to a drain of the second transistor at a first node, a gate of the second transistor is connected to a drain of the first transistor at a second node. The circuit can provide a first level of a word line voltage to the memory cell by directly coupling the power supply configured at a first level to the memory cell through the second transistor and a third transistor, and provide a second level of the word line voltage by directly coupling the power supply configured at a second level to the memory cell through the second transistor and the third transistor.

A memory circuit device includes multiple memory cells that are each constituted of a resistive memory element, a write circuit unit that is configured to write data to any one of the memory cells which is designated by cell designating information, and a read circuit unit that is configured to read out, from the memory cell designated by the cell designating information, data written in the memory cell. The memory circuit device has a configuration including a selection circuit unit that is shared by both of the write circuit unit and the read circuit unit and configured to select a memory cell to be activated from the multiple memory cells based on the cell designating information, and a control circuit unit that is configured to selectively enable any one of writing of data by the write circuit unit and reading of data by the read circuit unit with respect to the memory cell selected by the selection circuit unit.

Described is an apparatus including memory cell with retention using resistive memory. The apparatus comprises: memory element including a first inverting device cross-coupled to a second inverting device; a restore circuit having at least one resistive memory element, the restore circuit coupled to an output of the first inverting device; a third inverting device coupled to the output of the first inverting device; a fourth inverting device coupled to an output of the third inverting device; and a save circuit having at least one resistive memory element, the save circuit coupled to an output of the third inverting device.