Disclosed herein are transistors, memory cells, and arrangements thereof. For example, in some embodiments, an integrated circuit (IC) structure may include a plurality of transistors, wherein the transistors are distributed in a hexagonally packed arrangement. In another example, in some embodiments, an IC structure may include a memory cell including an axially symmetric transistor coupled to an axially symmetric capacitor, wherein the axis of the transistor is aligned with the axis of the capacitor.

A method for processing blocks of flash memory to decrease raw bit errors from the flash memory is provided. The method includes identifying one or more blocks of the flash memory for a refresh operation and writing information regarding the identified blocks, to a data structure. The method includes issuing background reads to the identified blocks, according to the data structure, as the refresh operation. The method may be embodied on a computer readable medium. In some embodiments the background reads may be based on a time based refresh responsive to an increase in raw bit error count in the flash memory over time.

A method for processing blocks of flash memory to decrease raw bit errors from the flash memory is provided. The method includes identifying one or more blocks of the flash memory for a refresh operation and writing information regarding the identified blocks, to a data structure. The method includes issuing background reads to the identified blocks, according to the data structure, as the refresh operation. The method may be embodied on a computer readable medium. In some embodiments the background reads may be based on a time based refresh responsive to an increase in raw bit error count in the flash memory over time.

Apparatuses, systems, and methods for refresh modes. A memory may need to perform targeted refresh operations to refresh the ‘victim’ word lines which are near to frequently accessed ‘aggressor’ word lines. To refresh the victims at a high enough rate, it may be desirable to refresh multiple victims as part of the same refresh operation. However, certain word lines (e.g., word lines in a same section or adjacent sections of the memory) cannot be refreshed together. The memory may have a section comparator, which may check stored aggressor addresses and may provide a signal if there are not two stored addresses which can be refreshed together. Based, in part, on the signal, the memory may activate one of several different refresh modes, which may control the types of refresh operation performed responsive to a refresh signal.

Apparatuses, systems, and methods for refresh modes. A memory may need to perform targeted refresh operations to refresh the ‘victim’ word lines which are near to frequently accessed ‘aggressor’ word lines. To refresh the victims at a high enough rate, it may be desirable to refresh multiple victims as part of the same refresh operation. However, certain word lines (e.g., word lines in a same section or adjacent sections of the memory) cannot be refreshed together. The memory may have a section comparator, which may check stored aggressor addresses and may provide a signal if there are not two stored addresses which can be refreshed together. Based, in part, on the signal, the memory may activate one of several different refresh modes, which may control the types of refresh operation performed responsive to a refresh signal.

A semiconductor structure includes a substrate, a drain region, a word line, a gate structure, and a first bit line. The drain region is disposed on the substrate. The gate structure is disposed on the drain region and has a portion in the word line. The first bit line is disposed on the gate structure to serve as a source region.

Techniques are provided for programming a multi-level self-selecting memory cell that includes a chalcogenide material. To program one or more intermediate memory states to the self-selecting memory cell, a programming pulse sequence that includes two pulses may be used. A first pulse of the programming pulse sequence may have a first polarity and a first magnitude and the second pulse of the programming pulse sequence may have a second polarity different than the first polarity and a second magnitude different than the first magnitude. After applying both pulses in the programming pulse sequence, the self-selecting memory cell may store an intermediate state that represents two bits of data (e.g., a logic ‘01’ or a logic ‘10’).

Some embodiments include an integrated assembly having a gate material, an insulative material adjacent the gate material, and a semiconductor oxide adjacent the insulative material. The semiconductor oxide has a channel region proximate the gate material and spaced from the gate material by the insulative material. An electric field along the gate material induces carrier flow within the channel region, with the carrier flow being along a first direction. The semiconductor oxide includes a grain boundary having a portion which extends along a second direction that crosses the first direction of the carrier flow. In some embodiments, the semiconductor oxide has a grain boundary which extends along the first direction and which is offset from the insulative material by an intervening portion of the semiconductor oxide. The carrier flow is within the intervening region and substantially parallel to the grain boundary. Some embodiments include methods of forming integrated assemblies.

Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described.

Technologies for fabricating a vertical dynamic random access memory (DRAM) structure include forming a DRAM cell hole through a word line layer and an associated substrate such that a first section of the DRAM cell hole extends through the word line layer and a second section of the DRAM cell hole extends through the substrate in vertical alignment with the first section. A pillar capacitor structure is initially formed using the second section of the DRAM cell hole, followed by the formation of a transistor using the first section of the DRAM cell hole as a channel for the transistor. Due to the use of a common DRAM cell hole, the pillar capacitor structure and the channel are in vertical alignment. The substrate is subsequently flipped and removed from the pillar capacitor structure, which is further processed to form a pillar capacitor. In some embodiments, the channel may be formed from a deposition of indium gallium zinc oxide (IGZO).