A processing device of a memory sub-system is configured to determine, for a memory unit of the memory device, a plurality of write disturb counts associated with the memory unit, wherein each of the plurality of write disturb (WD) count is associated with a corresponding write disturb direction; compute, for the memory unit, a weighted WD count reflecting the plurality of write disturb counts; determine whether the weighted WD count meets a criterion; and responsive to determining that the weighted WD count meets the criterion, perform a refresh operation on the memory unit.

A memory device includes memory cells connected to a first word-line, wherein the memory cells include a data region in which data is stored and a counting value backup region in which the number of times the first word-line is activated is backed up, a counting table for storing a first row address corresponding to the first word-line and a first counting value as a counting result of the number of times the first word-line is activated, and a comparator configured to compare the first counting value with a first backed-up counting value stored in the counting value backup region; and when the first counting value is greater than the first backed-up counting value, back up the first counting value in the counting value backup region, or when the first backed-up counting value is greater than the first counting value, overwrite the first backed-up counting value into the counting table.

A memory device includes memory cells connected to a first word-line, wherein the memory cells include a data region in which data is stored and a counting value backup region in which the number of times the first word-line is activated is backed up, a counting table for storing a first row address corresponding to the first word-line and a first counting value as a counting result of the number of times the first word-line is activated, and a comparator configured to compare the first counting value with a first backed-up counting value stored in the counting value backup region; and when the first counting value is greater than the first backed-up counting value, back up the first counting value in the counting value backup region, or when the first backed-up counting value is greater than the first counting value, overwrite the first backed-up counting value into the counting table.

A refresh counter circuit, a refresh counting method and a semiconductor memory are provided. The refresh counter circuit includes: a first signal generator that is configured to generate a first carry signal according to each of refresh pulse signals generated by a received refresh command; a second signal generator that is configured to generate a second carry signal according to a last refresh pulse signal generated by the received refresh command; a first counter that is configured to perform signal inversion according to the first carry signal and generate a first output signal; and a second counter that is configured to count the refresh command according to the second carry signal and generate a second output signal; where the refresh command generates at least two refresh pulse signals.

A memory device including: a memory cell array including memory cell rows; and a control logic circuit to perform a row, write, read, or pre-charge operation on the memory cell rows in response to an active, write, read, or pre-charge command, wherein the control logic circuit is further configured to: calculate a first count value by counting the active command and a second count value by counting the write command or the read command, with respect to a first memory cell row, during a row hammer monitor time frame; determine a type of row hammer of the first memory cell row based on a ratio of the first count value to the second count value; and adjust a pre-charge preparation time between an active operation and the pre-charge operation, by changing a pre-charge operation time point according to the determined type of row hammer.

Methods and systems for testing memory systems are disclosed. A refresh rate for a test system including a number of memory devices may be controlled based on estimated power scenario of a memory system design. In response to performance of a number of refresh operations on the memory devices and based on the refresh rate, one or more conditions of the test system may be monitored to generate estimated performance data for the memory system design.

A processing device of a memory sub-system is configured to determine a current refresh frequency associated with the memory device, the current refresh frequency specifying a rate of performing refresh operations on data stored at the memory device; compute an updated refresh frequency by updating the current refresh frequency based on a criterion reflecting a result of comparing one or more operating parameters of the memory device to their respective threshold values; and perform a refresh operation on data stored at the memory device according to the updated refresh frequency.

Methods, systems, and devices for techniques for memory error correction are described. A memory system may support a refresh with error correction code (ECC) operation. The refresh with ECC operation may be indicated in a command from a host device to a memory device, or the memory device may support executing the refresh with ECC operation autonomously, for example as part of a self-refresh operation. The refresh with ECC operation may cause the memory system to, as part of a refresh operation for a row of a memory array, perform an error correction operation on at least a portion of the row. The error correction operation may correct bit errors in a set of data before an additional bit of the set of data is corrupted. The address of the portion of the row may be determined using one or more counters associated with an ECC patrol block.

Methods, systems, and devices for techniques for memory error correction are described. A memory system may support a refresh with error correction code (ECC) operation. The refresh with ECC operation may be indicated in a command from a host device to a memory device, or the memory device may support executing the refresh with ECC operation autonomously, for example as part of a self-refresh operation. The refresh with ECC operation may cause the memory system to, as part of a refresh operation for a row of a memory array, perform an error correction operation on at least a portion of the row. The error correction operation may correct bit errors in a set of data before an additional bit of the set of data is corrupted. The address of the portion of the row may be determined using one or more counters associated with an ECC patrol block.

A semiconductor memory device is provided. The semiconductor memory device can suppress increases in power consumption. As a result, damage to the data normally caused by row problems can be prevented. The semiconductor memory device includes a control unit. The control unit controls the time interval for refreshing the memory. If the frequency of a read/write access requirement to the memory during a predetermined period is higher, then the control unit shortens the interval between memory refresh operations.