Methods, systems, and devices for voltage adjustment based on, for example, pending refresh operations are described. A memory device may periodically perform refresh operations to refresh volatile memory cells and may at times postpone performing one or more refresh operations. A memory device may determine a quantity of pending (e.g., postponed) refresh operations, such as by determining a quantity of refresh intervals that have elapsed without receiving or executing a refresh command, among other methods. A memory device may pre-emptively adjust (or cause to be adjusted) a supply voltage associated with the memory device or memory device component based on the quantity of pending refresh operations to prepare for the current demand associated with the performing the one or more pending refresh operations. For example, the memory device may increase a supply voltage associated with one or more components to prepare for performing multiple pending refresh operations.

Methods, systems, and devices for voltage adjustment based on, for example, pending refresh operations are described. A memory device may periodically perform refresh operations to refresh volatile memory cells and may at times postpone performing one or more refresh operations. A memory device may determine a quantity of pending (e.g., postponed) refresh operations, such as by determining a quantity of refresh intervals that have elapsed without receiving or executing a refresh command, among other methods. A memory device may pre-emptively adjust (or cause to be adjusted) a supply voltage associated with the memory device or memory device component based on the quantity of pending refresh operations to prepare for the current demand associated with the performing the one or more pending refresh operations. For example, the memory device may increase a supply voltage associated with one or more components to prepare for performing multiple pending refresh operations.

A method includes determining a quantity of refresh operations performed on a block of a memory device of a memory sub-system and determining a quantity of write operations and a quantity of read operations performed to the block. The method also includes determining the block is read dominant using the quantity of write operations and the quantity of read operations and determining whether the quantity of refresh operations has met a criteria. The method further includes, responsive to determining that the block is read dominant and that the quantity of refresh operations has met the criteria, modifying trim settings used to operate the block of the memory device.

A hammer refresh row address detector includes a control logic unit that receives a row address applied along with an active command, to increase a hit count stored in a corresponding entry when the row address is present in candidate aggressor row addresses stored in n entries. The control logic determines a candidate aggressor row address stored in an entry in which the hit count equals a threshold value to be a target aggressor row address. The control logic generates a victim row address adjacent to the target aggressor row address as a hammer refresh row address to accompany a hammer refresh command. The control logic increases the miss count value when the row address is not present in the candidate aggressor row addresses stored in the n entries and no hit count within the n entries is identical to the miss count value.

Disclosed herein is a method for controlling a refresh period of an extension memory pool. The method includes collecting information about each of preset unit DRAM cell sets of an extension memory pool, setting an initial refresh period for each of the DRAM cell sets, and adjusting the refresh period based on the information collected from the DRAM cell sets.

Systems and methods for multi-wordline direct refresh operations in response to a row hammer error in a memory bank. The approach includes detecting, by a row hammer mitigation component, a row hammer error in a memory bank; and then triggering, by the row hammer mitigation component, a response to the row hammer error. Further, a memory controller receives, from a mode register, data, based on an aliasing row counter policy, selecting a type of multi-wordline direct refresh operation to be performed on a plurality of victim memory rows within the memory bank, wherein the plurality of victim memory rows are dispersed across a plurality of memory sub-banks. The approach includes concurrently executing the selected multi-wordline direct refresh operation to the plurality of victim memory rows.

An energy-efficient and area-efficient, mitigation of errors in a memory media device that are caused by row hammer attacks and the like is described. The detection of errors is deterministically performed while maintaining, in an SRAM, a number of row access counters that is smaller than the total number of rows protected in the memory media device. The reduction of the number of required counters is achieved by aliasing a plurality of rows that are being protected to each counter. The mitigation may be implemented on a per-bank basis, per-channel basis or per-memory media device basis. The memory media device may be DRAM.

A memory controller combines information about which memory component segments are not being refreshed with the information about which rows are going to be refreshed next, to determine, for the current refresh command, the total number of rows that are going to be refreshed. Based on this total number of rows, the memory controller selects how long to wait after the refresh command before issuing a next subsequent command. When the combination of masked segments and the refresh scheme results in less than the ‘nominal’ number of rows typically refreshed in response to a single refresh command, the waiting period before the next command (e.g., non-refresh command) is issued may be reduced from the ‘nominal’ minimum time period, thereby allowing the next command to be issued earlier.

A semiconductor memory device includes a memory cell array including a plurality of memory cell rows, a row hammer management circuit and a refresh control circuit. The row hammer management circuit counts the number of times of access associated with each of the plurality of memory cell rows in response to an active command from an external memory controller to store the counted values in each of the plurality of memory cell rows as count data, determines a hammer address associated with at least one of the plurality of memory cell rows, which is intensively accessed more than a predetermined reference number of times, based on the counted values, and performs an internal read-update-write operation. The refresh control circuit receives the hammer address and to perform a hammer refresh operation on victim memory cell rows which are physically adjacent to a memory cell row corresponding to the hammer address.

A semiconductor chip with error detection and correction includes multiple pipes and each pipe is coupled to one or more ports on the semiconductor chip. The semiconductor chip further includes a state machine coupled to the pipes to generate a number of events consisting of read- and/or scan-type events associated with a plurality of storage elements. The state machine is implemented in hardware and can centrally detect and correct erroneous memory entries across the plurality of storage elements.