A dual-port memory cell includes first pull-up and pull-down transistors coupled at a first node between supply and reference voltage nodes, second pull-up and pull-down transistors coupled at a second node between the supply and reference voltage nodes, and first through fourth bit line landing pads in a metal layer. A first pass-gate transistor is coupled between the first bit line landing pad and the first node, a second pass-gate transistor is coupled between the second bit line landing pad and the second node, a third pass-gate transistor is coupled between the third bit line landing pad and the first node, and a fourth pass-gate transistor is coupled between the fourth bit line landing pad and the second node. The first node includes an interconnect between the first and second bit line landing pads, and the second node includes an interconnect between the third and fourth bit line landing pads.

A dual-port memory cell includes first pull-up and pull-down transistors coupled at a first node between supply and reference voltage nodes, second pull-up and pull-down transistors coupled at a second node between the supply and reference voltage nodes, and first through fourth bit line landing pads in a metal layer. A first pass-gate transistor is coupled between the first bit line landing pad and the first node, a second pass-gate transistor is coupled between the second bit line landing pad and the second node, a third pass-gate transistor is coupled between the third bit line landing pad and the first node, and a fourth pass-gate transistor is coupled between the fourth bit line landing pad and the second node. The first node includes an interconnect between the first and second bit line landing pads, and the second node includes an interconnect between the third and fourth bit line landing pads.

Disclosed herein is an apparatus for hardware metering using a memory-type camouflaged cell. The apparatus includes memory including at least one camouflaged memory cell in which a key is hidden by a designer in advance and a controller for controlling whether to block the supply of power to the memory. The controller may perform reading a key from a corresponding key location in the multiple memory cells of the memory based on key location information stored in the controller when a key is input from the outside, determining whether the key input from the outside is the same as the key read from the memory, setting an authentic flag based on the determination result, and performing control based on the set authentic flag such that the memory operates normally or the supply of power is blocked.

The present disclosure relates to a layout structure forming method of a sense amplifier and a layout structure of a sense amplifier. The method includes: providing a first active region layout structure layer, the first metal contact pattern layer includes a first metal contact pattern and a second metal contact pattern that are located on two opposite sides of the first pattern region; the first conductive wire pattern layer includes a first conductive wire pattern covering the first metal contact pattern and the second metal contact pattern; and the first connection hole pattern layer includes a plurality of connection hole designs, and the connection hole designs are connected to form a connection structure connected to the first metal contact pattern layer.

The present disclosure relates to a layout structure forming method of a sense amplifier and a layout structure of a sense amplifier. The method includes: providing a first active region layout structure layer, the first metal contact pattern layer includes a first metal contact pattern and a second metal contact pattern that are located on two opposite sides of the first pattern region; the first conductive wire pattern layer includes a first conductive wire pattern covering the first metal contact pattern and the second metal contact pattern; and the first connection hole pattern layer includes a plurality of connection hole designs, and the connection hole designs are connected to form a connection structure connected to the first metal contact pattern layer.

A method includes forming a first fin protruding from a substrate in a first region of the substrate and a second fin protruding from the substrate in a second region of the substrate, recessing a portion of the first fin, thereby forming a first recess, recessing a portion of the second fin, thereby forming a second recess, depositing a blocking layer in the second recess, growing a base epitaxial layer in the first recess, removing the blocking layer from the second recess, and growing a doped epitaxial layer in the first recess and the second recess. The base epitaxial layer is dopant free. The doped epitaxial layer abuts the first fin in the first region and the second fin in the second region.

A method includes forming a first fin protruding from a substrate in a first region of the substrate and a second fin protruding from the substrate in a second region of the substrate, recessing a portion of the first fin, thereby forming a first recess, recessing a portion of the second fin, thereby forming a second recess, depositing a blocking layer in the second recess, growing a base epitaxial layer in the first recess, removing the blocking layer from the second recess, and growing a doped epitaxial layer in the first recess and the second recess. The base epitaxial layer is dopant free. The doped epitaxial layer abuts the first fin in the first region and the second fin in the second region.

A semiconductor device, the device including: a first silicon layer including first single crystal silicon; an isolation layer disposed over the first silicon layer; a first metal layer disposed over the isolation layer; a second metal layer disposed over the first metal layer; a first level including a plurality of transistors, the first level disposed over the second metal layer, where the isolation layer includes an oxide to oxide bond surface, where the plurality of transistors include a second single crystal silicon region; and a third metal layer disposed over the first level, where a typical first thickness of the third metal layer is at least 50% greater than a typical second thickness of the second metal layer.

A floating body SRAM cell that is readily scalable for selection by a memory compiler for making memory arrays is provided. A method of selecting a floating body SRAM cell by a memory compiler for use in array design is provided.

A floating body SRAM cell that is readily scalable for selection by a memory compiler for making memory arrays is provided. A method of selecting a floating body SRAM cell by a memory compiler for use in array design is provided.