A memory device includes a memory array of memory cells and control logic operatively coupled to the memory array. The control logic to perform memory erase operations including: performing a true erase sub-operation by causing multiple pulse steps to be applied sequentially to a group of memory cells of the memory array, wherein each sequential pulse step of the multiple pulse steps occurs during a pulse-step period and at a higher voltage compared to an immediately-preceding pulse-step; in response to detecting an erase suspend command during a pulse step, suspending the true erase sub-operation at a start of a subsequent pulse-step period after the pulse step; and resuming the true erase sub-operation at an end of the subsequent pulse-step period.

An operating method of a semiconductor device including a controller and a non-volatile memory device operating under control of the controller is provided. The operating method includes determining, by the controller, whether the non-volatile memory device satisfies a block program condition; based on the non-volatile memory device satisfying the block program condition, performing a block program operation a plurality of times; and based the non-volatile memory device not satisfying the block program condition, performing an erase operation.

An operating method of a semiconductor device including a controller and a non-volatile memory device operating under control of the controller is provided. The operating method includes determining, by the controller, whether the non-volatile memory device satisfies a block program condition; based on the non-volatile memory device satisfying the block program condition, performing a block program operation a plurality of times; and based the non-volatile memory device not satisfying the block program condition, performing an erase operation.

A memory device configured to perform a program operation and a backup operation together includes a memory block including a main sub block including selected memory cells in which program data is programmed among a plurality of memory cells respectively connected to a plurality of word lines, and a backup block in which page data included in the program data is backed up, a peripheral circuit configured to perform a plurality of program loops to program the program data in the selected memory cells, and control logic configured to control the peripheral circuit to back up any one of the page data while programming the selected memory cells in preset program loops among the plurality of program loops.

A memory device configured to perform a program operation and a backup operation together includes a memory block including a main sub block including selected memory cells in which program data is programmed among a plurality of memory cells respectively connected to a plurality of word lines, and a backup block in which page data included in the program data is backed up, a peripheral circuit configured to perform a plurality of program loops to program the program data in the selected memory cells, and control logic configured to control the peripheral circuit to back up any one of the page data while programming the selected memory cells in preset program loops among the plurality of program loops.

A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.

A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.

A semiconductor memory device includes a precharge block, a select block, a peripheral circuit, and control logic. The precharge block is connected to bit lines and includes memory cells in an erase state. The select block shares the bit lines with the precharge block and includes memory cells in a program state. The peripheral circuit performs erase operation on the select block. The control logic controls the peripheral circuit to turn on a first circuit connected to the precharge block and apply first voltage to global lines connected to the first circuit when erase voltage is applied to a source line commonly connected to the precharge block and the select block. The memory cells of the precharge block are turned on by the first voltage applied from the global lines, and the erase voltage applied to the source line is transferred to the bit lines through the precharge block.

A semiconductor memory device includes a precharge block, a select block, a peripheral circuit, and control logic. The precharge block is connected to bit lines and includes memory cells in an erase state. The select block shares the bit lines with the precharge block and includes memory cells in a program state. The peripheral circuit performs erase operation on the select block. The control logic controls the peripheral circuit to turn on a first circuit connected to the precharge block and apply first voltage to global lines connected to the first circuit when erase voltage is applied to a source line commonly connected to the precharge block and the select block. The memory cells of the precharge block are turned on by the first voltage applied from the global lines, and the erase voltage applied to the source line is transferred to the bit lines through the precharge block.

A variety of applications can include memory devices designed to provide enhanced gate-induced-drain-leakage (GIDL) current during memory erase operations. The enhanced operation can be provided by enhancing the electric field in the channel structures of select gate transistors to strings of memory cells. The channel structures can be implemented as a segmented portion for drains and a portion opposite a gate. The segmented portion includes one or more fins and one or more non-conductive regions with both fins and non-conductive regions extending vertically from the portion opposite the gate. Variations of a border region for the portion opposite the gate with the segmented portion can include fanged regions extending from the fins into the portion opposite the gate or rounded border regions below the non-conductive regions. Such select gate transistors can be formed using a single photo mask process. Additional devices, systems, and methods are discussed.