A memory controller includes an interface and a control module. The interface interfaces with a memory device which includes a plurality of dies that each include a plurality of blocks. The control module groups a plurality of blocks included in different dies and manages the plurality of blocks as a super block. The control module performs scheduling to alternately perform a program on a part of an Nth super block, wherein N is a natural number, and a phased erase on an N+1st super block, and the control module completes the program on the Nth super block and the erase on the Nth super block before the program on the N+1st super block starts.

Systems, apparatus and methods are provided for performing program operations in a non-volatile storage system. In one embodiment, there is provided a method that may comprise categorizing active storage blocks of a non-volatile storage device into a robust group and a less-robust group based on a number of factors including page error count, program time and number of Program/Erase (P/E) cycles; determining that a cache program operation needs to be performed; selecting a first storage block from the robust group to perform the cache program operation; determining that a regular program operation needs to be performed; and selecting a second storage block from the less-robust group to perform the regular program operation.

Systems, apparatus and methods are provided for performing program operations in a non-volatile storage system. In one embodiment, there is provided a method that may comprise categorizing active storage blocks of a non-volatile storage device into a robust group and a less-robust group based on a number of factors including page error count, program time and number of Program/Erase (P/E) cycles; determining that a cache program operation needs to be performed; selecting a first storage block from the robust group to perform the cache program operation; determining that a regular program operation needs to be performed; and selecting a second storage block from the less-robust group to perform the regular program operation.

The abstract of the disclosure was objected to because of informality (e.g. format, reference to figures, etc.). See MPEP § 608.01 (b). Please amend the abstract to recite: Non-volatile memory device may include at least an array of memory cells. The non-volatile memory cells may include associated decoding and sensing circuitry and a memory controller. Methods for checking the erasing phase of a non-volatile device may include performing a dynamic erase operation of at least a memory block and storing in a dummy row at least an internal block variable of the dynamic erase operation and/or a known pattern.

The abstract of the disclosure was objected to because of informality (e.g. format, reference to figures, etc.). See MPEP § 608.01 (b). Please amend the abstract to recite: Non-volatile memory device may include at least an array of memory cells. The non-volatile memory cells may include associated decoding and sensing circuitry and a memory controller. Methods for checking the erasing phase of a non-volatile device may include performing a dynamic erase operation of at least a memory block and storing in a dummy row at least an internal block variable of the dynamic erase operation and/or a known pattern.

A variety of applications can include memory systems that have one or more memory devices capable of performing memory operations on multiple blocks of memory in response to a command from a host. For example, improvement in erase performance can be attained by erasing multiple blocks of memory by one of a number of approaches. Such approaches can include parallel erasure followed by serial verification in response to a single command. Other approaches can include sequential erase and verify operations of the multiple blocks in response to a single command. Additional apparatus, systems, and methods are disclosed.

Numerous embodiments are disclosed for accessing redundant non-volatile memory cells in place of one or more rows or columns containing one or more faulty non-volatile memory cells during a program, erase, read, or neural read operation in an analog neural memory system used in a deep learning artificial neural network.

A device includes a stack above a substrate in a first direction perpendicular to a surface of the substrate, the stack including conductive layers; a semiconductor layer neighboring the stack in a second direction parallel to the surface of the substrate; a memory layer between the first stack and the semiconductor layer; memory cells between the conductive layers and the semiconductor layer; a first transistor connected between one end of the semiconductor layer in a third direction parallel to the surface of the substrate and crossing the second direction and a first interconnect in the first direction; and a second transistor connected between the other end of the semiconductor layer and a second interconnect in the first direction.

A device includes a stack above a substrate in a first direction perpendicular to a surface of the substrate, the stack including conductive layers; a semiconductor layer neighboring the stack in a second direction parallel to the surface of the substrate; a memory layer between the first stack and the semiconductor layer; memory cells between the conductive layers and the semiconductor layer; a first transistor connected between one end of the semiconductor layer in a third direction parallel to the surface of the substrate and crossing the second direction and a first interconnect in the first direction; and a second transistor connected between the other end of the semiconductor layer and a second interconnect in the first direction.

A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.