A method of operating a memory system includes programming, in a memory device, K logical pages stored in a page buffer circuit into a memory cell array, reading, from the memory device, the K logical pages programmed into the memory cell array into the page buffer circuit after a first delay time elapses, transmitting, in a memory controller, N−K logical pages to the memory device, and programming, in the memory device, N logical pages into the memory cell array based on the read K logical pages and the N−K logical pages, wherein K is a positive integer and N is a positive integer greater than K.

A memory apparatus and method of operation are provided. The memory apparatus includes memory cells connected to one of a plurality of word lines including an edge word line and a plurality of other data word lines. The memory cells are disposed in memory holes organized in rows grouped in a plurality of strings. The rows include full circle rows and semi-circle rows. A control means is configured to program the memory cells connected to the edge word line and in the semi-circle rows of a first one and a second one of the plurality of strings to a predetermined one of a plurality of data states in a first program operation. The control means then selects both the first one and the second one of the plurality of strings together and programs the memory cells of the full circle rows together in a second program operation.

Methods of operating a nonvolatile memory device include performing erase loops on a memory block using a first voltage, performing program loops on memory cells of the memory block using a second voltage, and increasing the first and second voltages based on program/erase cycle information for the memory cells. The first voltage may include an erase verification voltage and the second voltage may include a program voltage.

A semiconductor memory device includes memory cell transistors and a control circuit. In a write operation, the control circuit executes multiple loops each including a program operation, a verify operation, and a bit scan operation. In the bit scan operation, the control circuit performs, a first process of generating verify result data in parallel for a group of memory cell transistors having different target threshold voltage states, the verify result data for each memory cell transistor in the group indicating whether the memory cell transistor has reached its target threshold voltage state, and a second process of calculating for each of the target threshold voltage states, the number of memory cell transistors that have not reached their target threshold voltage states.

A memory device includes an array of memory cells associated with wordlines and control logic. The control logic performs operations that cause a corrective read operation to be performed at a selected memory cell. The operations include: causing a first voltage to be applied to a first wordline associated with the selected memory cell; causing a second voltage, having a lower magnitude than the first voltage, to be applied to wordlines adjacent to the first wordline and associated with each of two neighbor memory cells of the selected memory cell; in response to determining that current flows through the two neighbor memory cells and the selected memory cell between a bitline and a source line of the array, identifying a first corrective read voltage; and causing the first corrective read voltage to be applied to the first wordline during a read operation for the selected memory cell.

A semiconductor memory device includes a plurality of memory cells, a plurality of word lines, including a word line that is connected to a group of the memory cells, and a control circuit configured to execute a write operation on the memory cells of the group. The write operation includes multiple program loops including a first program loop and a second program loop that is executed at a later time than the first program loop, and for each subsequent program loop, a program voltage that is applied to the first word line is increased from that of a current program loop. The program voltage is increased by a first amount from that of the current program loop if the next program loop is the first program loop and by a second amount that is less than the first amount if the next program loop is the second program loop.

Methods and devices for simultaneously verifying or reading multiple states in non-volatile storage are disclosed. Methods and devices for efficiently reducing or eliminating cross-coupling effects in non-volatile storage are disclosed. Methods and devices for efficiently performing reads at a number of voltages to search for the threshold voltage of a memory cell are disclosed. Memory cells on different NAND strings that are read at the same time may be tested for different threshold voltage levels. Memory cells may be tested for different threshold voltages by applying different gate-to-source voltages to memory cells being tested for different threshold voltages. Memory cells may be tested for different threshold voltages by applying different drain to source voltages to the memory cells. Different amounts of compensation for cross-coupling affects may be applied to memory cells on different NAND strings that are read or programmed at the same time.

Memory having an array of memory cells and a plurality of access lines each connected to a respective plurality of memory cells of the array of memory cells might include a controller configured to cause the memory to apply a respective programming pulse having a first target voltage level and a first pulse width to each access line of a first subset of access lines of the plurality of access lines, and apply a respective programming pulse having the first target voltage level and a second pulse width longer than the first pulse width to each access line of a second subset of access lines of the plurality of access lines, wherein each access line of the first subset of access lines is nearer a particular end of the string of series-connected memory cells than each access line of the second subset of access lines.

Devices, systems and methods for improving the performance of a memory device are described. An example method includes obtaining a plurality of cell counts for each of a plurality of read voltages applied to the memory device, generating, based on the plurality of cell counts and the plurality of read voltages, at least one ones count, at least one checksum, and a plurality of samples corresponding to a distribution function of at least one read voltage of the plurality of read voltages, determining an updated value for the at least one read voltage based on an output of a deep neural network whose input comprises the at least one ones count, the at least one checksum, and the plurality of samples, and applying the updated value of the at least one read voltage to the memory device to retrieve information from the memory device.

There are provided a semiconductor memory device and an operating method thereof. A semiconductor memory device may include a memory cell array, a peripheral circuit, a control logic, and one or more programs. The memory cell array may include a plurality of memory cells. The peripheral circuit may perform a program operation on the memory cell array. The control logic may control the peripheral circuit to program the memory cell array. The one or more programs are configured to be executed by the control logic. The programs may include an instruction for pre-programming one or more memory cells to be programmed to one or more target program states to have threshold voltage distributions lower than the target program state.