In a described example, an integrated circuit (IC) includes a repairable memory system. A repair controller is coupled to the repairable memory system. The repair controller includes compression logic configured to encode memory repair code data for a respective instance of the repairable memory system and provide compressed repair data. A non-volatile memory controller is coupled to the repair controller and to non-volatile memory. The non-volatile memory controller is configured to transfer the compressed repair data to the non-volatile memory for storage.

In a described example, an integrated circuit (IC) includes a repairable memory system. A repair controller is coupled to the repairable memory system. The repair controller includes compression logic configured to encode memory repair code data for a respective instance of the repairable memory system and provide compressed repair data. A non-volatile memory controller is coupled to the repair controller and to non-volatile memory. The non-volatile memory controller is configured to transfer the compressed repair data to the non-volatile memory for storage.

A processing device in a memory sub-system stores data at a first voltage level in a memory cell in a first segment of the memory sub-system, and determines a temperature change between a current temperature associated with the memory cell and a new temperature. The processing device further determines a voltage level read from the memory cell at the new temperature, determines a difference between the voltage level read from the memory cell and the first voltage level, and determines a temperature compensation value based on the difference between the voltage level read from the memory cell and the first voltage level in view of the temperature change.

Methods, systems, and devices for performing quick precharge command sequences are described. An operating mode that is associated with a command sequence having a reduced duration relative to another operating mode may be configured at a memory device. The operating mode may be configured based on determining that a procedure does not attempt to preserve or is independent of preserving a logic state of accessed memory cells, among other conditions. While operating in the mode, the memory device may perform a received precharge command using a first set of operations having a first duration—rather than a second set of operations having a second set of operations having a second, longer duration—to perform the received precharge command. The first set of operations may also use less current or introduce less disturbance into the memory device relative to the second set of operations.

Systems and methods of the present disclosure may be used to improve equalization module architectures for NAND cell read information. For example, embodiments of the present disclosure may provide for de-noising of NAND cell read information using a Multiple Shallow Threshold-Expert Machine Learning Models (MTM) equalizer. An MTM equalizer may include multiple shallow machine learning models, where each machine learning model is trained to specifically solve a classification task (e.g., a binary classification task) corresponding to a weak decision range between two possible read information values for a given NAND cell read operation. Accordingly, during inference, each read sample with a read value within a weak decision range is passed through a corresponding shallow machine learning model (e.g., a corresponding threshold expert) that is associated with (e.g., trained for) the particular weak decision range.

A semiconductor memory device includes a memory and a memory controller configured to control the memory. The memory controller includes a normal operation control part and a repair part. The normal operation control part is configured to control a normal operation of the memory and includes a plurality of storage spaces used while the normal operation is controlled. The repair part is configured to control a repair operation of the memory and stores faulty addresses detected while the repair operation is controlled into the plurality of storage spaces included in the normal operation control part.

A semiconductor memory device includes a memory and a memory controller configured to control the memory. The memory controller includes a normal operation control part and a repair part. The normal operation control part is configured to control a normal operation of the memory and includes a plurality of storage spaces used while the normal operation is controlled. The repair part is configured to control a repair operation of the memory and stores faulty addresses detected while the repair operation is controlled into the plurality of storage spaces included in the normal operation control part.

The present disclosure relates to a memory device comprising: an array of memory cells; and an access management architecture providing a secure access to a test mode of the array of memory cells,
the access management architecture comprising: a register group comprising data identifying the memory device; a cryptographic algorithm calculating an internal signature having a mechanism for ensuring data freshness; a non volatile memory area storing specific data to be used by the cryptographic algorithm for calculating the internal signature; a comparison block for comparing the calculated internal signature with a user provided signature to generate an enable signal allowing access to a test mode of the array of memory cells.
The disclosure also relates to a System-on-Chip (SoC) component comprising a memory device as well as to a method for managing access to a memory array into a test mode.

In various examples, a test system is provided for executing built-in-self-test (BIST) on integrated circuits deployed in the field. The integrated circuits may include a first device and a second device, the first device having direct access to external memory, which stores test data, and the second device having indirect access to the external memory by way of the first device. In addition to providing a mechanism to permit the first device and the second device to run test concurrently, the hardware and software may reduce memory requirements and runtime associated with running the test sequences, thereby making real-time BIST possible in deployment. Furthermore, some embodiments permit a single external memory image to cater to different SKU configurations.

Systems of screening memory cells of a memory include modulating bitline and/or wordline voltage. In a read operation, the wordline may be overdriven or underdriven with respect to a nominal operating voltage on the wordline. In a write operation, one or both of the bitline and wordline may be overdriven or underdriven with respect to corresponding a nominal operating voltage. Such a system has margin control circuity, which may be in the form of bitline and wordline margin controls, to modulate bitline and wordline voltages, respectively, in the memory cells of the memory array.