A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit, a fault address register, a scrubbing control circuit and a control logic circuit. The memory cell array includes memory cell rows. The scrubbing control circuit generates scrubbing addresses based on refresh operations performed on the memory cell array. The control logic circuit controls the ECC circuit such that the ECC circuit performs an error detection operation on a plurality of sub-pages in a first memory cell row to count a number of error occurrences, and determines whether to correct a codeword in which an error is detected based on the number of error occurrences. An uncorrected or corrected codeword is written back, and a row address of the first memory cell row may be stored in the fault address register as a row fault address based on the number of error occurrences.

A memory system is provided. The memory system includes a compare circuit and a control circuit. The compare circuit determines, in response to a number of detected error bits in a read data from a first memory array, whether a fail word address associated with the detected error bits is in an error table. The control circuit increments a counter value corresponding to the fail word address when the fail word address is in the error table, and further compares the counter value with a threshold value to replace memory locations, corresponding to the fail word address, in the first memory array with backup memory locations in a second memory array.

A memory system is provided. The memory system includes a compare circuit and a control circuit. The compare circuit determines, in response to a number of detected error bits in a read data from a first memory array, whether a fail word address associated with the detected error bits is in an error table. The control circuit increments a counter value corresponding to the fail word address when the fail word address is in the error table, and further compares the counter value with a threshold value to replace memory locations, corresponding to the fail word address, in the first memory array with backup memory locations in a second memory array.

A memory device can include multiple memory cells and a processing device operatively coupled with the memory device to perform operations including grouping the memory cells into a groups based on a metric reflecting an electrical distance of a memory cell from a voltage source, and determining, for each group, a respective share of write operations, wherein the share of write operations is related to an aggregate value of the metric for memory cells of the group. The operations can also include distributing the write operations to each group according to the share of write operations determined for the group.

A memory device can include multiple memory cells and a processing device operatively coupled with the memory device to perform operations including grouping the memory cells into a groups based on a metric reflecting an electrical distance of a memory cell from a voltage source, and determining, for each group, a respective share of write operations, wherein the share of write operations is related to an aggregate value of the metric for memory cells of the group. The operations can also include distributing the write operations to each group according to the share of write operations determined for the group.

A built-in self test (BIST) may be performed on a device memory having two memory portions that are symmetrical (e.g., two symmetric halves of the device memory). The BIST may be run on the first memory portion. Error logic output from the first memory portion is captured (stored) in the second memory portion during the BIST run process. Error logic output from the first memory portion may include error data and an address of the memory error in the first memory portion. As the first and second memory portions are symmetric, the memory errors captured (stored) in the second memory portion are located at identical locations to the location of the memory errors in the first memory portion. A memory dump from the second memory portion after the BIST may provide a map of the memory errors in the first memory portion.

A semiconductor memory device includes: a plurality of banks having a data storage unit and an error correction code storage unit; an error correction code generation unit; an error correction unit; a low counter that determines a low address as a refresh target; a bank counter that determines a bank address as an error correction target; and a column counter that determines a column address as the error correction target. The error correction unit performs the error correction process on a data of an error correction target address determined based on the low counter, the bank counter, and the column counter when receiving a refresh command.

A semiconductor memory device includes: a plurality of banks having a data storage unit and an error correction code storage unit; an error correction code generation unit; an error correction unit; a low counter that determines a low address as a refresh target; a bank counter that determines a bank address as an error correction target; and a column counter that determines a column address as the error correction target. The error correction unit performs the error correction process on a data of an error correction target address determined based on the low counter, the bank counter, and the column counter when receiving a refresh command.

A semiconductor system includes: a first semiconductor device suitable for outputting a command; and a second semiconductor device suitable for activating a test enable signal based on the command, generating a counting signal representing a toggling number of a row active signal for an activation period of the test enable signal, increasing and outputting an address when the counting signal reaches a target activation number, and deactivating the test enable signal when the counting signal reaches the target activation number and the address has a maximum value.

A semiconductor system includes: a first semiconductor device suitable for outputting a command; and a second semiconductor device suitable for activating a test enable signal based on the command, generating a counting signal representing a toggling number of a row active signal for an activation period of the test enable signal, increasing and outputting an address when the counting signal reaches a target activation number, and deactivating the test enable signal when the counting signal reaches the target activation number and the address has a maximum value.