A circuit includes a dynamic core data register (DCDR) cell that includes a data register, a shift register and an output circuit to route the output state of the data register or the shift register to an output of the DCDR in response to an output control input. A clock gate having a gate control input controls clocking of the shift register in response to a first scan enable signal. An output control gate controls the output control input of the output circuit and controls which outputs from the data register or the shift register are transferred to the output of the output circuit in response to a second scan enable signal. The first scan enable signal and the second scan enable signal to enable a state transition of the shift register at the output of the DCDR.

A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit, a fault address register and a control logic circuit. The memory cell array includes a plurality of memory cell rows. The scrubbing control circuit generates scrubbing addresses for performing a scrubbing operation on a first memory cell row based on refresh row addresses for refreshing the memory cell rows. The control logic circuit controls the ECC circuit such that the ECC circuit performs an error detection and correction operation on a plurality of sub-pages in the first memory cell row to count a number of error occurrences during a first interval and determines a sub operation in a second interval in the scrubbing operation based on the number of error occurrences in the first memory cell row.

A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit, a fault address register and a control logic circuit. The memory cell array includes a plurality of memory cell rows. The scrubbing control circuit generates scrubbing addresses for performing a scrubbing operation on a first memory cell row based on refresh row addresses for refreshing the memory cell rows. The control logic circuit controls the ECC circuit such that the ECC circuit performs an error detection and correction operation on a plurality of sub-pages in the first memory cell row to count a number of error occurrences during a first interval and determines a sub operation in a second interval in the scrubbing operation based on the number of error occurrences in the first memory cell row.

In a method of predicting a remaining lifetime of the nonvolatile memory device, a read sequence is performed. The read sequence includes a plurality of read operations, and at least one of the plurality of read operations is sequentially performed until read data stored in the nonvolatile memory device is successfully retrieved. Sequence class and error correction code (ECC) decoding information are generated. A life stage of the nonvolatile memory device is determined based on at least one of the sequence class and the ECC decoding information. When it is determined that the nonvolatile memory device corresponds to a first life stage, a coarse prediction on the remaining lifetime of the nonvolatile memory device is performed. When it is determined that the nonvolatile memory device corresponds to a second life stage after the first life stage, a fine prediction on the remaining lifetime of the nonvolatile memory device is performed.

The present technology relates to an electronic device. According to the present technology, a memory device having reduced latency includes a plurality of memory cells, an optimum read voltage information storage configured to store optimum read voltage information determined according to a cell count value, which is the number of memory cells read as a first memory cell based on data read from the plurality of memory cells among the plurality of memory cells, and a read voltage controller configured to calculate a cell count value corresponding to a default read voltage based on the data read from the plurality of memory cells using the default read voltage, in response to an optimum read voltage setting command input from a memory controller, and generate a first optimum read voltage based on the cell count value corresponding to the default read voltage and the optimum read voltage information.

The low end operating voltage of an integrated circuit is adjusted. Oscillations are counted at a ring oscillator on the integrated circuit over a designated period of clock cycles. Based on the number of oscillations, a prediction model associated with a first set of device degradation data and a second set of static random-access memory (SRAM) low end operating voltage data is used to select a low end operating voltage limit for a processor on the integrated circuit. The low end operating voltage of the processor is set based on the selected low end operating voltage limit. These steps are repeated multiple times during operation of the processor. A method of testing integrated circuits to provide the data employed to produce the prediction model is also provided.

A device includes serial cyclic redundancy check (CRC) processing circuitry and parallel CRC processing circuitry. The serial CRS processing circuitry, in operation, generates a set of intermediate CRC bits based on a first set of seed bits and input data. The parallel CRC processing circuitry is coupled to the serial CRC processing circuitry, and, in operation, generates, using the set of intermediate CRC bits as a set of parallel seed bits and using null input bits, a set of output CRC bits corresponding to the input data.

A device includes serial cyclic redundancy check (CRC) processing circuitry and parallel CRC processing circuitry. The serial CRS processing circuitry, in operation, generates a set of intermediate CRC bits based on a first set of seed bits and input data. The parallel CRC processing circuitry is coupled to the serial CRC processing circuitry, and, in operation, generates, using the set of intermediate CRC bits as a set of parallel seed bits and using null input bits, a set of output CRC bits corresponding to the input data.

A memory device to determine a voltage optimized to read a group of memory cells. In response to a command, the memory device reads the group of memory cells at a plurality of test voltages to determine a set of signal and noise characteristics of the group of memory cells. The memory device determines or recognizes a shape of a distribution of the signal and noise characteristics over the plurality of test voltages. Based on the shape, the memory device selects an operation in determining an optimized read voltage of the group of memory cells.

A memory system is provided. The memory system includes an error correction code circuit configured to correct a maximum of N error bits in each of multiple read data and a monitor circuit configured to monitor multiple fail word addresses associated with M error bits, and further configured to output a first word address in the fail word addresses to replace first memory locations corresponding to the first word address. Each of the fail word addresses corresponds to one of multiple counter values, and the first word address corresponds to a maximum value of the counter values.