An apparatus includes a controller adapted to be coupled to memory components in parallel and configured to provide memory address signals and a controller clock signal to the memory components, a memory enable logic circuit coupled to the controller and adapted to be coupled to the memory components in parallel and configured to provide test-enable signals to the memory components. The test-enable signals enable, with the controller clock signal, the memory components to read locally stored memory values. The apparatus includes a multiplexer adapted to be coupled to the memory components in parallel and configured to receive from the memory components memory signals that include the memory values in respective sequences of the memory clock signals, and a pipeline coupled to the multiplexer and the controller and configured to receive the memory values from the multiplexer and send the memory values to a multiple input signature register of the controller.

A memory management circuit stores information indicative of reliability-types of regions of a memory array. The memory management circuitry responds to a request to allocate memory in the memory array to a process by determining a request type associated with the request to allocate memory. Memory of the memory array is allocated to the process based on the request type associated with the request to allocate memory and the stored information indicative of reliability-types of regions of the memory array. The memory array may be a shared memory array. The memory array may be organized into rows and columns, and the regions of the memory array may be the rows of the memory array.

A memory management circuit stores information indicative of reliability-types of regions of a memory array. The memory management circuitry responds to a request to allocate memory in the memory array to a process by determining a request type associated with the request to allocate memory. Memory of the memory array is allocated to the process based on the request type associated with the request to allocate memory and the stored information indicative of reliability-types of regions of the memory array. The memory array may be a shared memory array. The memory array may be organized into rows and columns, and the regions of the memory array may be the rows of the memory array.

In an embodiment, a method includes: receiving, with a first buffer of a first error compactor unit (ECU), a first error packet associated with a first circuit; receiving, with the first buffer, a second error packet associated with a second circuit; transmitting a first reading request for reading the first error packet; receiving the first reading request with an arbiter of an error aggregator unit (EAU) of a central error management circuit; in response to receiving the first reading request, reading the first error packet from the first buffer, transmitting the first error packet to a controller of the central error management circuit, and transmitting a first acknowledgement to the first ECU; receiving the first acknowledgement with the first ECU; and in response to receiving the first acknowledgement, transmitting a second reading request for reading the second error packet.

A method for detecting a writing error of a datum in memory includes: storing at least two parts of equal size of a binary word representative of said datum at the same address in at least two identical memory circuits, and comparing internal control signals of the two memory circuits to determine existence of the writing error.

A memory transparent in-system built-in self-test may include performing in-system testing on subsets of memory cells over one or more test intervals of one or more test sessions. A test interval may include copying contents of a subset of memory cells to a register(s), writing test data (e.g., a segment of a pattern) to the subset of memory cells, reading back contents of the subset of memory cells, and restoring the content from the register(s) to the subset of memory cells. In-system testing may be performed on overlapping sets of memory cells. In-system testing may be performed on successive subsets of memory cells within a row (i.e., fast column addressing) and/or within a column (fast column addressing). In-system testing may be performed on sets of m blocks of memory cells during respective test intervals. The number of m blocks tested per interval may be configurable/selectable.

Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory device are configured to add variable delays to a command. The variable delays may be provided by a host device (e.g., a test equipment) using a test mode of the memory devices. Alternatively, the variable delays may be stored in nonvolatile memory (NVM) components of the memory devices. Further, mode registers of the memory devices may be set to indicate that the command is associated with the variable delays stored in the NVM components. Further, the memory devices may include delay components configured to add the variable delays to the command. Such variable delays facilitate staggered execution of the command across multiple memory devices so as to avoid (or mitigate) issues related to an instantaneous, large amount of current drawn from a power supply connected to the memory devices.

A measure associated with a characteristic of a die of a memory device is obtained. It is determined whether the measure satisfies a first criterion to group one or more die into a first die family. If it is determined that the measure satisfies the first criterion, the die is associated with the first die family.

A semiconductor storage device includes a bridge chip and memory chips connected to the bridge chip by a plurality of channels. The bridge chip includes a first delay circuit for setting the start of a first timing signal for a first memory chip output via a first channel and a second delay circuit for setting the start of for second timing signal for a second memory chip output via a second channel. A controller on the bridge chip controls at least one of the first and second delay circuits to adjust the start time of at least one of the first and second timing signals such that data sequences from the first and second memory chips will be aligned in time. The controller combines the data sequence from the first memory chip with the data sequence from the second memory chip to generate an interleaved serial sequence.

Methods, systems, and devices for masked training and analysis with a memory array are described. A memory device may operate in a first mode in which a maximum transition avoidance (MTA) decoder for a memory array of the memory device is disabled. During the first mode, the memory device may couple an input node of the MTA decoder with a first output node of a first decoder, such as a first pulse amplitude modulation (PAM) decoder. The memory device may operate in a second mode in which the MTA decoder for the memory array is enabled. During the second mode, the memory device may couple the input node of the MTA decoder with a second output node of a second decoder, such as a second PAM decoder.