G11C29/42

AGGRESSIVE WRITE FLUSH SCHEME FOR A VICTIM CACHE
20230004500 · 2023-01-05 ·

A caching system including a first sub-cache and a second sub-cache in parallel with the first sub-cache, wherein the second sub-cache includes: line type bits configured to store an indication that a corresponding cache line of the second sub-cache is configured to store write-miss data, and an eviction controller configured to evict a cache line of the second sub-cache storing write-miss data based on an indication that the cache line has been fully written.

AGGRESSIVE WRITE FLUSH SCHEME FOR A VICTIM CACHE
20230004500 · 2023-01-05 ·

A caching system including a first sub-cache and a second sub-cache in parallel with the first sub-cache, wherein the second sub-cache includes: line type bits configured to store an indication that a corresponding cache line of the second sub-cache is configured to store write-miss data, and an eviction controller configured to evict a cache line of the second sub-cache storing write-miss data based on an indication that the cache line has been fully written.

ECC BUFFER REDUCTION IN A MEMORY DEVICE
20230238074 · 2023-07-27 ·

A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory cells. The memory controller includes an error correction code (ECC) circuit. The ECC circuit is configured to determine data rows of first write data that are not all zeros and store the determined data rows in buffer rows of a buffer along with corresponding row indexes. The memory controller is configured to write second data based on the buffer to the memory device.

ECC BUFFER REDUCTION IN A MEMORY DEVICE
20230238074 · 2023-07-27 ·

A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory cells. The memory controller includes an error correction code (ECC) circuit. The ECC circuit is configured to determine data rows of first write data that are not all zeros and store the determined data rows in buffer rows of a buffer along with corresponding row indexes. The memory controller is configured to write second data based on the buffer to the memory device.

Detection of an Incorrectly Located Read Voltage

A memory device to program a group of memory cells to store multiple bits per memory cell. Each bit per memory cell in the group from a page. After determining a plurality of read voltages of the group of memory cells, the memory device can read the multiple pages of the group using the plurality of read voltages. For each respective page in the multiple pages, the memory device can determine a count of first memory cells in the respective page that have threshold voltages higher than a highest read voltage, among the plurality of read voltages, used to read the respective page. The count of the first memory cells can be compared with a predetermined range of a fraction of memory cells in the respective page to evaluate the plurality of read voltages (e.g., whether any of the read voltages is in a wrong voltage range).

DATA PROTECTION FOR THREE-DIMENSIONAL NAND MEMORY

The present disclosure provides a method of data protection for a three-dimensional NAND memory. The method includes programming a memory cell of the 3D NAND memory according to programming data; and backing up a portion of the programming data associated with the memory cell in response to a program loop count (PLC) that is larger than a threshold value, where the PLC tracks a repeated number of the programming of the memory cell. A previous PLC can be set as the threshold value, where the previous PLC was used by a previous programming operation and was collected after the memory cell was programmed successfully to a previous target logic state.

SINGLE "A" LATCH WITH AN ARRAY OF "B" LATCHES

An integrated circuit (IC) includes first and scan latches that are enabled to load data during a first part of a clock period. A clocking circuit outputs latch clocks with one latch clock driven to an active state during a second part of the clock period dependent on a first address input. A set of storage elements have inputs coupled to the output of the first scan latch and are respectively coupled to a latch clock to load data during a time that their respective latch clock is in an active state. A selector circuit is coupled to outputs of the first set of storage elements and outputs a value from one output based on a second address input. The second scan latch then loads data from the selector's output during the first part of the input clock period.

SINGLE "A" LATCH WITH AN ARRAY OF "B" LATCHES

An integrated circuit (IC) includes first and scan latches that are enabled to load data during a first part of a clock period. A clocking circuit outputs latch clocks with one latch clock driven to an active state during a second part of the clock period dependent on a first address input. A set of storage elements have inputs coupled to the output of the first scan latch and are respectively coupled to a latch clock to load data during a time that their respective latch clock is in an active state. A selector circuit is coupled to outputs of the first set of storage elements and outputs a value from one output based on a second address input. The second scan latch then loads data from the selector's output during the first part of the input clock period.

Semiconductor memory device having control unit which sets the refresh interval of the memory cell
11715510 · 2023-08-01 · ·

A semiconductor memory device capable of suppressing an increase in power consumption and avoiding data destruction due to the row hammer problem is provided. The semiconductor memory device includes a refresh control unit (first control unit) that sets a memory cell refresh interval based on information about a memory cell refresh interval included in a predetermined command input from the outside.

Semiconductor memory device having control unit which sets the refresh interval of the memory cell
11715510 · 2023-08-01 · ·

A semiconductor memory device capable of suppressing an increase in power consumption and avoiding data destruction due to the row hammer problem is provided. The semiconductor memory device includes a refresh control unit (first control unit) that sets a memory cell refresh interval based on information about a memory cell refresh interval included in a predetermined command input from the outside.