The present disclosure relates to a method for improving the safety of the reading phase of a non-volatile memory device including at least an array of memory cells and with associated decoding and sensing circuitry and a memory controller, the method comprising: storing in a dummy row of said memory block at least a known pattern; performing some reading cycles changing the read trimming parameters up to the moment wherein said known value is read correctly; adopting the trimming parameters of the correct reading for the subsequent reading phases. The disclosure further relates to a memory device structured for implementing the above method.

The present disclosure relates to a method for improving the safety of the reading phase of a non-volatile memory device including at least an array of memory cells and with associated decoding and sensing circuitry and a memory controller, the method comprising: storing in a dummy row of said memory block at least a known pattern; performing some reading cycles changing the read trimming parameters up to the moment wherein said known value is read correctly; adopting the trimming parameters of the correct reading for the subsequent reading phases. The disclosure further relates to a memory device structured for implementing the above method.

A system includes a memory array of sub-blocks, each sub-block including groups of memory cells, and a processing device. The processing device causes a first wordline to be programmed through the sub-blocks with a mask by causing to be programmed, to a first voltage level: a first group of memory cells of a first sub-block; and a second group of memory cells of a second sub-block. The processing device further scans a second wordline that has been programmed and is coupled to the first wordline, scanning includes: causing a custom wordline voltage to be applied to the second wordline, the custom wordline voltage to select groups of memory cells corresponding to those of the first wordline programmed to the first voltage level; concurrently reading data from the selected groups of memory cells of the second wordline; and performing, using the data, an error check of the second wordline.

A system includes a memory array of sub-blocks, each sub-block including groups of memory cells, and a processing device. The processing device causes a first wordline to be programmed through the sub-blocks with a mask by causing to be programmed, to a first voltage level: a first group of memory cells of a first sub-block; and a second group of memory cells of a second sub-block. The processing device further scans a second wordline that has been programmed and is coupled to the first wordline, scanning includes: causing a custom wordline voltage to be applied to the second wordline, the custom wordline voltage to select groups of memory cells corresponding to those of the first wordline programmed to the first voltage level; concurrently reading data from the selected groups of memory cells of the second wordline; and performing, using the data, an error check of the second wordline.

A method of screening weak bits in a memory array includes dividing the memory array into a first and a second memory array, storing a first set of data in the first memory array, performing a first baking process on the first memory array or applying a first magnetic field to the first memory array, determining that a first portion of the first set of data stored in the first memory array is altered by the first baking process or the first magnetic field, and at least one of replacing memory cells of a first set of memory cells that are storing the first portion of the first set of data with corresponding memory cells in the second memory array of the memory array, or not using the memory cells of the first set of memory cells storing the first portion of the first set of data.

A method of screening weak bits in a memory array includes dividing the memory array into a first and a second memory array, storing a first set of data in the first memory array, performing a first baking process on the first memory array or applying a first magnetic field to the first memory array, determining that a first portion of the first set of data stored in the first memory array is altered by the first baking process or the first magnetic field, and at least one of replacing memory cells of a first set of memory cells that are storing the first portion of the first set of data with corresponding memory cells in the second memory array of the memory array, or not using the memory cells of the first set of memory cells storing the first portion of the first set of data.

A semiconductor chip with error detection and correction includes multiple pipes and each pipe is coupled to one or more ports on the semiconductor chip. The semiconductor chip further includes a state machine coupled to the pipes to generate a number of events consisting of read- and/or scan-type events associated with a plurality of storage elements. The state machine is implemented in hardware and can centrally detect and correct erroneous memory entries across the plurality of storage elements.

A semiconductor chip with error detection and correction includes multiple pipes and each pipe is coupled to one or more ports on the semiconductor chip. The semiconductor chip further includes a state machine coupled to the pipes to generate a number of events consisting of read- and/or scan-type events associated with a plurality of storage elements. The state machine is implemented in hardware and can centrally detect and correct erroneous memory entries across the plurality of storage elements.

According to one embodiment, a memory system includes a semiconductor memory and a controller. The memory system is capable of executing a first operation and a second operation. In the first operation, the controller issues a first command sequence, the semiconductor memory applies a first voltage to a first word line and applies a second voltage to a second word line to read data from the first memory, and the read data is transmitted to the controller from the semiconductor memory. In the second operation, the controller issues a second command sequence, the semiconductor memory applies a third voltage to the first word line and applies a fourth voltage to the second word line, and data held in the memory cell array is left untransmitted to the controller.

A method of correcting a memory error of a dynamic random-access memory module (DRAM) using a double data rate (DDR) interface, the method includes conducting a memory transaction including multiple bursts with a memory controller to send data from data chips of the DRAM to the memory controller, detecting one or more errors using an ECC chip of the DRAM, determining a number of the bursts having the errors using the ECC chip of the DRAM, determining whether the number of the bursts having the errors is greater than a threshold number, determining a type of the errors, and directing the memory controller based on the determined type of the errors, wherein the DRAM includes a single ECC chip per memory channel.