A DRAM device with embedded flash memory for redundancy is disclosed. The DRAM device includes a substrate having a DRAM array area and a peripheral area. The peripheral area includes an embedded flash forming region and a first transistor forming region. DRAM cells are disposed within the DRAM array area. Flash memory is disposed in the embedded flash forming region. The flash memory includes an ONO storage structure and a flash memory gate structure. A first transistor is disposed in the first transistor forming region.

Providing efficient handling of memory array failures in processor-based systems is disclosed. In this regard, in one aspect, a memory controller of a processor-based device is configured to detect a defect within a memory element of a plurality of memory elements of a memory array. In response, a disable register of one or more disable registers is set to correspond to the memory element to indicate that the memory element is disabled. The memory controller receives a memory access request to a memory address corresponding to the memory element, and determines, based on one or more disable registers, whether the memory element is disabled. If so, the memory controller disallows the memory access request. Some aspects may provide that the memory controller, in response to detecting the defect, provides a failure indication to an executing process, and subsequently receives, from the executing process, a request to set the disable register.

A memory device includes at least one memory bank comprising a set of redundant word lines, a set of normal word lines, and row hammer refresh logic. The RHR logic comprises a first input to receive a first signal indicative of whether a match was generated at a fuse of the memory device, a second input to receive a redundant row address corresponding to a first location of a memory array of the memory device, a third input to receive a word line address corresponding to a second location of the memory array of the memory device. The RHR logic also comprises an output to transmit at least one first memory address adjacent to the first location or at least one second memory address adjacent to the second location based on a value of the first signal.

A memory system includes dynamic random-access memory (DRAM) component that include interconnected and redundant component data interfaces. The redundant interfaces facilitate memory interconnect topologies that accommodate considerably more DRAM components per memory channel than do traditional memory systems, and thus offer considerably more memory capacity per channel, without concomitant reductions in signaling speeds. Each DRAM component includes multiplexers that allow either of the data interfaces to write data to or read data from a common set of memory banks, and to selectively relay write and read data to and from other components, bypassing the local banks. Delay elements can impose selected read/write delays to align read and write transactions from and to disparate DRAM components.

A logic die for performing a through silicon via (TSV) repair operation and a semiconductor device including the logic die are provided. The semiconductor device includes the logic die including a memory controller and an interface circuit, a plurality of core dies stacked in a vertical direction on the logic die, each of the plurality of core dies including a memory cell array, and a plurality of through silicon vias (TSVs) configured to electrically connect the logic die to the plurality of core dies, the plurality of TSVs including a plurality of operation TSVs and at least one redundancy TSV. The interface circuit includes a plurality of TSV circuit blocks electrically connected to the plurality of TSVs, respectively, and a TSV repair logic configured to perform a repair operation on a first TSV, in which a defect occurs and a first TSV circuit block, electrically connected to the first TSV.