A method and apparatus for testing a fuse between two plastic pipes without destroying the fuse is performed in the field. The method and apparatus include a source of X-ray radiation and a scanning plate that has pixels that change state when exposed to this radiation. The source of the X-ray radiation is positioned on one side of the fuse and the scanning plate is positioned on another side so that the x-ray radiation passes through the fuse. The x-ray image from the scanning plate makes visible internal voids, weak fuses, and evidence of movement after the plastic of the fitting/pipes melted and flowed together. With such, the quality of the fitting is evident without cutting or otherwise destroying the fitting and, therefore, only weak or otherwise compromised fittings need be cut and redone.

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

The present disclosure proposes an inspection apparatus. The inspection apparatus may include: a structured-light source configured to sequentially radiate a plurality of structured lights having one phase range; a lens configured to adjust, for each of the plurality of structured lights, optical paths of light beams corresponding to phases of the phase range such that a light beam corresponding to one phase of the phase range arrives at each point of a partial region on an object; an image sensor configured to capture a plurality of reflected lights generated by the structured lights being reflected from the partial region; and a processor configured to acquire a light quantity value of the reflected lights; and derive an angle of the surface by deriving phase values of the reflected lights based on the light quantity value for the reflected lights.

Embodiments of the invention include a dye and pry process for removing a surface mount technology (SMT) dual in-line memory module (DIMM) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the SMT DIMM. The package assembly is dried, and a dummy card stock is installed in the SMT DIMM using an epoxy. The SMT DIMM is then removed by applying a force to an exposed cavity between the dummy card stock and the semiconductor package assembly. The semiconductor package assembly and the SMT DIMM can then be inspected for the dye to locate cracks.

Disclosed are an inspection system and an inspection method of performing image processing on an outline of an inspection object according to whether the inspection object is good or defective, and overlapping and displaying the image-processed outline with reference information for determining whether the inspection object is good or defective. The inspection system includes: a data acquisition unit configured acquire an image of an inspection object by irradiate light on the inspection object; a processing unit configured to detect an outline of the inspection object based on the image data of the inspection object; and an output unit configured to overlap and display the outline with reference information, wherein the processing unit is configured to determine whether the outline is good or defective based on the reference information to perform image processing on the outline according to whether the outline is good or defective.

An appearance inspection device that can easily determine optimum values of various imaging parameters is provided. An appearance inspection device includes: a moving means which changes relative positions of at least two or more portions within a work-piece, an imaging part, and an illumination part; an imaging processing part which performs, in a state that the illumination part irradiates a light to the work-piece, a processing for changing imaging parameters and taking a plurality of images by the imaging part under a condition that plural types of imaging parameters with mutually different properties are variably set, the plural types of imaging parameters including a change of the relative position between the work-piece and the imaging part caused by the moving means; and a parameter determining part determining a set of optimum values of the plural types of imaging parameters that are set variably based on the plurality of taken images.

A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.

A smart decision feedback method for inspecting a circuit board includes obtaining a number of abnormal solder paste points of a circuit board identified by a solder paste inspection device, determining whether the number of abnormal solder paste points is greater than or equal to a first predetermined value, determining whether an identification result of the solder paste inspection device is abnormal when the number of abnormal solder paste points is less than the first predetermined value, obtaining an inspection result performed by a testing device inspecting the circuit board when the identification result of the solder paste inspection device is abnormal, analyzing an adjustment parameter of the solder paste inspection device, and sending the adjustment parameter to the solder paste inspection device. A first prompt is displayed when the number of abnormal solder paste points is greater than or equal to the first predetermined value.

A solder printing inspection device that inspects a printing state of solder paste printed on a substrate having a through hole into which a lead terminal of an insertion component is inserted, the solder printing inspection device including: a non-printing face side illuminator that irradiates an inspection range on a non-printing face side with a predetermined light, wherein the non-printing face side is opposite to a printing face side, out of a surface and a rear face of the substrate; a non-printing face side camera that takes an image of the inspection range on the non-printing face side of the substrate irradiated with the predetermined light; and a controller that executes inspection with regard to the solder paste in the inspection range, based on image data with regard to the inspection range on the non-printing face side of the substrate taken by the non-printing face side camera.

A printed circuit board inspection apparatus generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.