Disclosed are an inspection system and an inspection method of performing image processing on an outline of an inspection object according to whether the inspection object is good or defective, and overlapping and displaying the image-processed outline with reference information for determining whether the inspection object is good or defective. The inspection system includes: a data acquisition unit configured acquire an image of an inspection object by irradiate light on the inspection object; a processing unit configured to detect an outline of the inspection object based on the image data of the inspection object; and an output unit configured to overlap and display the outline with reference information, wherein the processing unit is configured to determine whether the outline is good or defective based on the reference information to perform image processing on the outline according to whether the outline is good or defective.

A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

A three-dimensional measurement device includes: a projector that includes: a light source that emits predetermined light; and a reflective optical modulator that converts the predetermined light into a predetermined striped pattern, wherein the projector projects the predetermined striped pattern onto a measurement object at a predetermined number of frames per unit time; an imaging device that takes an image of the measurement object projected with the predetermined striped pattern; a processor that: controls the projector and the imaging device to sequentially project a plurality of different ones of the predetermined striped pattern and take images of the plurality of different ones of the predetermined striped pattern to obtain a plurality of image data having different light intensity distributions; and executes three-dimensional measurement of the measurement object based on the plurality of image data.

An illumination device configured to illuminate an imaging target, an image of which is to be captured by a camera, provided with a current adjusting device configured to adjust a current flowing through the LEDs of four LED-mounted boards on which many of the LEDs are mounted, wherein the four LED-mounted boards are arranged in a four-sided shape centered around the light axis of the camera as viewed from the imaging target, and each of the LED-mounted boards is inclined at a specified angle so that the LEDs of the LED-mounted boards face the imaging target. The current adjusting device is configured to divide an LED-mounted area of each of the LED-mounted boards into multiple illumination areas and to individually adjust the current flowing to the LEDs of each of the LED-mounted boards for each of the multiple illumination areas.

An inspection device includes an image acquisition unit configured to acquire images obtained by imaging, under at least two illumination conditions with different brightness, solder normally printed on a substrate, and an image processing unit configured to specify a shape of the solder based on a difference in brightness between the images acquired by the image acquisition unit, and generate, based on the shape of the solder, inspection data used for inspecting a state of the solder printed on the substrate.

Disclosed are an inspection system and an inspection method of performing image processing on an outline of an inspection object according to whether the inspection object is good or defective, and overlapping and displaying the image-processed outline with reference information for determining whether the inspection object is good or defective. The inspection system includes: a data acquisition unit configured acquire an image of an inspection object by irradiate light on the inspection object; a processing unit configured to detect an outline of the inspection object based on the image data of the inspection object; and an output unit configured to overlap and display the outline with reference information, wherein the processing unit is configured to determine whether the outline is good or defective based on the reference information to perform image processing on the outline according to whether the outline is good or defective.

Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.

An appearance inspection device that can easily determine optimum values of various imaging parameters is provided. An appearance inspection device includes: a moving means which changes relative positions of at least two or more portions within a work-piece, an imaging part, and an illumination part; an imaging processing part which performs, in a state that the illumination part irradiates a light to the work-piece, a processing for changing imaging parameters and taking a plurality of images by the imaging part under a condition that plural types of imaging parameters with mutually different properties are variably set, the plural types of imaging parameters including a change of the relative position between the work-piece and the imaging part caused by the moving means; and a parameter determining part determining a set of optimum values of the plural types of imaging parameters that are set variably based on the plurality of taken images.

Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.

An apparatus, a recording medium, and a method for generating a control parameter of a screen printer are disclosed. The apparatus includes a memory that stores a simulation model configured to derive predictive inspection information on a printed state of solder paste based on a plurality of control parameters of the screen printer; a communication circuit configured to receive first inspection information on a plurality of solder pastes printed by the screen printer based on a first control parameter, and a processor electrically connected to the memory and the communication circuit. The processor obtains first predictive inspection information by applying the first control parameter to the simulation model, generates a plurality of candidate control parameters based on the first predictive inspection information, determines a plurality of second control parameters among the candidate control parameters, and transmits the plurality of second control parameters to the screen printer via the communication circuit.