In order to reduce inspection tact time in centralized management of a plurality of inspection lines, the system includes: a plurality of inspection lines 4 each having a visual appearance inspection device 3; a first database 5A for storing a captured image captured by each of the visual appearance inspection device 3; and a centralized control device 6 connected to each of the visual appearance inspection devices 3 and the first database 5A, having a display unit 32 that displays an inspection image of an inspection object 7, and enabling visual inspection of the inspection object 7 conveyed on each of the inspection lines 4 in a centralized manner; wherein, while one of the inspection lines 4 is inspected by using the centralized control device 6, the visual appearance inspection devices 3 of the other inspection lines 4 pre-captures the inspection object 7 conveyed on the inspection line 4 under predetermined capturing conditions and stores the pre-captured image in the first database 5A, and wherein the pre-captured image read from the first database 5A is displayed on the display unit 32 in the visual inspection.

Disclosed are an inspection system and an inspection method of performing image processing on an outline of an inspection object according to whether the inspection object is good or defective, and overlapping and displaying the image-processed outline with reference information for determining whether the inspection object is good or defective. The inspection system includes: a data acquisition unit configured acquire an image of an inspection object by irradiate light on the inspection object; a processing unit configured to detect an outline of the inspection object based on the image data of the inspection object; and an output unit configured to overlap and display the outline with reference information, wherein the processing unit is configured to determine whether the outline is good or defective based on the reference information to perform image processing on the outline according to whether the outline is good or defective.

A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires an image of the patterned illumination from a second point of view. A controller is coupled to the source, and to the at least one camera. The controller generates a height topology of the circuit board based on images acquired from first and second image detectors of the patterned illumination. The characteristics of the pattern illumination are modified based on knowledge of the circuit board to enhance the dynamic range of the sensor and to reject image defects caused by multipath reflections.

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

A printing solder point quality identification and maintenance suggestion system and a method thereof are disclosed. In the system, when solder paste inspection data, component inspection data or circuit inspection data indicates presence of defect, an analysis and calculation device intercepts the operating data, the equipment data, the raw material data, the process data and the environment data from a time data stream, to generate a data feature portrait. The analysis and calculation device then sets a reliability value based on location association between the solder paste inspection data, the component inspection data, the circuit inspection data and the maintenance data in the location data stream, and performs similarity calculation on the data feature portrait and the comparison data feature portrait to calculate a similarity value, and then calculates a relative reliability value, and compares the relative reliability value with a reliability threshold value to generate maintenance suggestion information.

Inspection of microelectronic devices is described using near infrared light. In one example, a dielectric material layer on a substrate is illuminated with a near infrared light beam. The substrate has at least one contact land, the dielectric material layer overlies at least a portion of the contact land, and the substrate has at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land. Reflected near infrared light is reflected from the substrate at a camera. The position of the via is determined relative to the contact land from the reflected light beam using an image processing device.

A three-dimensional shape measurement apparatus includes a plurality of main pattern illumination parts, a plurality of main image-capturing parts and a control part. The main pattern illumination parts obliquely emit grating pattern lights toward a measurement target in different directions. The main image-capturing parts image-capture grating pattern lights that are emitted from the main pattern illumination parts and obliquely reflected by the measurement target. The control part produces a three-dimensional shape of the measurement target using grating pattern images captured from the main image-capturing parts. Thus, accuracy and precision of measurement may be improved.

A three-dimensional measurement device includes a light source and grid that irradiate a measurement object; a luminance controller that changes luminance levels of the light; a phase controller that changes phase levels of the light pattern; a camera that takes an image of the measurement object; and a processor that three-dimensionally measures a first measurement object area based on different image data taken by radiating a first light pattern in different phases; determines a relationship between a gain and offset determined according to an imaging condition based on the different image data; and three-dimensionally measures a second measurement object area based on two different image data taken by radiating a second light pattern in two different phases by using a gain and offset regarding each pixel determined according to a luminance value of each pixel in the two different image data and the determined relationship.

In order to reduce inspection tact time in centralized management of a plurality of inspection lines, the system includes: a plurality of inspection lines 4 each having a visual appearance inspection device 3; a first database 5A for storing a captured image captured by each of the visual appearance inspection device 3; and a centralized control device 6 connected to each of the visual appearance inspection devices 3 and the first database 5A, having a display unit 32 that displays an inspection image of an inspection object 7, and enabling visual inspection of the inspection object 7 conveyed on each of the inspection lines 4 in a centralized manner; wherein, while one of the inspection lines 4 is inspected by using the centralized control device 6, the visual appearance inspection devices 3 of the other inspection lines 4 pre-captures the inspection object 7 conveyed on the inspection line 4 under predetermined capturing conditions and stores the pre-captured image in the first database 5A, and wherein the pre-captured image read from the first database 5A is displayed on the display unit 32 in the visual inspection.

A visual inspection apparatus and a visual inspection method enabling the quality of a state of solder to be properly judged. Specifically, in the visual inspection apparatus and visual inspection method, a slope (concave slope region) present on a surface of solder is searched and the quality of a state of the solder is judged based on that result. The quality of the state of the solder can be properly judged based on not a height of the solder, but the slope of the surface of the solder.